Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System
Dudek, R.; Döring, R.; Rzepka, S.; Gromala, P.; Schindele, J.; Vandevelde, B.
Konferenzbeitrag
2014Strategies for responding to the reliability challenges of future smart systems
Rzepka, S.; Andersson, D.; Vandevelde, B.
Konferenzbeitrag
2008Embedding and assembly of ultrathin chips in multilayer flex boards
Christiaens, W.; Löher, T.; Pahl, B.; Feil, M.; Vandevelde, B.; Vanfleteren, J.
Zeitschriftenaufsatz
2006Embedding of chips in flex and rigid substrates: Impact on thermal and mechanical performance
Vandevelde, B.; Chen, C.; Sommer, J.-P.; Christiaens, W.; Vandecasteele, B.; Vanfleteren, J.; Lehtiniemi, R.; Arslan, A.
Konferenzbeitrag
2005FP5-CSG-IMECAT - Highlight of a EC funded project on lead-free materials and assembly development technology
Vandevelde, B.; Vanfleteren, J.; Manessis, D.; Gonzales, M.
Konferenzbeitrag
2005Highlights of a EC funded project on Lead-free Materials and Assembly Development Technology
Vandevelde, B.; Vanfleteren, J.; Manessis, D.; Gonzales, M.
Konferenzbeitrag
2005Thermo-mechanical FEM analysis of lead free and lead containing solder for flip chip applications
Gonzalez, M.; Vandevelde, B.; Vanfleteren, J.; Manessis, D.
Konferenzbeitrag