English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
Fine pitch ultrasonic wedge-bonding with ultra thin wire and optimized tools
Details
Full
Export
Statistics
Options
1999
Journal Article
Titel
Fine pitch ultrasonic wedge-bonding with ultra thin wire and optimized tools
Author(s)
Trapp, T.U.
Harder, T.
Monser, H.-P.
Bierwirth, R.
Zeitschrift
VTE
Language
English
google-scholar
View Details
Fraunhofer-Institut für Siliziumtechnologie ISIT