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| 2020 | An investigation on the feasibility of the bluetooth frequency hopping mechanism for the use as a covert channel technique
Vogel, D.; Akhmedjanov, U.; Ohm, M.; Meier, M. | Konferenzbeitrag |
| 2019 | BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses
Auersperg, J.; Auerswald, E.; Vogel, D.; Rzepka, S. | Konferenzbeitrag |
| 2018 | Application-driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Zeitschriftenaufsatz |
| 2018 | Combining additive manufacturing and biomimetics for the optimization of satellite structures
Vogel, D.; Geismayr, L.; Langer, M.; Leslabay, P.; Schlick, G. | Konferenzbeitrag |
| 2018 | Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Zeitschriftenaufsatz |
| 2018 | Reliability assessment and failure mode analysis of MEMS accelerometers for space applications
Marozau, I.; Auchlin, M.; Pejchal, V.; Souchon, F.; Vogel, D.; Lahti, M.; Saillen, N.; Sereda, O. | Zeitschriftenaufsatz |
| 2017 | Application driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Konferenzbeitrag |
| 2017 | Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B. | Konferenzbeitrag |
| 2017 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Best practice approaches for stress measurements on thin layer stacks
Auerswald, E.; Vogel, D.; Sebastiani, M.; Lord, J.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T. | Zeitschriftenaufsatz |
| 2016 | Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Vogel, D.; Auerswald, E.; Gadhiya, G.; Rzepka, S. | Zeitschriftenaufsatz |
| 2016 | Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S. | Zeitschriftenaufsatz |
| 2016 | Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components
Rost, F.; Arnold, B.; Vogel, D.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Stress analysis in semiconductor devices by Kelvin probe force microscopy
Sheremet, E.; Fuchs, F.; Paul, S.; Haas, S.; Vogel, D.; Rodriguez, P.; Zienert, A.; Schuster, J.; Reuter, D.; Gessner, T.; Zahn, D.; Hietschold, M. | Abstract |
| 2016 | Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B. | Konferenzbeitrag |
| 2015 | Challenges in the reliability of 3D integration using TSVs
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B. | Konferenzbeitrag |
| 2015 | Mechanical characterization of poly-silicon membranes by efficient experimental tests and numerical simulations
Brückner, J.; Auerswald, E.; Vogel, D.; Dudek, R.; Rzepka, S.; Dehe, A. | Konferenzbeitrag |
| 2015 | Mechanical stress induced in Si sensors during bonding and packaging processes
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Miniaturisierte On-Chip Teststrukturen zur Festigkeitsüberwachung von Poly-Silizium
Brückner, J.; Auerswald, E.; Hildebrandt, M.; Vogel, D.; Rzepka, S.; Glacer, C.; Dehe, A. | Konferenzbeitrag |
| 2015 | Stress measurements on TSVs and BEoL structures with high spatial resolution
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
Bayat, P.; Vogel, D.; Rodriguez, R.D.; Sheremet, E.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R. | Konferenzbeitrag |
| 2014 | Determination of residual stresses by fib-DAC methodology
Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S. | Aufsatz in Buch |
| 2014 | Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Modelling and testing of mechanical stresses by means of stress chips for the MERGE project
Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B. | Konferenzbeitrag |
| 2014 | Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2014 | Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Bayat, Parisa; Vogel, D.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Stress measurements at through silicon vias
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2013 | Experimental Analysis of Mechanical Stresses and Material Properties in Multi-Layer Interconnect Systems by fibDAC
Vogel, D.; Auerswald, E.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Measuring techniques for deformation and stress analysis in micro-dimensions
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Strain and Stress Measurement for Reliability Analyses in Small Material Volumes. Invited plenary presentation
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Stress Measurement in Thin Multilayer Systems by Stress Relief
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Local deformation and stress analysis in the micro-nano interface regions
Vogel, D.; Auerswald, E.; Dudek, R.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | Nonlinear copper behavior of TSV and the cracking risks during BEoL-built-up for 3D-IC-integration
