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| 2013 | Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique
Jankowski, K.; Swierczynski, R.; Urbanski, K.; Wymyslowski, A.; Chicot, D.; Dudek, R. | Konferenzbeitrag |
| 2010 | Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Wymyslowski, A.; Dowha, L.; Wittler, O.; Mrossko, R.; Dudek, R. | Zeitschriftenaufsatz |
| 2010 | Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test
Dowhán, L.; Wymyslowski, A.; Wittler, O.; Mrosko, R. | Konferenzbeitrag |
| 2010 | Influence of meso-scale analysis parameters of cross-linked polymers on final simulation results
Tesarski, S.J.; Holck, O.; Platek, B.T.; Wymyslowski, A. | Konferenzbeitrag |
| 2010 | Numerical approach to multiscale evaluation and analysis of Tg of crosslinked polymers
Tesarski, S.J.; Hölck, O.; Wymyslowski, A. | Konferenzbeitrag |
| 2009 | Multi-objective decision support system in numerical reliability optimization of modern electronic packaging
Dowhán, L.; Wymyslowski, A.; Dudek, R. | Zeitschriftenaufsatz |
| 2009 | Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, A.; Wittler, O.; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhan, L. | Konferenzbeitrag |
| 2008 | An approach of numerical multi-objective optimization in stacked packaging
Dowhán, L.; Wymyslowski, A.; Dudek, R. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | The Polymer Materials as the Essential Input Parameters in Numerical Multi-Objective Optimization of Stacked Packaging
Dowhán, L.; Wymyslowski, A.; Felba, J.; Dudek, R. | Konferenzbeitrag |
| 2007 | Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach
Falat, T.; Wymyslowski, A.; Kolbe, J.; Jansen, K.M.B.; Ernst, L. | Zeitschriftenaufsatz |
| 2007 | Multi-objective parametric approach to numerical optimization of stacked packages
Dowhán, L.; Wymyslowski, A.; Dudek, R. | Konferenzbeitrag |
| 2007 | Numerical approach to characterization of thermally conductive adhesives
Falat, T.; Wymyslowski, A.; Kolbe, J. | Zeitschriftenaufsatz |
| 2006 | Parametric approach to numerical design for optimization of stacked packages
Dowhán, L.; Wymyslowski, A.; Dudek, R.; Auersperg, J. | Konferenzbeitrag |