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| 2013 | Conductive AFM for CNT characterization
Toader, M.; Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T.; Hietschold, M. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2012 | ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks
Waechtler, T.; Mueller, S.; Fiedler, H.; Melzer, M.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications
Fiedler, H.; Ecke, R.; Hermann, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study
Sommer, J.; Zienert, A.; Gemming, S.; Schuster, J.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Distinguishing between individual contributions to the via resistance in carbon nanotubes based interconnects
Fiedler, H.; Toader, M.; Hermann, S.; Rodriguez, R.D.; Sheremet, E.; Rennau, M.; Schulze, S.; Waechtler, T.; Hietschold, M.; Zahn, D.R.T.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2012 | FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure
Hermann, S.; Schulze, S.; Ecke, R.; Liebig, A.; Schaefer, P.; Zahn, D.R.T.; Albrecht, M.; Hietschold, M.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2012 | Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials
Fischer, T.; Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2012 | A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices
Zimmermann, S.; Ahner, N.; Fischer, T.; Schaller, M.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | A Low Damage Patterning Scheme for Ultra Low-k Dielectrics
Zimmermann, S.; Ahner, N.; Fischer,T.; Oszinda,T.; Uhlig, B.; Schulz, S.E.; Gessner,T. | Zeitschriftenaufsatz |
| 2012 | Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2
Fronk, M.; Müller, S.; Waechtler, T.; Schulz, S.E.; Mothes, R.; Lang, H.; Zahn, D.R.T.; Salvan, G. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2012 | Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Blský, P.; Streiter, R.; Wolf, H.; Schulz, S.E.; Aubel, O.; Gessner, T. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2012 | Nanomechanics oc CNTs for Sensor Simulation
Wagner, C.; Hartmann, S.; Schuster, J.; Wunderle, B.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Nanomechanics of CNTs for sensor application
Wagner, C.; Hartmann, S.; Wunderle, B.; Schuster, J.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Nanoscale optical and electrical characterization of horizontally aligned single-walled carbon nanotubes
Rodriguez, R.D.; Toader, M.; Hermann, S.; Sheremet, E.; Mueller, S.; Gordan, O.D.; Yu, H.; Schulz, S.E.; Hietschold, M.; Zahn, D.R.T. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2012 | Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Konferenzbeitrag |
| 2012 | Optimizing sonication parameters for dispersion of single-walled carbon nanotubes
Yu, H.B.; Hermann, S.; Schulz, S.E.; Gessner, T.; Dong, Z.L.; Li, W.J. | Zeitschriftenaufsatz |
| 2012 | Processes for wafer level integration of carbon nanotubes in electronic and sensor applications
Hermann, S.; Fiedler, H.; Loschek, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Simulation of nanostructures for sensor and circuit applications
Zienert, A.; Wagner, C.; Mohammadzadeh, S.; Schuster, J.; Streiter, R.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Structuring of carbon nanotubes for field emission based movement sensors
Loschek, S.; Hermann, S.; Yu, H.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications
Hermann, S.; Fiedler, H.; Haibo, Y.; Loschek, S.; Bonitz, J.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2011 | ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems
Waechtler, T.; Ding, S.-F.; Hofmann, L.; Mothes, R.; Xie, Q.; Oswald, S.; Detavernier, C.; Schulz, S.E.; Qu, X.-P.; Lang, H.; Gessner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2011 | Electrical property improvements of ultra low-k ILD using a silylation process feasible for process integration
Thomas, O.; Schaller, M.; Gerlich, L.; Fischer, D.; Leppack, S.; Bartsch, C.; Schulz, S.E. | Konferenzbeitrag |
