Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Analysis of the effect of TSV-induced stress on devices performance by direct strain and electrical measurements and FEA simulations
Kteyan, Armen; Mühle, Uwe; Gall, Martin; Sukharev, Valeriy; Radojcic, Riko; Zschech, Ehrenfried
Zeitschriftenaufsatz
2017Carrier mobility shift in advanced silicon nodes due to chip-package interaction
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Nakamoto, Mark; Zhao, Wei; Radojcic, Riko; Mühle, Uwe; Zschech, Ehrenfried
Zeitschriftenaufsatz
2016CPI stress induced carrier mobility shift in advanced silicon nodes
Sukharev, Valeriy; Choy, Jun-Ho; Kteyan, Armen; Hovsepyan, Henrik; Mühle, Uwe; Zschech, Ehrenfried; Radojcic, Riko
Konferenzbeitrag
2016Novel approaches to determine thermomechanical materials data in advanced interconnect stacks
Zschech, Ehrenfried; Gall, Martin; Clausner, André; Sander, Christoph; Sukharev, Valeriy
Konferenzbeitrag
2014Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies - effect of stress on 3D IC interconnect reliability
Sukharev, Valeriy; Zschech, Ehrenfried
Konferenzbeitrag
2014Physics-based simulation of EM and SM in TSV-based 3D IC structures
Kteyan, Armen; Sukharev, Valeriy; Zschech, Ehrenfried
Konferenzbeitrag
2009Geometry and microstructure effect on EM-induced copper interconnect degradation
Zschech, Ehrenfried; Ho, Paul S.; Schmeißer, Dieter; Meyer, Moritz Andreas; Vairagar, Anand V.; Schneider, Gerd; Hauschildt, Meike; Kraatz, Matthias; Sukharev, Valeriy
Zeitschriftenaufsatz
2009Microstructure effect on EM-induced degradations in dual inlaid copper interconnects
Sukharev, Valeriy; Kteyan, Armen; Zschech, Ehrenfried; Nix, W.D.
Zeitschriftenaufsatz