Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021IC package related stress effects on the characteristics of ring oscillator circuits
Schlipf, Simon; Sander, Christoph; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Konferenzbeitrag
2021Piezoresistive characteristics of MOSFET channels determined with indentation
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Zeitschriftenaufsatz
2021Stress-induced transistor degradation studied by an indentation approach
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Zeitschriftenaufsatz
2020Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Wambera, Laura; Meier, Karsten; Zschech, Ehrenfried
Konferenzbeitrag
2019Impact of mechanical strain on 22 nm FDSOI device performance using nanoindentation
Schlipf, Simon; Clausner, André; Paul, Jens; Capecchi, Simone; Kurz, G.; Zschech, Ehrenfried
Konferenzbeitrag
2018Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation
Clausner, André; Schlipf, Simon; Kurz, G.; Otto, M.; Paul, J.; Giering, Kay-Uwe; Warmuth, Jens; Lange, André; Jancke, Roland; Aal, A.; Rosenkranz, Rüdiger; Gall, Martin; Zschech, Ehrenfried
Konferenzbeitrag
2018Prediction of SRAM reliability under mechanical stress induced by harsh environments
Warmuth, Jens; Giering, Kay-Uwe; Lange, André; Clausner, André; Schlipf, Simon; Kurz, Gottfried; Otto, Michael; Paul, Jens; Jancke, Roland; Aal, Andreas; Gall, Martin; Zschech, Ehrenfried
Konferenzbeitrag