Laser bonding of micro optical components

A novel method for bonding micro optical components using a new joining process of silicon with glass is described. The process is based on selective heating with laser radiation forming a chemical bond at the interface of both joining partners. In order to characterize the locally selective bonding with laser (SBL) process, variations of laser parameters have been correlated with temperature measurements during bonding and the achieved bonding results. It was found that the temperature load outside the laser irradiated zone only lasted for seconds and remained below 300 degrees C, so minimizing the heat load of the entire component. The result of the investigations was a parameter field producing reproducible and strong silicon glass bonds. Basic knowledge for the thermal process of bonding and an understanding of the recognized bond defects was developed. Finally advantages and disadvantages of SBL with silicon and glass are discussed with respect to micro assembly of optical parts for telecommunication components.