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A thermode bonding process for fine pitch flip chip applications down to 40 micron

 
: Pahl, B.; Nieland, S.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.

:

Lee, S.B. ; Institute of Electrical and Electronics Engineers -IEEE-:
Advances in electronic materials and packaging 2001 : Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001, November 19 - 22, 2001, Jeju Island, Korea
Piscataway, NJ: IEEE, 2001
ISBN: 0-7803-7157-7
pp.163-169
International Symposium on Electronic Materials and Packaging (EMAP) <3, 2001, Jeju Island>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-301153.html