Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded Contacts
Klengel, R.; Klengel, S.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Konferenzbeitrag
2020Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jaegle, Martin; Klengel, Sandy; Kappert, Holger
Konferenzbeitrag
2019Influence of copper wire material to corrosion resistant packages and systems for high temperature applications
Klengel, S.; Klengel, R.; Schischka, J.; Stephan, T.; Petzold, M.; Eto, M.; Araki, N.; Yamada, T.
Konferenzbeitrag
2016Comparative Reliability Study of Au Wire Bond Contacts on Al Metallization vs. over Pad Metallization
Klengel, R.; Schischka, J.; Berthold, L.; Klengel, S.
Konferenzbeitrag
2016Failure analysis and material characterization in power electronics packaging
Boettge, B.; Schak, M.; Klengel, R.; Schischka, J.; Klengel, S.
Konferenzbeitrag
2014High resolution failure analysis of silver-sintered contact interfaces for power electronics
Boettge, B.; Maerz, B.; Schischka, J.; Klengel, S.; Petzold, M.
Konferenzbeitrag
2014Improvement of nickel wire bonding using Al nano coating
Klengel, R.; Klengel, S.; Schischka, J.; Lorenz, G.; Petzold, M.
Konferenzbeitrag
2014Microstructural study of the fatigue mechanism of aluminum cladded copper wires
Naumann, F.; März, B.; Klengel, R.; Schischka, J.; Petzold, M.
Konferenzbeitrag
2014Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies
Brand, S.; Lapadatu, A.; Djuric, T.; Czurratis, P.; Schischka, J.; Petzold, M.
Zeitschriftenaufsatz
2013Defect analysis using high throughput plasma FIB in packaging reliability investigations
Altmann, F.; Klengel, S.; Schischka, J.; Petzold, M.
Konferenzbeitrag
2013Sample preparation strategies for fast and effective failure analysis of 3D devices
Kwakman, L.; Straw, M.; Coustillier, G.; Sentis, M.; Beyersdorfer, J.; Schischka, J.; Naumann, F.; Altmann, F.
Konferenzbeitrag
2012Cross section analysis of Cu filled TSVs based on high throughput plasma-FIB milling
Altmann, F.; Beyersdorfer, J.; Schischka, J.; Krause, M.; Franz, G.; Kwakman, L.
Konferenzbeitrag
2012Microstructural and mechanical characterization of ceramic substrates with different metallization for power applications
Böttge, B.; Klengel, S.; Schischka, J.; Lorenz, G.; Knoll, H.
Konferenzbeitrag
2012Reliability characterization of heavy wire bonding materials
Naumann, F.; Schischka, J.; Koetter, S.; Milke, E.; Petzold, M.
Konferenzbeitrag
2010Combined electron beam induced current imaging (EBIC) and focused ion beam (FIB) techniques for thin film solar cell characterization
Altmann, F.; Schischka, J.; Ngo, V. van; Stone, S.; Kwakman, L.F.T.; Lehmann, R.
Konferenzbeitrag
2009Characterization of reactive nano scale multilayer foils for microsystem applications
Boettge, B.; Teuscher, N.; Schischka, J.; Krause, M.; Richter, S.; Heilmann, A.; Petzold, M.; Bagdahn, J.
Konferenzbeitrag
2009Tensile testing of individual ultrathin electrospun poly(L-lactic acid) fibers
Jaeger, D.; Schischka, J.; Bagdahn, J.; Jaeger, R.
Zeitschriftenaufsatz
2008Development of a model for simulating stress distributions and transport phenomena in electro-spun scaffolds
Jaeger, D.; Henrichs, B.; Schischka, J.; Bagdahn, J.; Moseler, M.; Jaeger, R.
Konferenzbeitrag
2006A SEM and TEM study of the interconnect microstructure and reliability for a new XFLGA package
Bennemann, S.; Graff, A.; Schischka, J.; Petzold, M.; Theuss, H.; Dangelmaier, J.; Pressel, K.
Konferenzbeitrag
2006Test methods for characterizing the local plastic deformability of bonding wires
Dresbach, C.; Knoll, H.; Schischka, J.; Petzold, M.; Hosseini, K.; Schräpler, L.
Konferenzbeitrag
2005A highly reliable flip chip solution based on electroplated AuSn bumps in a leadless package
Theuss, H.; Pressel, K.; Paulus, S.; Kilger, T.; Dangelmaier, J.; Lehner, R.; Eisener, B.; Kiendl, H.; Schischka, J.; Graff, A.; Petzold, M.
Konferenzbeitrag
2004Bestimmung mechanischer Eigenschaften von Drahtbondkontaktierungen mittels instrumentierter Eindringprüfung
Knoll, H.; Schischka, J.; Petzold, M.
Konferenzbeitrag
2001Strength and fatigue investigations of polycrystalline silicon
Bagdahn, J.; Sharpe, W.N.; Schischka, J.; Petzold, M.
Konferenzbeitrag