Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. | | |
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| 2015 | Characteristics and process stability of complete electrical interconnection structures for a low cost interposer technology
Dittrich, Michael; Steinhardt, Alexander; Heinig, Andy; Wojnowski, M.; Pressel, K.; Wolf, Jürgen | Konferenzbeitrag |
| 2014 | Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen | Konferenzbeitrag |