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  4. Fabrication of high frequency microscanners by using low temperature silicon wafer bonding
 
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1999
Conference Paper
Title

Fabrication of high frequency microscanners by using low temperature silicon wafer bonding

Author(s)
Hiller, K.
Wiemer, M.
Hahn, R.
Kaufmann, C.
Kurth, S.
Kehr, K.
Gessner, T.
Dötzel, W.
Milekhin, A.
Friedrich, M.
Zahn, D.
Mainwork
Transducers '99, 10th International Conference on Solid-State Sensors and Actuators. Digest of technical papers  
Conference
International Conference on Solid-State Sensors and Actuators 1999  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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