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Reliability of electroless nickel for high temperature applications
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1999
Conference Paper
Titel
Reliability of electroless nickel for high temperature applications
Author(s)
Anhöck, S.
Ostmann, A.
Oppermann, H.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
International Symposium on Advanced Packaging Materials 1999: Processes, Properties and Interfaces. Proceedings
Konferenz
International Symposium on Advanced Packaging Materials 1999
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM