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Application of flip-chip bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules

 
: Elger, G.; Oppermann, H.H.

:

IEEE Lasers and Electro-Optics Society:
LEOS 2001. The 14th Annual Meeting of the IEEE Lasers & Electro-Optics Society. Vol.2 : Hyatt Regency La Jolla, San Diego, CA. 2001 IEEE/LEOS annual meeting conference proceedings
Piscataway, NJ: IEEE, 2001
ISBN: 0-7803-7105-4
ISBN: 0-7803-7106-2
pp.437-438
IEEE Lasers and Electro-Optics Society (Annual Meeting) <14, 2001, San Diego/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-301089.html