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Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches

 
: Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.

Sancaktar, E. ; American Society of Mechanical Engineers -ASME-, Design Engineering Division:
Threaded and riveted connections, design issues, reliability, design issues, reliability stress analysis, and failure prevention : Presented at the 2001 ASME International Mechanical Engineering Congress and Exposition, November 11 - 16, 2001, New York, New York
New York, NY: ASME, 2001 (DE 114)
ISBN: 0-7918-3571-5
pp.89-94
International Mechanical Engineering Congress and Exposition (IMECE) <2001, New York/NY>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-301517.html