| 2011 | Fabrication and characterisation of CNT via interconnects for application in ULSI circuits
Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2011 | Influence of copper on the catalytic carbon nanotube growth process
Fiedler, H.; Hermann, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2011 | Influence of the additives argon, O-2, C4F8, H-2, N-2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpcke, J.; Schulz, S.E.; Geßner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2011 | Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials
Fischer, T.; Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Konferenzbeitrag |
| 2011 | The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru
Ding, S.-F.; Xie, Q.; Mueller, S.; Waechtler, T.; Lu, H.-S.; Schulz, S.E.; Detavernier, C.; Qu, X.-P.; Gessner, T. | Zeitschriftenaufsatz |
| 2011 | Lewis-base copper(I) formates: Synthesis, reaction chemistry, structural characterization and their use as spin-coating precursors for copper deposition
Tuchscherer, A.; Shen, Y.; Jakob, A.; Mothes, R.; Al-Anber, M.; Walfort, B.; Rüffer, T.; Frühauf, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Lang, H. | Zeitschriftenaufsatz |
| 2011 | Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Belsky, P.; Streiter, R.; Wolf, H.; Schulz, S.E.; Aubel, O.; Gessner, T. | Konferenzbeitrag |
| 2011 | Prediction of wafer homogeneity maps using a virtual metrology scheme consisting of time resolved OES measurements and a neural network
Zimmermann, S.; Reich, R.; Zacher, M.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2011 | Smart systems
Gessner, T.; Vogel, M.; Otto, T.; Schulz, S.E.; Baumann, R. | Konferenzbeitrag |
| 2011 | Thermal ALD of Cu via reduction of CuxO films for the advanced metallization in spintronic and ULSI interconnect systems
Mueller, S.; Waechtler, T.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, F.; Ogiewa, M.; Gerlich, L.; Ding, S.-F.; Schulz, S.E.; Gessner, T.; Lang, H.; Zahn, D.R.T.; Qu, X.-P. | Konferenzbeitrag |
| 2011 | Variable-shaped e-beam lithography enabling process development for future copper damascene technology
Jaschinsky, P.; Erben, J.-W.; Choi, K.-H.; Schulze, K.; Gutsch, M.; Freitag, M.; Schulz, S.E.; Steidel, K.; Hohle, C.; Gessner, T.; Kücher, P. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2010 | Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Rülke, H.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2010 | Carbon nanotubes for nanoscale low temperature flip chip connections
Hermann, S.; Pahl, B.; Ecke, R.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2010 | Chemical Repair of plasma damaged porous ultra low-k SiOCH film using a vapor phase process
Oszinda, T.; Schaller, M.; Schulz, S.E. | Konferenzbeitrag |
| 2010 | How to evaluate surface free energies of dense and ultra low-k dielectrics in pattern structures
Oszinda, T.; Schaller, M.; Dittmar, K.; Jiang, L.; Schulz, S.E. | Konferenzbeitrag |
| 2010 | Inhibition of enhanced Cu oxidation on ruthenium
Ding, S.-F.; Xie, Q.; Waechtler, T.; Lu, H.-S.; Schulz, S.E.; Qu, X.-P. | Konferenzbeitrag |
| 2010 | Integration von Kohlenstoffnanoröhren für MEMS/NEMS Anwendungen
Hermann, S.; Loschek, S.; Haibo, Y.; Bonitz, J.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2010 | Investigation of physical and chemical property changes of ultra low-kappa SiOCH in aspect of cleaning and chemical repair processes
Oszinda, T.; Schaller, M.; Fischer, D.; Walsh, C.; Schulz, S.E. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2010 | Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2010 | Mikro- und Nanotechnologien für Smart Integrated Systems
Gessner, T.; Vogel, M.; Schulz, S.E.; Wiemer, M.; Hiller, K.; Kurth, S. | Zeitschriftenaufsatz |
| 2010 | Neue Materialien und Technologien für Nanoelektronik und Sensorik
Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2010 | Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants