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | Quantitative determination of the mechanical stresses in BEoL films and structures on Si wafers with sub-micron spatial resolution by fibDAC
Rzepka, S.; Vogel, D.; Auerswald, E.; Michel, B. | Konferenzbeitrag |
| 2011 | Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
Vogel, D.; Rzepka, S.; Michel, B.; Gollhardt, A. | Konferenzbeitrag |
| 2011 | Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2010 | Comparative study of residual stress measurement techniques with high spatial resolution
Vogel, D.; Maus, I.; Schindler-Saefkow, F.; Michel, B. | Konferenzbeitrag |
| 2010 | Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2010 | Crack and damage in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.D.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2010 | fibDAC stress relief - A novel stress measurement approach for BEoL structures
Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2010 | fibDAC stress relief - A novel stress measurement approach with high spatial resolution
Vogel, D.; Maus, I.; Michel, B. | Konferenzbeitrag |
| 2010 | Local stress measurement methods for packaging purposes- a comparison
Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2010 | Localized high-resolution stress measurements on MEMS structures
Vogel, D.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2010 | Verfahren zur Bestimmung von Deformationen im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Maus, I.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2010 | XANES studies on Eu-doped fluorozirconate-based glass ceramics
Henke, B.; Keil, P.; Paßlick, C.; Vogel, D.; Rohwerder, M.; Wiegand, M.; Johnson, J.A.; Schweizer, S. | Konferenzbeitrag |
| 2009 | Advanced experimental and simulation approaches to meet reliability challenges of new electronics systems
Vogel, D.; Auersperg, J.; Michel, B. | Zeitschriftenaufsatz |
| 2009 | Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2009 | Crack and damage evaluation in low-k BEoL structures under CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2009 | Crack and delamination risk evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2009 | Virtual prototyping in microelectronics and packaging
Rzepka, S.; Dudek, R.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2008 | Approaches of local stress measurement on microsystem devices
Vogel, D.; Auerswald, E.; Gollhardt, A.; Luczak, F.; Sabate, N.; Michel, B. | Konferenzbeitrag |
| 2008 | Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging
Auersperg, J.; Dudek, R.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2008 | Deformation and stress measurement on electronic components with high spatial resolution
Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | Nanoscale resolution deformation measurements at crack tips of nanostructured materials and interface cracks
Keller, J.; Vogel, D.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2008 | Residual stress measurements of high spatial resolution
Vogel, D.; Luczak, F.; Michel, B. | Konferenzbeitrag |
| 2008 | Residual Stress Measurements on Semiconductor Layers Utilizing Stress Relief Techniques
Vogel, D.; Lehr, M.U.; Grillberger, M.; Jaschke, V.; Geisler, H.; Gollhardt, A.; Luczak, F.; Michel, B. | Konferenzbeitrag |
| 2007 | Bonding and reliability for 3D mechanical, optical and fluidic systems
Wiemer, M.; Bagdahn, J.; Beckert, E.; Eichler, M.; Hollaender, A.; Vogel, D. | Konferenzbeitrag |
| 2007 | Experimental Determination of Fracture Parameters Within Small Regions by AFM Techniques
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | FIB Based Local Residual Stress Measurement - Potentials and Challenges
Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | FIB-based technique for stress characterization on thin films for reliability purposes
Sabaté, N.; Vogel, D.; Keller, J.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cané, C.; Michel, B. | Zeitschriftenaufsatz |
| 2007 | Localized high-resolution stress measurement for microsystems
Vogel, D.; Gollhardt, A.; Sabate, N. | Konferenzbeitrag |
| 2007 | Localized stress measurements - a new approach covering needs for advanced micro and nanoscale system development
Vogel, D.; Gollhardt, A.; Sabate, N.; Keller, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Lokale Eigenspannungsmessung im FIB - Potential und Herausforderung
Vogel, D.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Measurement of stresses in MEMS structures by stress release
Vogel, D.; Sabate, N.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2007 | Messung von Bruchkenngrößen in sehr kleinen Werkstoffbereichen mit dem AFM
