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A thermode bonding process for fine pitch flip chip applications down to 40 micron
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2001
Conference Paper
Titel
A thermode bonding process for fine pitch flip chip applications down to 40 micron
Author(s)
Pahl, B.
Nieland, S.
Kallmayer, C.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
Advances in electronic materials and packaging 2001
Konferenz
International Symposium on Electronic Materials and Packaging (EMAP) 2001
DOI
10.1109/EMAP.2001.983977
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM