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| 2016 | Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy
Dhakal, D.; Assim, K.; Lang, H.; Bruener, P.; Grehl, T.; Georgi, C.; Waechtler, T.; Ecke, R.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2015 | [Ag{S2CNR(C2H4OH)}] as single-source precursor for Ag2S – synthesis, decomposition mechanism, and deposition studies
Mothes, R.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Zeitschriftenaufsatz |
| 2015 | Half-sandwich cobalt complexes in the metal-organic chemical vapor deposition process
Georgi, C.; Hapke, M.; Thiel, I.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Lang, H. | Zeitschriftenaufsatz |
| 2014 | ALD of Nickel Oxide and its Reduction to Nickel for Potential Applications in Interconnects and Spintronics
Wächtler, T.; Sharma, A.; Ahner, N.; Melzer, M.; Mueller, S.; Lehmann, D.; Schäfer, P.; Schulze, S.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Gessner, T. | Konferenzbeitrag |
| 2014 | Carbon nanotube based via interconnects: Performance estimation based on the resistance of individual carbon nanotubes
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems
Georgi, C.; Hildebrandt, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Zeitschriftenaufsatz |
| 2014 | Deposition of copper thin films for ULSI interconnects by ALD of copper oxide and subsequent reduction
Waechtler, T.; Mothes, R.; Hofmann, L.; Schulze, S.; Oswald, S.; Schulz, S.E.; Lang, H.; Hietschold, M.; Gessner, T. | Aufsatz in Buch |
| 2014 | Numerical Simulation of Turbulent Dispersions in Liquid-Liquid Extraction Columns
Wächtler, T. | Dissertation |
| 2014 | Sidewall Damage Analysis of Low-k Dielectricmaterial by Using Energy-Filtered Transmission Electron Microscopy
Singh, P.K.; Zimmermann, S.; Waechtler, T.; Schulze, Steffen; Schulz, S.E.; Hietschold, Michael | Konferenzbeitrag |
| 2014 | Surface chemistry of a Cu(I) beta-diketonate precursor and the atomic layer deposition of Cu2O on SiO2 studied by x-ray photoelectron spectroscopy
Dhakal, D.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H.; Mothes, R.; Tuchscherer, A. | Zeitschriftenaufsatz |
| 2013 | Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications
Melzer, M.; Waechtler, T.; Müller, S.; Fiedler, H.; Hermann, S.; Rodriguez, R.D.; Villabona, A.; Sendzik, A.; Mothes, R.; Schulz, S.E.; Zahn, D.R.T.; Hietschold, M.; Lang, H.; Gessner, T. | Zeitschriftenaufsatz |
| 2013 | Enhancement of the thermoelectric properties of PEDOT:PSS thin films by post-treatment
Luo, J.; Billep, D.; Waechtler, T.; Otto, T.; Toader, M.; Gordan, O.; Sheremet, E.; Martin, J.; Hietschold, M.; Zahn, D.R.T.; Gessner, T. | Zeitschriftenaufsatz |
| 2013 | Magneto-optical Kerr effect studies of Cu2O/nickel heterostructures
Salvan, G.; Robaschik, P.; Fronk, M.; Müller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Schubert, C.; Thomas, S.; Albrecht, M.; Zahn, D.R.T. | Zeitschriftenaufsatz |
| 2013 | Mean droplet size in stirred extraction columns. From 1D simulation to 3D FPM approach
Wächtler, T.; Hlawitschka, M.; Jildeh, H. | Konferenzbeitrag |
| 2012 | ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks
Waechtler, T.; Mueller, S.; Fiedler, H.; Melzer, M.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Counting droplets: A solver for the droplet population balance equation
Wächtler, Timo; Kuhnert, Jörg; Attarakih, Menwer; Klar, Axel | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2012 | Distinguishing between individual contributions to the via resistance in carbon nanotubes based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2012 | FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2
Fronk, M.; Müller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Zahn, D.R.T.; Salvan, G. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2012 | Ruthenocenes and half-open ruthenocenes: Synthesis, characterization, and their use as CVD precursors for ruthenium thin film deposition
Tuchscherer, A.; Georgi, C.; Roth, N.; Schaarschmidt, D.; Rüffer, T.; Waechtler, T.; Schulze, S.E.; Oswald, S.; Gessner, T.; Lang, H. | Zeitschriftenaufsatz |
| 2011 | ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems
Waechtler, T.; Ding, S.-F.; Hofmann, L.; Mothes, R.; Xie, Q.; Oswald, S.; Detavernier, C.; Schulz, S.E.; Qu, X.-P.; Lang, H.; Gessner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2011 | The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru