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | NanoDAC - Object deformation measurements for micro and nanotechnology applications
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | Nanodeformation Measurements for Reliability Studies of Nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | Nanoscale deformation measurements for reliability assessment of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | Reliability analysis for smart systems on the way from micro to nano
Michel, B.; Auersperg, J.; Vogel, D. | Konferenzbeitrag |
| 2007 | Residual stress measurement on a MEMS structure with high-spatial resolution
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B. | Zeitschriftenaufsatz |
| 2006 | AFM based fracture analysis in micro- and nanomaterials
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2006 | Digital image correlation of nanoscale deformation fields for local stress measurement in thin films
Sabate, N.; Vogel, D.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cane, C.; Michel, B. | Zeitschriftenaufsatz |
| 2006 | FIB based measurement of local residual stresses on microsystems
Vogel, D.; Sabate, N.; Gollhardt, A.; Keller, J.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2006 | FibDAC - residual stress determination by combination of focused ion beam technique and digital image correlation
Keller, J.; Gollhardt, A.; Vogel, D.; Auerswald, E.; Sabate, N.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2006 | High-resolution stress measurements for microsystem and semiconductor applications
Vogel, D.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2006 | Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale
Wunderle, B.; Dudek, R.; Vogel, D.; Michel, B. | Abstract |
| 2006 | Measurement of residual stress by slot milling with focused ion-beam equipment
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B. | Zeitschriftenaufsatz |
| 2006 | Measurement of residual stresses in micromachined structures in a microregion
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B.; Cane, C.; Gracia, I.; Morante, J.R. | Zeitschriftenaufsatz |
| 2006 | NanoDAC/fibDAC - Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2006 | Nanoscale Deformation Measurements for Reliability Assessment of Material Interfaces
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2006 | A new method for local strain field analysis near cracks in micro- and nanotechnology applications
Michel, B.; Vogel, D.; Sabaté, N.; Lieske, D. | Konferenzbeitrag |
| 2006 | Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging
Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2006 | Verfahren zur Erfassung von lokalen Eigenspannungen in Festkoerperobjekten mit einer Ionenstrahltechnik
Auersperg, J.; Lieske, D.; Keller, J.; Vogel, D.; Michel, B.; Gollhardt, A.; Dost, M. | Patent |
| 2005 | 3D deformation analysis of flow and gas sensors membranes for reliability assessment
Sabate, N.; Keller, J.; Gollhardt, A.; Vogel, D.; Gracia, I.; Cane, C.; Morante, J.R.; Michel, B. | Konferenzbeitrag |
| 2005 | Characterization of nanoscale modified polymers for automotive applications
Vogel, D.; Gollhardt, A.; Keller, J.; Holst, M.; Muzic, M.; Michel, B. | Abstract |
| 2005 | A combined simulative and experimental approach to reliability optimization of MEMS
Wittler, O.; Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2005 | Crack and delamination risk evaluation of thin silicon based microelectronics devices
Auersperg, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2005 | Deformation field measurement on micro and nanotechnology components utilizing SFM and FIB equipment
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2005 | Design methodology of microstructures for enhanced mechanical reliability
Wittler, O.; Walter, H.; Vogel, D.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2005 | FIB based Measurements for Material Characterization on MEMS Structures
Vogel, D.; Lieske, D.; Gollhardt, A.; Keller, J.; Sabaté, N.; Morante, J.R.; Michel, B. | Konferenzbeitrag |
| 2005 | fibDAC - A new Approach of Material Characterization for the Transition from Micro to Nano Scale
Vogel, D.; Sabaté, N.; Keller, J.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2005 | Nanodac - a method for fracture mechanical characterization on the nanoscale
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2005 | Nanoreliability for mechanically loaded devices
Vogel, D.; Sabate, N.; Wunderle, B.; Keller, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2005 | Nanoscale deformation measurements for reliability analysis of sensors
