Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016ATHENIS-3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
Wachmann, Ewald; Saponara, Sergio; Zambelli, C.; Tisserand, Pierre; Charbonnier, Jean; Erlbacher, Tobias; Grünler, Saeideh; Hartler, C.; Siegert, J.; Chassard P.; Ton D.M.; Ferrari, L.; Fanucci, L.
Konferenzbeitrag
2015Thermo-mechanical ball bonding simulation with elasto-plastic parameters obtained from nanoindentation and atomic force measurements
Wright, Alan; Koffel, Stephane; Kraft, Silke; Pichler, Peter; Cambieri, Juri; Minixhofer, Rainer; Wachmann, Ewald
Konferenzbeitrag
2014On an improved boron segregation calibration from a particularly sensitive power MOS process
Koffel, S.; Burenkov, A.; Sekowski, M.; Pichler, P.; Giubertoni, D.; Bersani, M.; Knaipp, M.; Wachmann, E.; Schrems, M.; Yamamoto, Y.; Bolze, D.
Zeitschriftenaufsatz, Konferenzbeitrag
2013On the thermo-mechanical modelling of a ball bonding process with ultrasonic softening
Wright, A.; Koffel, S.; Pichler, P.; Enichlmair, H.; Minixhofer, R.; Wachmann, E.
Konferenzbeitrag
20113D Sensor application with open through silicon via technology
Kraft, J.; Schrank, F.; Teva, J.; Siegert, J.; Koppitsch, G.; Cassidy, C.; Wachmann, E.; Altmann, F.; Brand, S.; Schmidt, C.; Petzold, M.
Konferenzbeitrag
2001Optimization of High-Speed SiGe HBTs
Palankovski, V.; Röhrer, G.; Wachmann, E.; Kraft, J.; Löffler, B.; Cervenka, J.; Quay, R.; Grasser, T.; Selberherr, S.
Konferenzbeitrag