Ahner, N.; Zimmermann, S.; Schaller, M.; Schulz, S.E. | Konferenzbeitrag |
| 2010 | Phosphane copper(I) dicarboxylates: Synthesis and their potential use as precursors for the spin-coating process in the deposition of copper
Jakob, A.; Rüffer, T.; Ecorchard, P.; Walfort, B.; Körbitz, K.; Frühauf, J.; Schulz, S.E.; Gessner, T.; Lang, H. | Konferenzbeitrag |
| 2010 | Phosphite copper(I) trifluoroacetates [((RO)(3)P)(m)CuO2CCF3] (m=1, 2, 3): synthesis, solid state structures and their potential use as CVD precursors
Mothes, R.; Rüffer, T.; Shen, Y.Z.; Jakob, A.; Walfort, B.; Petzold, H.; Schulz, S.E.; Ecke, R.; Gessner, T; Lang, H. | Zeitschriftenaufsatz |
| 2010 | Pulse reverse electroplating for TSV filling in 3D integration
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2009 | Characterization of plasma damaged porous ULK SiCOH layers in aspect of changes in the diffusion behavior of solvents and repair-chemicals
Oszinda, T.; Schaller, M.; Fischer, D.; Schulz, S.E. | Konferenzbeitrag |
| 2009 | Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications
Hermann, S.; Ecke, R.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2009 | Copper oxide ALD from a Cu(I) beta-diketonate: Detailed growth studies on SiO2 and TaN
Wächtler, T.; Roth, N.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Konferenzbeitrag |
| 2009 | Copper oxide ALD from a Cu(I) beta-diketonate: Growth studies and application as seed layers for electrochemical copper deposition
Waechtler, T.; Hofmann, L.; Mothes, R.; Schulze, S.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Abstract, Konferenzbeitrag |
| 2009 | Copper oxide films grown by atomic layer deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2
Waechtler, T.; Oswald, S.; Roth, N.; Jakob, A.; Lang, H.; Ecke, R.; Schulz, S.E.; Gessner, T.; Moskvinova, A.; Schulze, S.; Hietschold, M. | Zeitschriftenaufsatz |
| 2009 | Detailed study of copper oxide ALD on SiO2, TaN, and Ru
Wächtler, T.; Schulze, S.; Hofmann, L.; Hermann, S.; Roth, N.; Schulz, S.E.; Gessner, T.; Lang, H.; Hietschold, M. | Poster |
| 2009 | Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration
Hofmann, L.; Braeuer, J.; Baum, M.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2009 | Improved characterization of Fourier transform infrared spectra analysis for post-etched ultra-low-kappa SiOCH dielectric using chemometric methods
Oszinda, T.; Beyer, V.; Schaller, M.; Fischer, D.; Bartsch, C.; Schulz, S.E. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2009 | Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods
Zimmermann, S.; Ahner, N.; Blaschta, F.; Schaller, M.; Zimmermann, H.; Rülke, H.; Lang, N.; Röpcke, J.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2009 | Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik
Hofmann, L.; Ecke, R.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2009 | Process development for smart systems integration in MEMS
Ecke, R.; Frömel, J.; Schulz, S.E.; Wiemer, M.; Gessner, T. | Zeitschriftenaufsatz |
| 2009 | Restoration of plasma damaged porous ultra low-k SiOCH films: A coating process with UV activation versus a vapor phase process with thermal activation
Oszinda, T.; Schaller, M.; Leppack, S.; Schulz, S.E. | Konferenzbeitrag |
| 2009 | Selective deposition of aligned carbon nanotubes for NEMS applications
Bonitz, J.; Hermann, S.; Loschek, S.; Liu, P.; Schulz, S.E. | Konferenzbeitrag |
| 2009 | Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions
Ahner, N.; Schaller, M.; Bartsch, C.; Baryschpolec, E.; Schulz, S.E. | Konferenzbeitrag |
| 2009 | Surfactants as an additive to wet cleaning solutions for plasma etch residue removal: Compatibility to a porous CVD-SiCOH ultra low-k dielectric material
Ahner, N.; Schulz, S.E.; Zacher, M. | Konferenzbeitrag |
| 2009 | Vom Open Government zur digitalen Agora
Graudenz, D.; Krug, B.; Hoffmann, C.; Schulz, S.E.; Warnecke, T.; Klessmann, J. | Technischer Bericht |
