Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2005Development of 3-D redistribution and balling technologies for fabrication of vertical power devices
Böttcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.; Whitmore, M.; Staddon, M.
Zeitschriftenaufsatz
2005The development of balling technologies for wafer level devices with pitches down to 400µm pitch
Whitmore, M.; Staddon, M.; Manessis, D.
Konferenzbeitrag
2005Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
Manessis, D.; Whitmore, M.; Staddon, M.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2005The packaging and assembly of a waferscale system on chip
Veen, C. van; Samber, M. de; Bergveld, H.; Ackerveken, A.; Slob, C.; Manessis, D.; Ostmann, A.; Whitmore, M.
Konferenzbeitrag
2004The development of a low cost wafer level bumping technique
Whitmore, M.; Staddon, M.; Manessis, D.
Konferenzbeitrag