Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S.
2013Evaluation of embedded IC approach for automotive application
Schwerz, R.; Meier, K.; Roellig, M.; Schiessl, A.; Schingale, A.; Wolter, K.-J.; Meyendorf, N.
2013Novel quick predict approach for identification of critical loadings in electronic components on PCB under vibration realized as design support tool
Roellig, M.; Metasch, R.; Schingale, A.; Schießl, A.; Meier, K.; Meyendorf, N.