Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Thermochemical Stress in Solar Cells: Contact Pad Modeling and Reliability Analysis
Rendler, L.; Romer, P.; Beinert, A.; Stecklum, S.; Kraft, A.; Eitner, U.; Wiese, S.
Zeitschriftenaufsatz
2018Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
Krämer, Frank; Röllig, Mike; Metasch, René; Ahmar, Joseph Al; Meier, Karsten; Wiese, Steffen
Zeitschriftenaufsatz
2018Heat haze effects in thermal chamber tensile tests on digital image correlation
Yuile, Adam; Schwerz, Robert; Röllig, Mike; Metasch, René; Wiese, Steffen
Konferenzbeitrag
2018Mechanical and electrical properties of wave-shaped wires for low-stress interconnection of solar cells
Rendler, L.; Walter, J.; Goldenberg, S.; Beinert, A.J.; Wiese, S.; Eitner, U.
Zeitschriftenaufsatz
2018Wave-Shaped Wires Soldered on the Finger Grid of Solar Cells: Solder Joint Stability under Thermal Cycling
Rendler, L.; Haryantho, A.P.; Walter, J.; Huyeng, J.; Kraft, A.; Wiese, S.; Eitner, U.
Konferenzbeitrag
2017Experimental determination of the Young's modulus of various electronic packaging materials
Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten
Konferenzbeitrag
2017Ultra-soft wires for direct soldering on finger grids of solar cells
Rendler, L.C.; Walter, J.; Kraft, A.; Ebert, C.; Wiese, S.; Eitner, U.
Zeitschriftenaufsatz, Konferenzbeitrag
2016Investigation of Thermomechanical Stress in Solar Cells with Multi Busbar Interconnection by Finite Element Modeling
Rendler, L.C.; Kraft, A.; Ebert, C.; Wiese, S.; Eitner, U.
Konferenzbeitrag
2016Mechanical stress in solar cells with multi busbar interconnection - parameter study by FEM simulation
Rendler, L.C.; Kraft, A.; Ebert, C.; Eitner, U.; Wiese, S.
Konferenzbeitrag
2014Investigation of the undercooling of SnCu solder spheres
Schindler, S.; Mueller, M.; Wiese, S.
Konferenzbeitrag
2013Investigation of the failure mode formation in BGA components subjected to JEDEC drop test
Kraemer, F.; Wiese, S.; Rzepka, S.; Lienig, J.
Konferenzbeitrag
2013Undifferentiated embryonic stem cells express ionotropic glutamate receptor mRNAs
Pachernegg, Svenja; Joshi, Illah; Muth-Köhne, Elke; Pahl, Steffen; Münster, Yvonne; Terhag, Jan; Karus, Michael; Werner, Markus; Ma-Högemeier, Zhan-Lu; Körber, Christoph; Grunwald, Thomas; Faissner, Andreas; Wiese, Stefan; Hollmann, Michael
Zeitschriftenaufsatz
2012FEM stress analysis in BGA components subjected to JEDEC drop test applying high strain rate lead-free solder material models
Kraemer, F.; Meier, K.; Wiese, S.; Rzepka, S.
Konferenzbeitrag
2011The creep behaviour and microstructure of ultra small solder joints
Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Wolter, K.-J.
Konferenzbeitrag
2011Mechanical problems of manufacturing processes for photovoltaic modules
Wiese, S.; Kraemer, F.; Meier, R.; Schindler, S.
Konferenzbeitrag
2011Solidification processes in the Sn-rich part of the SnCu system
Panchenko, I.; Mueller, M.; Wiese, S.; Schindler, S.; Wolter, K.-J.
Konferenzbeitrag
2011Solidification processes of SnCu, SnAg and SnAgCu solder alloys and interface reactions to charactize solar cell interconnections processes
Schindler, S.; Wiese, S.
Konferenzbeitrag
2010BGA lifetime prediction in JEDEC drop tests accounting for copper trace routing effects
Kraemer, F.; Wiese, S.; Rzepka, S.; Lienig, J.
