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| 2019 | Entwicklung eines MIMO-Radarfrontends auf Glasinterposer Basis fürs autonome Fahren
Tschoban, C.; Fritsche, C.; Böttcher, M.; Steller, W.; Ndip, I.; Pötter, H. | Konferenzbeitrag |
| 2018 | Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G. | Konferenzbeitrag |
| 2018 | Microfluidic Interposer for High Performance Fluidic Chip Cooling
Steller, W.; Windrich, F.; Bremner, D.; Robertson, S.; Mroßko, R.; Keller, J.; Brunschwiler, T.; Schlottig, G.; Oppermann, H.; Wolf, M.J.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D. | Konferenzbeitrag |
| 2018 | Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B. | Konferenzbeitrag |
| 2017 | Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B. | Konferenzbeitrag |
| 2017 | Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J. | Konferenzbeitrag |
| 2016 | Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, Jessica; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T. | Konferenzbeitrag |
| 2016 | Stress investigations in 3D-integrated silicon microstructures
Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B. | Konferenzbeitrag |
| 2015 | Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M. | Konferenzbeitrag |
| 2015 | Challenges in the reliability of 3D integration using TSVs
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B. | Konferenzbeitrag |
| 2015 | Challenges of TSV backside process integration
Rudolph, Catharina; Wachsmuth, Holger; Boettcher, Mathias; Steller, Wolfram; Wolf, M. Jürgen | Konferenzbeitrag |
| 2014 | SIMEIT-project: High precision inertial sensor integration on a modular 3D-interposer platform
Steller, Wolfram; Meinecke, C.; Gottfried, Knut; Woldt, Gregor; Günther, W.; Wolf, M. Jürgen; Lang, Klaus-Dieter | Konferenzbeitrag |