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2005 | A new approach to micro deformation analysis by finite element based digital image correlation
Kühnert, R.; Meyer, R.; Vogel, D.; Michel, B. | Abstract |
| 2004 | Characterization approaches of nanoscale modified plastics
Vogel, D.; Keller, J.; Michel, B.; Holst, M.; Muzic, M. | Konferenzbeitrag |
| 2004 | Characterization of materials with nanoscopic filler particles by AFM techniques
Vogel, D.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2004 | Characterization of microcracks by application of digital image correlation to SPM images
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches
Auersperg, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Determination of local stress intensity factor at crack tip using image correlation techniques
Tsai, Y.; Keller, J.; Eylon, D.; Vogel, D.; Michel, B.; Meyendorf, N. | Konferenzbeitrag |
| 2004 | Displacement and strain field measurements from SPM images
Keller, J.; Vogel, D.; Schubert, A.; Michel, B. | Aufsatz in Buch |
| 2004 | Fracture mechanical characterization of micro- and nano-filled polymers by a combined experimental and simulative procedure
Wunderle, B.; Dermitzaki, E.; Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | MicroDAC - ein Messverfahren zur Ermittlung von Werkstoffeigenschaften im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Nanodac - an SPM-based nanodeformation measurement technique for reliability assessment of micro- and nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Verfahren und Vorrichtung zur Bestimmung zumindest eines bruchmechanischen Materialparameters eines Pruefkoerpers
Uhlig, C.; Bauer, M.; Kahle, O.; Vogel, D.; Wieneke, B. | Patent |
| 2004 | Zuverlässigkeitsaspekte in Chip-in-Polymer-Applikationen
Auersperg, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2003 | Bestimmung der Querkontraktionszahl von Polymeren mittels Laserextensometrie und Grauwertkorrelationsanalyse
Walter, H.; Vogel, D.; Michel, B.; Grellmann, W.; Bierögel, C. | Konferenzbeitrag |
| 2003 | Combining DIC techniques and finite element analysis for reliability assessment on micro and nano scale
Vogel, D.; Dudek, R.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2003 | Evaluating microdefect structures by AFM-based deformation measurement
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2003 | High temperature degradation of Pt/Ti electrodes in micro-hotplate gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R. | Zeitschriftenaufsatz |
| 2003 | How to detect Edgar Allan Poe's 'purloined letter' - Or: Cross correlation algorithms in digitised video images for object identification, movement evaluation and deformation analysis
Dost, M.; Vogel, D.; Winkler, T.; Vogel, J.; Erb, R.; Kieselstein, E.; Michel, B. | Konferenzbeitrag |
| 2003 | Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments
Kaulfersch, E.; Vogel, D.; Michel, B. | Zeitschriftenaufsatz |
| 2003 | nanoDAC - A Method of Reliability Analysis for Micro and Nano Technology
Vogel, D.; Michel, B. | Abstract |
| 2003 | Thermal and mechanical analysis of micromachined gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R. | Zeitschriftenaufsatz |
| 2002 | Determination of packaging material properties utilizing image correlation techniques
Vogel, D.; Kühnert, R.; Dost, M.; Michel, B. | Zeitschriftenaufsatz |
| 2002 | Displacement and strain field measurements for nanotechnology applications
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2002 | Encapsulant characterization - valuable tools for process setup and failure analysis
Becker, K.F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.W.; Neumann Rodekirch, J. | Konferenzbeitrag |
| 2002 | Fracture mechanical characterization of polymers on nano scale by means of grey scale correlation
Keller, J.; Vogel, D.; Gollhardt, A.; Bauer, M.; Michel, B. | Konferenzbeitrag |
| 2002 | Micro & nanoDAC - A powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D. | Konferenzbeitrag |
| 2002 | Micro andnanoDAC - a powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D. | Konferenzbeitrag |
| 2002 | Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B. | Zeitschriftenaufsatz |
| 2002 | Micro/nanoDAC deformation measurement to analyze packaging components response to thermo-mechanical load
Vogel, D.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2002 | NanoDAC - A powerful method for nanomechanical analysis of polymeric materials
Keller, J.; Vogel, D.; Bauer, M.; Michel, B. | Konferenzbeitrag |
