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| 2019 | Affordable and safe high performance vehicle computers with ultra-fast on-board ethernet for automated driving
Hager, M.; Gromala, P.; Wunderle, B.; Rzepka, S. | Konferenzbeitrag |
| 2019 | BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses
Auersperg, J.; Auerswald, E.; Vogel, D.; Rzepka, S. | Konferenzbeitrag |
| 2019 | A Combined Methodology to Include System Effects in Board-Level Stress Simulations
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Döring, R.; Scheiter, L.; Tröger, B.; Zhang, M.J.; Ortmann, R.W. | Konferenzbeitrag |
| 2019 | Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results
Dudek, R.; Kreyssig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Frühauf, P.; Weigert, A. | Konferenzbeitrag |
| 2019 | Concept of the 3rd Generation of Reliability for Electronic Smart Systems
Gromala, P.; Dietz, F.; Rzepka, S.; Han, B. | Konferenzbeitrag |
| 2019 | Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
Otto, A.; Rzepka, S.; Wunderle, B. | Zeitschriftenaufsatz |
| 2019 | Measurements and Simulations of the Creep Strain in Flip Chip Solder Balls
Schindler-Saefkow, F.; Rost, F.; Rzepka, S. | Konferenzbeitrag |
| 2018 | "3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W. | Konferenzbeitrag |
| 2018 | Application-driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Zeitschriftenaufsatz |
| 2018 | Automated virtual prototyping for fastest time-to-market of new system in package solutions
Gadhiya, G.; Brämer, B.; Rzepka, S. | Konferenzbeitrag |
| 2018 | Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W. | Zeitschriftenaufsatz |
| 2018 | Effizienter Modellierungsansatz für die transiente, gekoppelte elektro-thermische Simulation am Beispiel einer D²PAK-Anwendung
Schacht, R.; Rzepka, S. | Konferenzbeitrag |
| 2018 | Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S. | Konferenzbeitrag |
| 2018 | Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices for automotive applications
Otto, A.; Rzepka, S.; Wunderle, B. | Konferenzbeitrag |
| 2018 | Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Zeitschriftenaufsatz |
| 2018 | Long-term thermal fatigue testing of solder joints and related fatigue life predictions
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Schuck, B. | Konferenzbeitrag |
| 2018 | Lotermüdung von SAC- und Innolot-Verbindungen unter Langzeit-Feldbeanspruchungen und vergleichende Simulationen
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Beart, K.; Grübl, W.; Schuch, B. | Konferenzbeitrag |
| 2018 | Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
Albrecht, J.; Weissbach, M.; Auersperg, J.; Rzepka, S. | Konferenzbeitrag |
| 2018 | Multiscale residual stress analysis in thin film layers
Weißbach, M.; Auerswald, E.; Hildebrandt, M.; Rzepka, S. | Konferenzbeitrag |
| 2018 | On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
Auersperg, J.; Albrecht, J.; Rzepka, S. | Konferenzbeitrag |
| 2018 | Reliability testing of integrated low-temperature PVD PZT films
Monteiro Diniz Reis, D.; Rzepka, S.; Hiller, K. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2018 | Stress analyses in HPC-soldered assemblies by optical measurement and FEA
Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S. | Konferenzbeitrag |
| 2018 | Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S. | Konferenzbeitrag |
| 2018 | Transient electro-thermal coupled system simulation
Schacht, R.; Rzepka, S. | Konferenzbeitrag |
| 2017 | Application driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R. | Konferenzbeitrag |
| 2017 | Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W. | Konferenzbeitrag |
| 2017 | Characterization of partial discharge performance of die attach adhesives
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2017 | Development of sensor integration concept for mass production processes
Rost, F.; Arnold, B.; Decker, R.; Bauer, A.; Tsapkolenko, A.; Rzepka, S.; Mehner, J.; Kroll, L. | Konferenzbeitrag |
| 2017 | Effective viscoelastic plastic material modeling for faster and reliable calculations
Schindler-Saefkow, F.; Pantou, R.; Keller, J.; Rzepka, S. | Konferenzbeitrag |
| 2017 | Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S. | Konferenzbeitrag |
| 2017 | Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application
Schacht, R.; Rzepka, S. | Konferenzbeitrag |
| 2017 | FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R. | Konferenzbeitrag |
| 2017 | Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S. | Konferenzbeitrag |
| 2017 | Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration
Rost, F.; Arnold, B.; Decker, R.; Mehner, J.; Kroll, L.; Rzepka, S.; Otto, T. | Konferenzbeitrag |
| 2017 | Reliability investigation on SiC based diode and MOSFET modules developed for high power conversion in medical X-ray applications
Otto, A.; Dudek, R.; Rzepka, S.; Abo Ras, M.; Essen, T. von; Bast, M.; Hindel, A.; Eisele, R.; Mueter, U.; Lunding, A. | Konferenzbeitrag |
| 2017 | Robust design optimization: On methodology and short review
Bektas, E.; Broermann, K.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B. | Konferenzbeitrag |
| 2017 | Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system
Otto, A.; Rzepka, S.; