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3D simulation of the conformality of copper layers deposited by low-pressure chemical vapor deposition from cul(tmvs)(hfac)

 
: Bär, E.; Lorenz, J.; Ryssel, H.

Vantomme, A.:
Materials for advanced metallization. Proceedings of the Third European Workshop on Materials for Advanced Metallization
Amsterdam: Elsevier, 2000 (Microelectronic engineering 50.1999, 1/4)
European Workshop on Materials for Advanced Metallization (MAM) <3, 1999, Ostende>
English
Conference Paper
Fraunhofer IIS B ( IISB) ()

: http://publica.fraunhofer.de/documents/B-62479.html