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  4. Application and cost analysis of scatterometry for integrated metrology
 
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1999
Conference Paper
Title

Application and cost analysis of scatterometry for integrated metrology

Abstract
In semiconductor manufacturing there is a great demand for innovations towards higher cost-effectiveness. The increasing use of integrated metrology is one means to improve manufacturing processes effectively and, hence, to lower costs. Especially for the 300 mm technology, a substantial reduction of costly monitor wafers is required. Moreover, misprocessing has to be reduced by efficient feedback process control. Scatterometry can be a versatile technique for these tasks. In order to define the requirements on integrated scatterometric metrology, a cost and break-even analysis is carried out first. Several conclusions are drawn from the economic analysis to determine appropriate arrangements for scatterometric intensity measurements. The evaluation of intensity signatures measured at a fixed angle of incidence is demonstrated to be a valuable tool for the in-line characterization of critical dimensions and layer thickness.
Author(s)
Benesch, N.
Schneider, C.
Pfitzner, L.
Ryssel, H.
Mainwork
In-line characterization, yield reliability, and failure analyses in microelectronic manufacturing  
Conference
Conference on In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing 1999  
Language
English
IIS-B  
Keyword(s)
  • cost-benefit analysis

  • integrated circuit manufacture

  • integrated circuit measurement

  • integrated circuit testing

  • light scattering

  • spatial variables measurement

  • thickness measurement

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