Konferenzbeitrag
2010Characterisation of the mechanical behaviour of SAC solder at high strain rates
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2010A detailed investigation of the failure formation of copper trace cracks during drop tests
Kraemer, F.; Wiese, S.; Rzepka, S.; Faust, W.; Lienig, J.
Konferenzbeitrag
2010The effect of copper trace routing on the drop test reliability of BGA modules
Kraemer, F.; Rzepka, S.; Wiese, S.; Lienig, J.
Konferenzbeitrag
2010Interconnection technologies for photovoltaic modules - analysis of technological and mechanical problems
Wiese, S.; Kraemer, F.; Betzl, N.; Wald, D.
Konferenzbeitrag
2010Investigation of wettability and interface reactions of Sn-Pb, Sn-Cu, Sn-Ag and Sn-Ag-Cu solders for solar cell interconnections
Schindler, S.; Wiese, S.
Konferenzbeitrag
2010Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors
Wiese, S.; Meier, R.; Kraemer, F.
Konferenzbeitrag
2010Mechanical behaviour of typical lead-free solders at high strain rate conditions
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2010Mechanical solder characterisation under high strain rate conditions
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2010The packaging technologies for photovoltaic modules - technological challenges and mechanical integrity
Wiese, S.; Kraemer, F.; Betzl, N.; Wald, D.
Konferenzbeitrag
2010Rate dependent mechanical behaviour of SAC solder in fast tensile experiments
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2010Realistic stress representation in 2nd level interconnections of productive BGA components during drop test simulations
Kraemer, F.; Rzepka, S.; Wiese, S.; Lienig, J.
Konferenzbeitrag
2010Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J.
Konferenzbeitrag
2010The scaling effect on microstructure and creep properties of Sn-based solders
Wiese, S.; Mueller, M.; Panchenko, I.; Metasch, R.; Roellig, M.; Wolter, K.-J.
Konferenzbeitrag
2010Thermal cycling induced load on copper-ribbons in crystalline photovoltaic modules
Meier, R.; Kraemer, F.; Wiese, S.; Wolter, K.-J.; Bagdahn, J.
Konferenzbeitrag
2009Combining experimental and simulation methods for the mechanical characterisation of lead free solder alloys under high strain rate loads
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2009Constitutive behaviour of copper ribbons used in solar cell assembly processes
Wiese, S.; Meier, R.; Kraemer, F.; Bagdahn, J.
Konferenzbeitrag
2009Mechanical characterisation of Lead free solder alloys under high strain rate loads
Meier, K.; Wiese, S.; Roellig, M.; Wolter, K.-J.
Konferenzbeitrag
2009Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens
Metasch, R.; Boareto, J.C.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2009The twinning phenomenon in SnAgCu solder balls
Mueller, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2008Scaling effects on grain size and texture of lead free interconnects - investigations by electron backscatter diffraction and nanoindentation
Krause, M.; Müller, M.; Petzold, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Zeitschriftenaufsatz
2007Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions
Dudek, R.; Faust, W.; Wiese, S.; Röllig, M.; Michel, B.
Konferenzbeitrag
2007The size effect on the creep properties of SnAgCu-solder alloys
Wiese, S.; Roellig, M.; Mueller, M.; Wolter, K.-J.; Bennemann, S.; Petzold, M.
Konferenzbeitrag
2006Analytical and mechanical methods for material property investigations of SnAgCu-solder
Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
2006Compositional effects on the creep properties of SnAgCu solder
Wiese, S.; Krämer, F.; Müller, M.; Röllig, M.; Wolter, K.-J.; Krause, M.; Bennemann, S.; Petzold, M.
Konferenzbeitrag
2006Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B.
Konferenzbeitrag
2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Roellig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Konferenzbeitrag
2005Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Röllig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Konferenzbeitrag
2001Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Meusel, E.; Michel, B.
Konferenzbeitrag
1997Load free determination of the coefficient of thermal expansion of polymer foils
Feustel, F.; Vogel, D.; Wiese, S.
Konferenzbeitrag
1996Critical use conditions and their effect on the reliability of soldered interconncects in under the hood application
Ahrens, T.; Wulff, F.W.; Wiese, S.; Nitopi, L.
Konferenzbeitrag