Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array
Kumar, A.; Schulz, M.; Sheva, S.; Keller, J.; Bader, V.; Wöhrmann, M.; Bauer, J.; May, D.; Wunderle, B.
Konferenzbeitrag
2016In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package
Wunderle, B.; May, D.; Abo Ras, M.; Sheva, S.; Schulz, M.; Wöhrmann, M.; Bauer, J.; Keller, J.
Konferenzbeitrag
2014In situ monitoring of interface delamination by the 3ω-method
Schulz, M.; Sheva, S.; Walter, H.; Mroßko, R.; Yang, G.; Keller, J.; Wunderle, B.
Konferenzbeitrag