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Characterization of electronic packaging materials and components by image correlation methods
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2001
Conference Paper
Titel
Characterization of electronic packaging materials and components by image correlation methods
Author(s)
Vogel, D.
Auersperg, J.
Michel, B.
Hauptwerk
Advanced photonic sensors and applications II
Konferenz
Conference "Advanced Photonic Sensors and Applications" 2001
DOI
10.1117/12.447348
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM