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Application of flip-chip bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
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2001
Conference Paper
Title
Application of flip-chip bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Author(s)
Elger, G.
Oppermann, H.H.
Mainwork
LEOS 2001. The 14th Annual Meeting of the IEEE Lasers & Electro-Optics Society. Vol.2
Conference
IEEE Lasers and Electro-Optics Society (Annual Meeting) 2001
DOI
10.1109/LEOS.2001.968860
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