| 2002 | Verfahren und Vorrichtung zur Erzeugung hochenergetischer Ionenstrahlen und/oder kurzwelliger elektromagnetischer Strahlung
Vogel, D.; Vogel, N.; Kaempfe, B. | Patent |
| 2001 | Characterization of electronic packaging materials and components by image correlation methods
Vogel, D.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2001 | Deformations- und Bruchverhalten von Mikrobauteilen aus Polymerverbunden
Michel, B.; Vogel, D.; Auersperg, J. | Konferenzbeitrag |
| 2001 | Life time prediction on polymer encapsulated components
Sonner, M.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | Messung von Materialkennwerten an Komponenten der Mikrotechnik
Vogel, D.; Sommer, J.-P.; Großer, V.; Michel, B. | Zeitschriftenaufsatz |
| 2001 | Microcrack evaluation for electronics components by AFM nano-DAC deformation measurements
Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2001 | The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability
Michel, B.; Dudek, R.; Vogel, D. | Konferenzbeitrag |
| 2001 | MicroDAC strain measurement for electronics packaging structures
Vogel, D.; Grosser, V.; Schubert, A.; Michel, B. | Zeitschriftenaufsatz |
| 2001 | mTest - A new approach to measure material properties from microscopic specimens
Vogel, D.; Gollhardt, A.; Walter, H.; Dudek, R.; Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 2001 | Ongoing research in the NanoMechanicsLab Berlin-Adlershof
Vogel, D.; Gollhardt, A.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2000 | Determination of Materials Properties on Micro Components
Vogel, D.; Sommer, J.-P.; Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 2000 | Effect of bump height on the strain variation during the thermalcycling test of ACA flip-chip joints
Pinardi, K.; Lai, Z.; Vogel, D.; Kang, Y.L.; Liu, J.; Liu, S.; Haug, R.; Willander, M. | Zeitschriftenaufsatz |
| 2000 | Experimental validation of finite-element modeling
Vogel, D.; Jian, C.; Dewolf, I. | Konferenzbeitrag |
| 2000 | Measurement of material properties by a modified microDAC approach
Vogel, D.; Luczak, F.; Wittler, O.; Gollhardt, A.; Walter, H.; Michel, B. | Konferenzbeitrag |
| 2000 | Measurement of Thermal Expansion in Micromaterials - cTest Microscopy
Kühnert, R.; Tränkner, K.; Herrmann, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2000 | Measurement of thermally induced strains on flip chip and chip scale packages
Vogel, D.; Kaulfersch, E.; Simon, J.; Kuehnert, R.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2000 | MicroDAC strain measurement for FEA support
Vogel, D.; Gollhardt, A.; Schubert, A.; Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 2000 | Strain measurement in solder interconnects of advanced electronic packages
Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2000 | Thermo-mechanical reliability enhancement of microelectronics
Auersperg, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2000 | Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications
Wittler, O.; Walter, H.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B. | Konferenzbeitrag |
| 2000 | UNIDAC: Cross correlation based deformation analysis at digitised micrographs to study material behaviour and parameters in MST
Dost, M.; Kieselstein, E.; Erb, R.; Seiler, B.; Vogel, J.; Bombach, C.; Großer, V.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 1999 | Flip chip solder joint reliability
Schubert, A.; Dudek, R.; Vogel, D.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1999 | Glassensor-Studie zur Erfassung der korrosiven Belastung innerhalb und außerhalb von Solarabsorbersystemen
Troll, C.; Böhm, T.; Vogel, D.; Maas, G. | Aufsatz in Buch |
| 1999 | Lasermetrological measurement of transient strain fields in Hopkinson-bar experiments
Vogel, D.; Michel, B.; Totzauer, W.; Schreppel, U.; Clos, R. | Aufsatz in Buch |
| 1999 | Materials microscopy
Kühnert, R.; Tränkner, K.; Franke, H.; Vogel, D.; Schubert, A. | Aufsatz in Buch |
| 1999 | Micro-DAC - a three year history of strain measurements on tiny electronics packaging structures
Vogel, D. | Aufsatz in Buch |
| 1999 | MicroDAC deformation analysis on solder interconnects for flip chip
Vogel, D.; Luczak, F.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1999 | Microscopic deformation field measurement supporting FEA based reliability analysis in electronic packaging
Vogel, D.; Gollhardt, A.; Kühnert, R.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 1999 | Optical measurement methods for MEMS applications
Großer, V.; Bombach, C.; Faust, W.; Vogel, D.; Michel, B. | Aufsatz in Buch |
| 1999 | Packaging and thermomechanical challenges for high temperature electronics
