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Reliability investigations of flip-chip solder bumps on palladium

 

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IEEE Components, Packaging, and Manufacturing Technology Society:
49th Electronic Components & Technology Conference 1999. Proceedings
Piscataway, NJ: IEEE Order Department, 1999
ISBN: 0-7803-5231-9
ISBN: 0-7803-5232-7
ISBN: 0-7803-5233-5
ISBN: 0-7803-5234-3
pp.135-140
Electronic Components and Technology Conference (ECTC) <49, 1999, San Diego/Calif..>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-63004.html