Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2008The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction
Yu, D.Q.; Wang, L.
Zeitschriftenaufsatz
2008Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
Yu, D.Q.; Oppermann, H.; Kleff, J.; Hutter, M.
Zeitschriftenaufsatz
2007Direct robust bonding between Sn-based solder and Si substrate
Yu, D.Q.; Wu, C.M.L.; Wong, Y.W.; Lai, J.K.L.
Zeitschriftenaufsatz
2006Electrochemical migration of lead free solder joints
Yu, D.Q.; Jillek, W.; Schmitt, E.
Zeitschriftenaufsatz
2006Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water
Yu, D.Q.; Jillek, W.; Schmitt, E.
Zeitschriftenaufsatz