Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Cobalt integration solutions - integration (R&D accelerator)
Gerlich, Lukas; Wislicenus, Markus; Koch, Johannes; Dhavamani, Abitha; Esmaeili, Sajjad; Uhlig, Benjamin
Vortrag
2018Copper electroplating with polyethylene Glycol. Pt.II. Experimental analysis and determination of model parameters
Yang, Hongliu; Krause, Robert; Scheunert, Christin; Liske, Romy; Uhlig, Benjamin; Preusse, Axel; Dianat, Arezoo; Bobeth, Manfred; Cuniberti, Gianaurelio
Zeitschriftenaufsatz
2017BEoL post CMP cleaning challenges for 22 nm FD-SOI and beyond
Koch, Johannes; Rehschuh, Stephan; Gerlich, Lukas; Dhavamani, Abitha; Steinke, Philipp; Krause, Robert; Naue, Johannes; Bott, Sascha; Vasilev, Boris; Breuer, Dirk; Seidel, Robert; Preusse, Axel; Bartha, Johann Wolfgang; Uhlig, Benjamin
Konferenzbeitrag
2017Evaluation of an electrochemical corrosion technique for the determination of static etch rates of post CMP cleaning chemicals
Krause, Robert; Koch, Johannes; Rehschuh, Stephan; Naue, Johannes; Bott, Sascha; Uhlig, Benjamin; Vasilev, Boris
Vortrag
2017The fabrication of copper-carbon nanotube composites for global interconnects
Nagy, Nicole; Lilienthal, Katharina; Uhlig, Benjamin
Poster
2017Seed-layer resistance and its impact on the electrochemical copper deposition
Wislicenus, Marcus; Gerlich, Lukas; Koch, Johannes; Uhlig, Benjamin
Vortrag
2016CVD-CoXN for advanced semiconductor metallization
Dhavamani, Abitha; Wislicenus, Marcus; Gerlich, Lukas; Uhlig, Benjamin
Vortrag
2016The influence of adsorption kinetics on copper superfilling for dual damascene
Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel
Zeitschriftenaufsatz
2015Advanced Wet-Etch-Only Process for Complete Tri-Layer Rework
Steinke, Philipp; Calvo, Jesús; Uhlig, Benjamin
Zeitschriftenaufsatz, Konferenzbeitrag
2015Development and characterization of a novel CoXN barrier film for future semiconductor technology nodes
Dhavamani, Abitha
: Uhlig, Benjamin (Betr.); Bartha, Johann Wolfgang (Gutachter)
Master Thesis
2015Theory of co-adsorption and its application to copper superfilling
Liske, Romy; Krause, Robert; Uhlig, Benjamin; Gerlich, Lukas; Bott, Sascha; Wislicenus, Marcus; Preusse, Axel
Vortrag
2015Untersuchung des Korrosionsverhaltens von kobalthaltigen Dünnschichten für den Einsatz in der Halbleitertechnologie
Nagy, Nicole
: Kalies, Grit (Betr.); Uhlig, Benjamin (Betr.)
Master Thesis
2014Post etch wet clean processes for advanced technology nodes
Uhlig, Benjamin; Steinke, Philipp; Liske, Romy; Ott, Andreas; Mieth, Oliver
Konferenzbeitrag
2010High precision stress measurements in semiconductor structures by raman microscopy
Uhlig, Benjamin
: Eng, Lukas M. (Gutachter); Michaelis, Alexander (Gutachter)
Dissertation