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Characterization of electronic packaging materials and components by image correlation methods

 
: Vogel, D.; Auersperg, J.; Michel, B.

:

Asundi, A.K. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Advanced photonic sensors and applications II : 27 - 30 November 2001, Singapore
Bellingham/Wash.: SPIE, 2001 (SPIE Proceedings Series 4596)
ISBN: 0-8194-4326-3
pp.237-247
Conference "Advanced Photonic Sensors and Applications" <2, 2001, Singapore>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-301086.html