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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. A thermode bonding process for fine pitch flip chip applications down to 40 micron
| Lee, S.B. ; Institute of Electrical and Electronics Engineers -IEEE-:
Advances in electronic materials and packaging 2001 : Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001, November 19 - 22, 2001, Jeju Island, Korea
Piscataway, NJ: IEEE, 2001
ISBN: 0-7803-7157-7
pp.163-169 |
| International Symposium on Electronic Materials and Packaging (EMAP) <3, 2001, Jeju Island> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |