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2018 | Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts Klengel, R.; Naumann, F.; Tismer, S.; Klengel, S. | Konferenzbeitrag |
2016 | Evaluation of the bond quality of laser-joined sapphire wafers using a fresnoite-glass sealant Pablos-Martin, A. de; Tismer, S.; Naumann, F.; Krause, M.; Lorenz, M.; Grundmann, M.; Höche, T. | Zeitschriftenaufsatz |
2016 | Laser soldering of sapphire substrates using a BaTiAl6O12 thin-film glass sealant Pablos-Martin, A. de; Tismer, S.; Benndorf, G.; Mittag, M.; Lorenz, M.; Grundmann, M.; Höche, T. | Zeitschriftenaufsatz |
2016 | Laser-welded fused silica substrates using a luminescent fresnoite-based sealant Pablos-Martin, A. de; Benndorf, G.; Tismer, S.; Mittag, M.; Cismak, A.; Lorenz, M.; Grundmann, M.; Höche, T. | Zeitschriftenaufsatz |
2016 | Magnetic field and current density imaging using off-line lock-in analysis Kögel, M.; Altmann, F.; Tismer, S.; Brand, S. | Zeitschriftenaufsatz |
2015 | Non-destructive wafer-level bond defect identification by scanning acoustic microscopy Brand, S.; Tismer, S.; Moe, S.T.; Schjølberg-Henriksen, K. | Zeitschriftenaufsatz |
2015 | Scaling behavior of EEG amplitude and frequency time series across sleep stages Kantelhardt, J.W.; Tismer, S.; Gans, F.; Schumann, A.Y.; Penzel, T. | Zeitschriftenaufsatz |
2015 | Structural characterization of laser bonded sapphire wafers using a titanium absorber thin film Pablos-Martin, A. de; Tismer, S.; Höche, T. | Zeitschriftenaufsatz |
2013 | Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis Tismer, S.; Brand, S.; Klengel, S.; Petzold, M.; Czurratis, P. | Konferenzbeitrag |
2013 | Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M. | Zeitschriftenaufsatz |