| 2008 | Airgap structures by using sacrificial wet etch: Fabrication, thermal and mechanical behaviour, reliability
Schulze, K.; Schulz, S.E.; Koerner, H.; Gessner, T. | Konferenzbeitrag |
| 2008 | ALD of Copper and Copper Oxide Thin Films for Applications in Metallization Systems of ULSI Devices
Waechtler, T.; Oswald, S.; Roth, N.; Lang, H.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2008 | Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers
Wächtler, T.; Oswald, S.; Pohlers, A.; Schulze, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2008 | Copper(I) Carboxylates of Type [(nBu3P)mCuO2CR] (m = 1, 2, 3) - Synthesis, Properties, and their Use as CVD Precursors
Jakob, A.; Shen, Y.; Wächtler, T.; Schulz, S.E.; Gessner, T.; Riedel, R.; Fasel, C.; Lang, H. | Zeitschriftenaufsatz |
| 2008 | Copper oxide and copper thin films grown by ALD for seed layer applications
Wächtler, T.; Schulz, S.E. | Konferenzbeitrag |
| 2008 | Evaluation of airgap structures produced by wet etch of sacrificial dielectrics: Impact of wet etch media on diffusion barriers, copper, and the Cu/SiC:H interface
Schulze, K.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2008 | Investigation of etch processes of dense and porous low-k dielectrics using OES and QMS as in situ diagnostic methods
Zimmermann, S.; Blaschta, F.; Schaller, M.; Rülke, H.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2008 | Metallization by chemical vapor deposition of W and Cu
Klumpp, A.; Wieland, R.; Ecke, R.; Schulz, S.E. | Aufsatz in Buch |
| 2008 | New precursors for CVD copper metallization
Norman, J.A.T.; Perez, M.; Schulz, S.E.; Wächtler, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | Optical, electrical and structural properties of spin-on MSQ low-k dielectrics over a wide temperature range
Ahner, N.; Schulz, S.E.; Blaschta, F.; Rennau, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | Study of nano-mechanical properties for thin porous films through instrumented indentation: SiO2 low dielectric constant films as an example
Herrmann, M.; Richter, F.; Schulz, S.E. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | 3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology
Wieland, R.; Ecke, R.; Klumpp, A.; Merkel, R.; Schulz, S.E.; Ramm, P. | Konferenzbeitrag |
| 2007 | Achieving ultra low k dielectric constant for nanoelectronics interconnect systems
Schulz, S.E.; Schulze, K. | Konferenzbeitrag |
| 2007 | Atomic layer deposition of copper and copper oxide for applications in microelectronic metallization systems
Waechtler, T.; Schulz, S.E.; Oswald, S.; Gessner, T. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2007 | Characterization of sputtered Ta and TaN films by spectroscopic ellipsometry
Waechtler, T.; Gruska, B.; Zimmermann, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2007 | CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices
Gottfried, K.; Schubert, I.; Schulze, K.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2007 | Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation
Schulze, K.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Impact of dielectric material and metal arrangement on thermal behaviour of interconnect systems
Schulze, K.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2007 | Influence of barrier crystallization on CV characteristics of MIS structures
Ecke, R.; Rennau, M.; Zimmermann, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2007 | Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver
Frühauf, S.; Gessner, T.; Haase, T.; Jakob, A.; Kohse-Hoeinghaus, K.; Lang, H.; Schulz, S.E.; Wächtler, T. | Konferenzbeitrag |
| 2007 | Phosphane copper(I) complexes as CVD precursors
Roth, N.; Jakob, A.; Waechtler, T.; Schulz, S.E.; Gessner, T.; Lang, H. | Konferenzbeitrag |
| 2007 | Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics
Ahner, N.; Schulz, S.E.; Blaschta, F.; Rennau, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure
