Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y.
Zeitschriftenaufsatz
2020Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y.
Konferenzbeitrag
2019Parylene based technologies for smart coatings and wearables
Selbmann, F.; Roscher, F.
Zeitschriftenaufsatz
2019Sealing of glass with titanium by glass pressing at the softening point
Winkler, Sebastian; Edelmann, Jan; Günther, Daniel; Wieland, Sebastian; Selbmann, Franz; Baum, Mario; Schubert, Andreas
Zeitschriftenaufsatz
2018Challenges in transferring quantum dot sensitized solar cells on technical textiles
Heinrich, K.; Martin, J.; Mehlhorn, H.; Langenickel, J.; Selbmann, F.; Hartwig, M.; Otto, T.
Konferenzbeitrag
2018Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T.
Konferenzbeitrag
2017Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T.
Konferenzbeitrag
2016Deposition of parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2016A new approach for 3D Integration based on printed multilayers and through polymer vias
Roscher, F.; Saeidi, N.; Enderlein, T.; Selbmann, F.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2016Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications
Selbmann, F.; Baum, M.; Wiemer, M.; Gessner, T.
Konferenzbeitrag
2016Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
Hofmann, L.; Fischer, T.; Werner, T.; Selbmann, F.; Rennau, M.; Ecke, R.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz