Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Automated quantitative analysis of void morphology evolution in Ag-Ag direct bondig interface after accelerated aging
Yu, Zechun; Xu, Tian; Letz, Sebastian; Bayer, Christoph Friedrich; Schletz, Andreas; März, Martin
Vortrag
2020Application of response surface methodology for optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging
Yu, Zechun; Zeng, Weijian; Bayer, Christoph Friedrich; Schletz, Andreas; März, Martin
Konferenzbeitrag
2020Combined experimental and numerical approach for investigating the mechanical degradation of the interface between thin film metallization and Si-substrate after temperature cycling test
Zhao, Dawei; Letz, Sebastian; Yu, Zechun; Schletz, Andreas; März, Martin
Zeitschriftenaufsatz
2020Future Packaging Technologies in Power Electronic Modules
Bayer, Christoph Friedrich; Yu, Zechun; Bach, Hoang Linh; Müller, Jonas; Schletz, Andreas
Vortrag
2020Integration of Printed Electronics in Potted Power Electronic Modules
Zimmermann, Victoria; Zoerner, Alicia; Yu, Zechun; Jank, Michael; Bayer, Christoph Friedrich; Schletz, Andreas; März, Martin
Konferenzbeitrag
2019Ceramic Embedding Technologies for High Temperature Power Electronics
Bach, Linh; Yu, Zechun
Vortrag
2018Heterogeneous integration of vertical GaN power transistor on Si capacitor for DC-DC converters
Yu, Zechun; Zeltner, Stefan; Boettcher, Norman; Rattmann, Gudrun; Leib, Jürgen; Bayer, Christoph Friedrich; Schletz, Andreas; Erlbacher, Tobias; Frey, Lothar
Vortrag
2018Vias in DBC substrates for embedded power modules
Bach, Hoang Linh; Yu, Zechun; Letz, Sebastian; Bayer, Christoph Friedrich; Waltrich, Uwe; Schletz, Andreas; März, Martin
Konferenzbeitrag