Ding, S.-F.; Xie, Q.; Mueller, S.; Waechtler, T.; Lu, H.-S.; Schulz, S.E.; Detavernier, C.; Qu, X.-P.; Gessner, T. | Zeitschriftenaufsatz |
| 2011 | Method for the production of a substrate having a coating comprising copper, and coated substrate and device prepared by this method
Wächtler, Thomas; Schulz, Stefan; Gessner, T.; Mueller, Steve; Tuchscherer, A.; Lang, Heinrich | Patent |
| 2011 | The normalized quadrature method of moments coupled with finite pointset method
Wächtler, T.F.; Kuhnert, J.; Attarakih, M.; Tiwari, S.; Klar, A.; Bart, H.-J. | Konferenzbeitrag |
| 2011 | Thermal ALD of Cu via reduction of CuxO films for the advanced metallization in spintronic and ULSI interconnect systems
Mueller, S.; Waechtler, T.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, F.; Ogiewa, M.; Gerlich, L.; Ding, S.-F.; Schulz, S.E.; Gessner, T.; Lang, H.; Zahn, D.R.T.; Qu, X.-P. | Konferenzbeitrag |
| 2010 | Disilver(I) coordination complexes: Synthesis, reaction chemistry, and their potential use in CVD and spin-coating processes for silver deposition
Jakob, A.; Rüffer, T.; Schmidt, H.; Djiele, P.; Körbitz, K.; Ecorchard, P.; Haase, T.; Kohse-Hoeinghaus, K.; Frühauf, S.; Wächtler, T.; Schulz, S.; Gessner, T.; Lang, H. | Zeitschriftenaufsatz |
| 2010 | Inhibition of enhanced Cu oxidation on ruthenium
Ding, S.-F.; Xie, Q.; Waechtler, T.; Lu, H.-S.; Schulz, S.E.; Qu, X.-P. | Konferenzbeitrag |
| 2010 | Thin films of copper oxide and copper grown by atomic layer deposition for applications in metallization systems of microelectronic devices
Wächtler, T. | Dissertation |
| 2009 | Copper oxide ALD from a Cu(I) beta-diketonate: Detailed growth studies on SiO2 and TaN
Wächtler, T.; Roth, N.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Konferenzbeitrag |
| 2009 | Copper oxide ALD from a Cu(I) beta-diketonate: Growth studies and application as seed layers for electrochemical copper deposition
Waechtler, T.; Hofmann, L.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Abstract |
| 2009 | Copper oxide films grown by atomic layer deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2
Waechtler, T.; Oswald, S.; Roth, N.; Jakob, A.; Lang, H.; Ecke, R.; Schulz, S.E.; Gessner, T.; Moskvinova, A.; Schulze, S.; Hietschold, M. | Zeitschriftenaufsatz |
| 2009 | Detailed study of copper oxide ALD on SiO2, TaN, and Ru
Wächtler, T.; Schulze, S.; Hofmann, L.; Hermann, S.; Roth, N.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Poster |
| 2008 | ALD of Copper and Copper Oxide Thin Films for Applications in Metallization Systems of ULSI Devices
Waechtler, T.; Oswald, S.; Roth, N.; Lang, H.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2008 | Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
Wächtler, T.; Oswald, S.; Pohlers, A.; Schulze, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2008 | Copper(I) Carboxylates of Type [(nBu3P)mCuO2CR] (m = 1, 2, 3) - Synthesis, Properties, and their Use as CVD Precursors
Jakob, A.; Shen, Y.; Wächtler, T.; Schulz, S.E.; Gessner, T.; Riedel, R.; Fasel, C.; Lang, H. | Zeitschriftenaufsatz |
| 2008 | Copper oxide and copper thin films grown by ALD for seed layer applications
Wächtler, T.; Schulz, S.E. | Konferenzbeitrag |
| 2008 | New precursors for CVD copper metallization
Norman, J.A.T.; Perez, M.; Schulz, S.E.; Wächtler, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits
Rudra, S.; Friedrich, M.; Louis, S.; Gordan, O.; Waechtler, T.; Zahn, D.R.T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Atomic layer deposition of copper and copper oxide for applications in microelectronic metallization systems
Waechtler, T.; Schulz, S.E.; Oswald, S.; Gessner, T. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2007 | Characterization of sputtered Ta and TaN films by spectroscopic ellipsometry
Waechtler, T.; Gruska, B.; Zimmermann, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2007 | Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver
Frühauf, S.; Gessner, T.; Haase, T.; Jakob, A.; Kohse-Hoeinghaus, K.; Lang, H.; Schulz, S.E.; Wächtler, T. | Konferenzbeitrag |
| 2007 | Phosphane copper(I) complexes as CVD precursors
Roth, N.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2007 | Substrat mit einer Kupfer enthaltenden Beschichtung und Verfahren zu deren Herstellung mittels Atomic Layer Deposition
Gessner, T.; Schulz, S.; Wächtler, T.; Lang, H.; Jakob, A. | Patent |
| 2004 | Ermittlung der Zerspankräfte der Mikrobearbeitung mittels Fräsen
Wächtler, T. | Diplomarbeit |