Iacopi, F.; Beyer, G.; Travaly, Y.; Waldfried, C.; Gage, D.M.; Dauskardt, R.H.; Houthoofd, K.; Jacobs, P.; Adriaensens, P.; Schulze, K.; Schulz, S.E.; List, S.; Carlotti, G. | Zeitschriftenaufsatz |
| 2006 | Cu/barrier CMP on porous low-k based interconnect schemes
Gottfried, K.; Schubert, I.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2005 | The current limits of the laser-acoustic test method to characterize low-k films
Schneider, D.; Frühauf, S.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2005 | Material development for integrated optics, microelectronics and display technology - selected examples
Dreyer, C.; Schneider, J.; Keil, N.; Zawadzki, C.; Yao, H.H.; Schuldt, U.; Schulze, K.; Kahle, O.; Schulz, S.E.; Uhlig, M.; Uhlig, C.; Boeffel, C.; Gessner, T.; Bauer, M. | Konferenzbeitrag |
| 2005 | Novel low-k polycyanurates for integrated circuit (IC) metallization
Schulze, K.; Schuldt, U.; Kahle, O.; Schulz, S.E.; Uhlig, M.; Uhlig, C.; Dreyer, C.; Bauer, M.; Gessner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2005 | Scaling down thickness of ULK materials for 65 nm node and below and its effect on electrical performance
Frühauf, S.; Himcinschi, C.; Rennau, M.; Schulze, K.; Schulz, S.E.; Friedrich, M.; Gessner, T.; Zahn, D.R.T.; Le, Q.T.; Caluwaerts, R. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2004 | Contributions to the static dielectric constant of low-k xerogel films derived from ellipsometry and IR spectroscopy
Himcinschi, C.; Friedrich, M.; Frühauf, S.; Schulz, S.E.; Gessner, T.; Zahn, D.R.T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2004 | Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility
Schulze, K.; Schulz, S.E.; Frühauf, S.; Körner, H.; Seidel, U.; Schneider, D.; Gessner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2003 | CVD TiN layers as diffusion barrier films on porous SiO2 aerogel
Bonitz, J.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2003 | Deposition and treatment of titanium based barrier layers by MOCVD
Ecke, R.; Schulz, S.E.; Gessner, T.; Riedel, S.; Lipp, E.; Eizenberg, M. | Konferenzbeitrag |
| 2003 | Influence of SiH4 on the WN4-PECVD process
Ecke, R.; Schulz, S.E.; Hecker, M.; Mattern, N.; Gessner, T. | Konferenzbeitrag |
| 2003 | Thermal conductivity of ultra low-k dielectrics
Delan, A.; Rennau, M.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2002 | Copper alloy formation and film properties after annealing of Al/Cu stacks in different ambients
Chen, Z.; Richter, K.; Riedel, S.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 2002 | InterChip via technology by using copper for vertical system integration
Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T. | Konferenzbeitrag |
| 2001 | Charakterisierung von CVD-WNx-Schichten als Barriere gegen Kupferdiffusion
Ecke, R.; Richter, K.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2001 | Copper metallization scheme for vertical chip integration
Riedel, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Wieland, R.; Leutenecker, R.; Klumpp, A.; Ramm, P. | Konferenzbeitrag |
| 2001 | Influence of barrier and cap layer deposition on the properties of capped and non-capped porous silicon oxide
Schulz, S.E.; Koerner, H.; Murray, C.; Streiter, I.; Gessner, T. | Zeitschriftenaufsatz |
| 2001 | Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusion
Riedel, S.; Schulz, S.E.; Baumann, J.; Rennau, M.; Gessner, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2001 | Nanoporous dielectric materials for advanced CMOS
Gessner, T.; Bohuslavova, A.; Schulz, S.E. | Konferenzbeitrag |
| 2001 | Neue Dünnschichtmaterialien für die fortgeschrittene Mikroelektronik
Gessner, T.; Schulz, S.E. | Konferenzbeitrag |
| 2000 | Investigation of the plasma treatment in a multistep TiN MOCVD process
Riedel, S.; Schulz, S.E.; Gessner, T. | Zeitschriftenaufsatz |
| 1998 | Morphology and electromigration lifetime of copper lines with different barriers
Schulz, S.E.; Baumann, J.; Weidner, J.-O.; Hasse, W.; Koerner, H.; Gessner, T. | Konferenzbeitrag |