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Reliability of electroless nickel for high temperature applications

 

Wong, C.P. ; International Microelectronics and Packaging Society -IMAPS-; IEEE Components, Packaging, and Manufacturing Technology Society:
International Symposium on Advanced Packaging Materials 1999: Processes, Properties and Interfaces. Proceedings
Reston, Va.: IMAPS, 1999
ISBN: 0-930815-56-4
ISBN: 0-7803-5508-3
pp.256-261
International Symposium on Advanced Packaging Materials <5, 1999, Braselton/Ga.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-62986.html