Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018PoCOsteo: Personalized fracture risk prediction via point-of-care device
Khashayar, Patricia; O'Sullivan, Ciara K.; Katakis, Ioanis; Ortiz, Mayreli; Acero, Josep Lluis; Gransee, Rainer; Latta, Daniel; Hoogenboom, Richard; Devlieghere, Frank; Ragaert, Peter; Vermeulen, An; Adriaens, Mieke; Leys, Frederik; Lopes, Paula; Schols, Gust; Riley, Ian James; Biggs, Phil; Barredo, Borja; Ostovar, Afshin; Moradi, Nahid; Larijani, Bagher; Dimai, Hans Peter; Obermayer-Pietsch, Barbara; Vanfleteren, Jan
Zeitschriftenaufsatz
2016Real-time monitoring of metabolic function in liver-on-chip microdevices tracks the dynamics of mitochondrial dysfunction
Bavli, Danny; Prill, Sebastian; Ezra, Elishai; Levy, Gahl; Cohen, Merav; Vinken, Mathieu; Vanfleteren, Jan; Jaeger, Magnus S.; Nahmias, Yaakov
Zeitschriftenaufsatz
2014Übertragung des außenstromlosen Nickel-Metallisierungs-Verfahrens in die Mikrosystemtechnik
Ostmann, A.
: Lang, K.-D.; Vanfleteren, J.; Nowottnick, M.
Dissertation
2013Reliability and application scenarios of stretchable electronics realized using printed circuit board technologies
Vanfleteren, J.; Bossuyt, F.; Löher, T.; Hsu, Y.-Y.; Gonzalez, M.; Günther, J.
Aufsatz in Buch
2012SCB and SMI: Two stretchable circuit technologies, based on standard printed circuit board processes
Vanfleteren, Jan; Loeher, Thomas; Gonzalez, Mario; Bossuyt, Frederick; Vervust, Thomas; Wolf, Ingrid de; Jablonski, Michal
Zeitschriftenaufsatz
2008Embedding and assembly of ultrathin chips in multilayer flex boards
Christiaens, W.; Löher, T.; Pahl, B.; Feil, M.; Vandevelde, B.; Vanfleteren, J.
Zeitschriftenaufsatz
2006Embedding of chips in flex and rigid substrates: Impact on thermal and mechanical performance
Vandevelde, B.; Chen, C.; Sommer, J.-P.; Christiaens, W.; Vandecasteele, B.; Vanfleteren, J.; Lehtiniemi, R.; Arslan, A.
Konferenzbeitrag
2006Stretchable electronic systems
Löher, T.; Manessis, D.; Heinrich, R.; Schmied, B.; Vanfleteren, J.; Baets, J. de; Ostmann, A.; Reichl, H.
Konferenzbeitrag
2005FP5-CSG-IMECAT - Highlight of a EC funded project on lead-free materials and assembly development technology
Vandevelde, B.; Vanfleteren, J.; Manessis, D.; Gonzales, M.
Konferenzbeitrag
2005Highlights of a EC funded project on Lead-free Materials and Assembly Development Technology
Vandevelde, B.; Vanfleteren, J.; Manessis, D.; Gonzales, M.
Konferenzbeitrag
2005Lead-free flip chip: A comparison between lead-free solder and adhesives
Vandecasteele, B.; Manessis, D.; Vanfleteren, J.; Ostmann, A.; Hagedorn, H.W.; Wiese, J.
Konferenzbeitrag
2005Thermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applications
Gonzalez, M.; Vandevelde, B.; Vanfleteren, J.; Manessis, D.
Konferenzbeitrag