Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2010Advanced virtual qualification methods to reduce the time-to-market of microelectronic assemblies
Shirangi, M.H.; Koyuncu, M.; Keller, J.; Michel, B.
Konferenzbeitrag
2010Advanced virtual testing of structural integrity in microelectronic assemblies
Shirangi, M.H.; Otto, C.; Fischer, A.; Staa, P. van; Müller, W.H.; Michel, B.
Konferenzbeitrag
2010Mechanism of moisture diffusion, hygroscopic swelling, and adhesion degradation in epoxy molding compounds
Shirangi, M.H.; Michel, B.
Aufsatz in Buch
2009Determination of copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages
Shirangi, M.H.; Müller, W.H.; Michel, B.
Konferenzbeitrag
2009Effect of nonlinear hygro-thermal and residual stresses on the interfacial fracture in plastic IC packages
Shirangi, M.H.; Müller, W.H.; Michel, B.
Konferenzbeitrag
2009Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages
Wunderle, B.; Wittler, O.; Walter, H.; Michel, B.; Shirangi, M.H.
Konferenzbeitrag
2008Investigation of fracture toughness and displacement fields of copper/polymer interface using image correlation technique
Shirangi, M.H.; Gollhardt, A.; Fischer, A.; Müller, W.H.; Michel, B.
Konferenzbeitrag
2008Mechanism of moisture diffusion, hygroscopic swelling and adhesion degradation in Epoxy Molding Compounds
Shirangi, M.H.; Fan, X.J.; Michel, B.
Konferenzbeitrag