Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks
Vereshchagina, E.; Poppe, E.; Schjolberg-Henriksen, K.; Wöhrmann, M.; Moe, S.
Konferenzbeitrag
2015Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
Brand, S.; Tismer, S.; Moe, S.T.; Schjølberg-Henriksen, K.
Zeitschriftenaufsatz
2014Low-temperature bonding technologies for MEMS and 3D-IC
Taklo, M.M.V.; Schjolberg-Henriksen, K.; Malik, N.; Tofteberg, H.R.; Poppe, E.; Vella, D.O.; Borg, J.; Attard, A.; Hajdarevic, Z.; Klumpp, A.; Ramm, P.
Konferenzbeitrag
20103D integration of MEMS and IC: Design, technology and simulations: Advanced processes and materials
Taklo, M.M.V.; Schjolberg-Henriksen, K.; Lietaer, N.; Prainsack, J.; Elfving, A.; Weber, J.; Klein, M.; Schneider, P.; Reitz, S.
Konferenzbeitrag
20103D interconnect technologies for advanced MEMS/NEMS applications
Lietaer, N.; Taklo, M.M.V.; Schjolberg-Henriksen, K.; Ramm, P.
Konferenzbeitrag
2009Miniaturised sensor node for tire pressure monitoring (e-CUBES)
Schjølberg-Henriksen, K.; Taklo, M.M.V.; Lietaer, N.; Prainsack, J.; Dielacher, M.; Klein, M.; Wolf, M.J.; Weber, J.; Ramm, P.; Seppänen, T.
Konferenzbeitrag
2003Semiconductor gas sensor compatibility with CMOS technologies
López-Bosque, M.; Plaza, J.A.; Dantander, J.; Gracia, I.; Cane, C.; Wöllenstein, J.; Moretton, E.; Lambrecht, A.; Schjolberg-Henriksen, K.
Konferenzbeitrag