Michel, B.; Vogel, D. | Konferenzbeitrag |
| 1999 | Strain measurement in micrometrology
Vogel, D.; Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 1998 | Damage and fracture evaluation in microelectronic assemblies by FEA and experimental investigations
Auersperg, J.; Winkler, T.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 1998 | Investigation of a rigid carrier CSP with the microDAC method
Simon, J.; Vogel, D.; Faust, W.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 1998 | Microdeformation analysis of packages and interconnects by the MicroDAC method
Vogel, D.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1998 | Thermo-mechanical analysis of microelectronics components and chipcards
Michel, B.; Vogel, D. | Konferenzbeitrag |
| 1998 | Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Advanced deformation and failure analysis on flip chip assemblies
Vogel, D.; Caers, J.; Auersperg, J.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | The application of thermophysical methods in microsystems and microelectronics
Uhlig, C.; Kahle, O.; Vogel, D.; Bauer, M. | Konferenzbeitrag |
| 1997 | Characterization of microsystem and packaging components by acoustic microscopy
Vogel, D.; Becker, K.-F.; Zakel, E. | Konferenzbeitrag |
| 1997 | Deformation analysis on flip chip solder interconnects by MicroDAC
Vogel, D.; Auersperg, J.; Schubert, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC
Auersperg, J.; Schubert, A.; Vogel, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Load free determination of the coefficient of thermal expansion of polymer foils
Feustel, F.; Vogel, D.; Wiese, S. | Konferenzbeitrag |
| 1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz |
| 1997 | Mechanical reliability study of FCOB and CSP assemblies by FEA and MicroDAC
Schubert, A.; Dudek, R.; Vogel, D.; Auersperg, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | MicroDAC deformation measurement in packaging components
Vogel, D.; Langheinrich, M.; Auersperg, J.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | MicroDAC deformation measurement on microelectronic products
Vogel, D.; Bombach, C.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 1997 | The microDAC method. A powerful means for microdeformation analysis in electronic packaging
Michel, B.; Vogel, D.; Schubert, A.; Auersperg, J.; Reichl, H. | Konferenzbeitrag |
| 1997 | Reliability evaluation of chip scale packages by FEA and MicroDAC
Auersperg, J.; Vogel, D.; Simon, J.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Thermo-mechanical reliability issues of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Verfahren zur feldmaessigen Bestimmung von Deformationszustaenden in mikroskopisch dimensionierten Prueflingsbereichen
Kuehnert, R.; Schubert, A.; Dost, M.; Vogel, D.; Kaempfe, B.; Michel, B. | Patent |
| 1996 | Mechanisch-thermische Zuverlässigkeit von Chipkarten
Schubert, A.; Dudek, R.; Faust, W.; Vogel, D.; Michel, B.; Reichl, H. | Aufsatz in Buch |
| 1996 | MicroDAC - ein neues Verfahren zur quantitativen Mikroverformungsanalyse
Vogel, D.; Schubert, A.; Michel, B. | Aufsatz in Buch |
| 1995 | Einsatzmöglichkeiten der Ultraschallmikroskopie an Bauteilen der Mikroelektronik und Mikrosystemtechnik
Zakel, E.; Vogel, D. | Konferenzbeitrag |
| 1995 | Thermische Verformungsuntersuchungen an Polymer-Abdeckmassen für Si-Chips - Simulation Tauchlötvorgang
Grosser, V.; Vogel, D.; Bombach, C.; Dudek, R.; Michel, B. | Aufsatz in Buch |
| 1995 | Werkstoffmechanische Untersuchungen an Chipkarten
Vogel, D.; Schubert, A.; Faust, W.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1994 | Optical deformation analysis of surface mounted devices
Vogel, D.; Kaulfersch, E.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1994 | Reliability of epoxy Globtop in microelectronic assemblies
Krause, F.; Voges, T.; Rehme, F.; Dudek, R.; Vogel, D.; Faust, W. | Konferenzbeitrag |
| 1994 | Speckle photographic strain field measurement. A helpful aid in fracture modelling and analysis of microstructures
Vogel, D.; Sommer, J.-P.; Michel, B. | Konferenzbeitrag |
| 1993 | Automatisierte specklefotografische Lasermeßtechnik zur berührungslosen, ortsauflösenden Deformationsanalyse
Vogel, D.; Kaulfersch, E. | Aufsatz in Buch |
| 1993 | SPY - a modular specklephotographic measurement system for micro-mechanics purposes
Vogel, D.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1993 | Untersuchungen zum lokalen Deformationsverhalten in der Rißspitzenumgebung mit laseroptischen und elektronenmikroskopischen Feldmeßverfahren
Michel, B.; Vogel, D.; Kühnert, R. | Konferenzbeitrag |