2002
Conference Paper
Title

InterChip via technology by using copper for vertical system integration

Author(s)
Ramm, P.
Bonfert, D.
Ecke, R.
Iberl, F.
Klumpp, A.
Riedel, S.
Schulz, S.E.
Wieland, R.
Zacher, M.
Gessner, T.
Mainwork
Conference
Language
English