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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. InterChip via technology by using copper for vertical system integration
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Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T. | McKerrow, A.J. ; Univ. of California, Continuing Education in Engineering:
Advanced Metallization Conference, AMC 2001 : Proceedings of the conference held October 8 - 11, 2001, in Montreal, Canada. A parallel session was held October 29 - 31, 2001 in Tokyo, Japan
Warrendale, Pa.: Materials Research Society, 2002
ISBN: 1-558-99670-2
pp.159-168 |
| Advanced Metallization Conference (AMC) <2001, Montreal> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |