Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Effects of alloying elements in high reliability copper wire bond material for high temperature applications
Eto, M.; Araki, N.; Yamada, T.; Klengel, R.; Klengel, S.; Petzold, M.; Sugiyama, M.; Fujimoto, S.
Zeitschriftenaufsatz
2020How copper wire material additive elements effect the reliability of wire bonded contacts in HAST testing
Klengel, R.; Klengel, S.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Konferenzbeitrag
2020Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts
Klengel, R.; Klengel, S.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Konferenzbeitrag
2019Influence of copper wire material to corrosion resistant packages and systems for high temperature applications
Klengel, S.; Klengel, R.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Konferenzbeitrag
2019Investigation of mechanical and microstructural properties of a new, corrosion resistant gold-palladium coated copper bond wire
Lorenz, G.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Konferenzbeitrag
2018Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity
Brand, S.; Vogg, G.; Petzold, M.
Zeitschriftenaufsatz
2018Failure Analysis Techniques for 3D Packages
Altmann, F.; Brand, S.; Petzold, M.
Konferenzbeitrag
2018Failure Analysis Techniques for 3D Packages
Altmann, F.; Brand, S.; Petzold, M.
Konferenzbeitrag
2018Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R.
Konferenzbeitrag
2017Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Petzold, M.; Paulasto-Kröckel, M.; Brand, S.
Zeitschriftenaufsatz
2017Interfacial void segregation of Cl in Cu-Sn micro-connects
Ross, G.; Tao, X.; Broas, M.; Mäntyoja, N.; Vuorinen, V.; Graff, A.; Altmann, F.; Petzold, M.; Paulasto-Kröckel, M.
Zeitschriftenaufsatz
2017On reproducing the copper extrusion of through-silicon-vias from the atomic scale
Liu, J.; Huang, Z.; Conway, P.P.; Altmann, F.; Petzold, M.; Naumann, F.
Konferenzbeitrag
2017XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.
Zeitschriftenaufsatz
2016Claudin-16 deficiency impairs tight junction function in ameloblasts, leading to abnormal enamel formation
Bardet, C.; Courson, F.; Wu, Y.; Khaddam, M.; Salmon, B.; Ribes, S.; Thumfart, J.; Yamaguti, P.M.; Rochefort, G.Y.; Figueres, M.L.; Breiderhoff, T.; Garcia-Castano, A.; Vallee, B.; Denmat, D. le; Baroukh, B.; Guilbert, T.; Schmitt, A.; Masse, J.M.; Bazin, D.; Lorenz, G.; Morawietz, M.; Hou, J.H.; Carvalho-Lobato, P.; Manzanares, M.C.; Fricain, J.C.; Talmud, D.; Demontis, R.; Neves, F.; Zenaty, D.; Berdal, A.; Kiesow, A.; Petzold, M.; Menashi, S.; Linglart, A.; Acevedo, A.C.; Vargas-Poussou, R.; Müller, D.; Houillier, P.; Chaussain, C.
Zeitschriftenaufsatz
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Konferenzbeitrag
2016Innovative failure analysis techniques for 3-D packaging developments
Altmann, F.; Petzold, M.
Zeitschriftenaufsatz
2016Non-destructive assessment of reliability and quality related properties of power electronic devices for the in-line application of scanning acoustic microscopy
Brand, S.; Naumann, F.; Tismer, S.; Böttge, B.; Rudzki, J.; Osterwald, F.; Petzold, M.
Konferenzbeitrag
2016Probabilistic strength characterization of thin semiconductor devices for power electronic applications
Naumann, F.; Mittag, M.; Bernasch, M.; Petzold, M.
Konferenzbeitrag
2015Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M.
Konferenzbeitrag
2015A descriptive in vitro electron microscopic study of acidic fluoride-treated enamel: Potential anti-erosion effects
Hjortsjö, C.; Young, A.; Kiesow, A.; Cismak, A.; Berthold, L.; Petzold, M.
Zeitschriftenaufsatz
2015Innovative Material Diagnostics Methods for Through Silicon Via 266 Technologies
Altmann, F.; Brand, S.; Höche, T.; Krause, M.; Petzold, M
Aufsatz in Buch
2014EMMPRIN/CD147 deficiency disturbs ameloblast-odontoblast cross-talk and delays enamel mineralization
Khaddam, M.; Huet, E.; Vallée, B.; Bensidhoum, M.; Denmat, D. le; Filatova, A.; Jimenez-Rojo, L.; Ribes, S.; Lorenz, G.; Morawietz, M.; Rochefort, G.Y.; Kiesow, A.; Mitsiadis, T.A.; Poliard, A.; Petzold, M.; Gabison, E.E.; Menashi, S.; Chaussain, C.
Zeitschriftenaufsatz
2014High resolution failure analysis of silver-sintered contact interfaces for power electronics
Boettge, B.; Maerz, B.; Schischka, J.; Klengel, S.; Petzold, M.
Konferenzbeitrag
2014Improvement of nickel wire bonding using Al nano coating
Klengel, R.; Klengel, S.; Schischka, J.; Lorenz, G.; Petzold, M.
Konferenzbeitrag
2014Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials
März, B.; Graff, A.; Klengel, R.; Petzold, M.
Zeitschriftenaufsatz
2014Lifetime prediction of thick aluminium wire bonds for mechanical cyclic loads
Merkle, L.; Sonner, M.; Petzold, M.
Zeitschriftenaufsatz
2014Mechanical characterization of bond wire materials in electronic devices at elevated temperatures
Lorenz, G.; Naumann, F.; Mittag, M.; Petzold, M.
Konferenzbeitrag
2014Microstructural study of the fatigue mechanism of aluminum cladded copper wires
Naumann, F.; März, B.; Klengel, R.; Schischka, J.; Petzold, M.
Konferenzbeitrag
2014Novel failure diagnostic methods for smart card systems
Klengel, S.; Brand, S.; Große, C.; Altmann, F.; Petzold, M.
Konferenzbeitrag
2014Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies
Brand, S.; Lapadatu, A.; Djuric, T.; Czurratis, P.; Schischka, J.; Petzold, M.
Zeitschriftenaufsatz
2013Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis
Tismer, S.; Brand, S.; Klengel, S.; Petzold, M.; Czurratis, P.
Konferenzbeitrag
2013Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M.
Zeitschriftenaufsatz
2013Characterization and modeling of copper TSVs for silicon interposers
Malta, D.; Gregory, C.; Lueck, M.; Lannon, J.; Lewis, J.; Temple, D.; DiFonzo, P.; Naumann, F.; Petzold, M.
Konferenzbeitrag
2013Defect analysis using high throughput plasma FIB in packaging reliability investigations
Altmann, F.; Klengel, S.; Schischka, J.; Petzold, M.
Konferenzbeitrag
2013Dental tribology at the microscale
Scherge, M.; Sarembe, S.; Kiesow, A.; Petzold, M.
Zeitschriftenaufsatz
2013Determination of hardness and Young's modulus for important III-V compound semiconductors
Klinger, V.; Roesener, T.; Lorenz, G.; Petzold, M.; Dimroth, F.
Zeitschriftenaufsatz
2013Differences in intermetallic phase growth in thermally aged alloyed gold bond interconnections on aluminium
Maerz, B.; Graff, A.; Klengel, R.; Petzold, M.
Konferenzbeitrag
2013Fracture mechanics life-time modeling of low temperature Si fusion bonded interfaces used for 3D MEMS device integration
Naumann, F.; Bernasch, M.; Siegert, J.; Carniello, S.; Petzold, M.
Konferenzbeitrag
2013Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts
Klengel, R.; Klengel, S.; Stephan, T.; Petzold, M.
Konferenzbeitrag
2013Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M.
Konferenzbeitrag
2013Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M.
Konferenzbeitrag
2012Characterizing the anisotropic hardening behavior of aluminum bonding wires
Altenbach, H.; Dresbach, C.; Petzold, M.
Konferenzbeitrag
2012Characterizing the chip damage potential during wafer probing of highly integrated devices
Lorenz, G.; Stephan, T.; Petzold, M.
Konferenzbeitrag
2012Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds
Merkle, L.; Sonner, M.; Petzold, M.
Zeitschriftenaufsatz
2012Emerging techniques for 3-D integrated system-in-package failure diagnostics
Altmann, F.; Petzold, M.
Zeitschriftenaufsatz
2012Failure analysis using scanning acoustic microscopy for diagnostics of electronic devices and 3D system integration technologies
Czurratis, P.; Hoffrogge, P.; Brand, S.; Altmann, F.; Petzold, M.
Konferenzbeitrag
2012Failure mechanisms and mechanical characterization of reactive bonded interfaces
Boettge, B.; Schippel, F.; Naumann, F.; Berthold, L.; Lorenz, G.; Gerbach, R.; Bagdahn, J.; Petzold, M.
Konferenzbeitrag
2012High resolution analyzes of resistance behavior in eWLB metal contacts
Klengel, S.; Krause, M.; Berthold, L.; Petzold, M.; Förster, J.; Pressel, K.; Meyer, T.
Konferenzbeitrag
2012The impact of material composition and process parameters on the cSi solar cell interconnection
Schindler, S.; Schneider, J.; Klengel, R.; Petzold, M.
Konferenzbeitrag
2012Low temperature fusion wafer bonding quality investigation for failure mode analysis
Dragoi, V.; Czurratis, P.; Brand, S.; Beyersdorfer, J.; Patzig, C.; Krugers, J.; Schrank, F.; Siegert, J.; Petzold, M.
Konferenzbeitrag
2012Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M.
Konferenzbeitrag
2012A proper alternative: Ultra sonic bonding for thin film solar cell interconnections
Klengel, R.; Stephan, T.; Petzold, M.; Schindler, S.; Schneider, J.; Spira, K.
Konferenzbeitrag
2012Quality control of bond strength in low-temperature bonded wafers
Siegert, J.; Cassidy, C.; Schrank, F.; Gerbach, R.; Naumann, F.; Petzold, M.
Konferenzbeitrag
2012Reliability characterization of heavy wire bonding materials
Naumann, F.; Schischka, J.; Koetter, S.; Milke, E.; Petzold, M.
Konferenzbeitrag
2012Strength of thin silicon wafers with via holes
Schoenfelder, S.; Kaule, F.; Oswald, M.; Bagdahn, J.; Petzold, M.
Konferenzbeitrag
2012A study of factors influencing micro-chevron-testing of glass frit bonded interfaces
Naumann, F.; Bernasch, M.; Brand, S.; Wünsch, D.; Vogel, K.; Czurratis, P.; Petzold, M.
Konferenzbeitrag
20113D Sensor application with open through silicon via technology
Kraft, J.; Schrank, F.; Teva, J.; Siegert, J.; Koppitsch, G.; Cassidy, C.; Wachmann, E.; Altmann, F.; Brand, S.; Schmidt, C.; Petzold, M.
Konferenzbeitrag
2011Acoustic inspection of high-density-interconnects for 3D-integration
Brand, S.; Petzold, M.; Czurratis, P.; Reed, J.D.; Lueck, M.; Gregory, C.; Huffman, A.; Lennon, J.M.; Temple, D.S.
Konferenzbeitrag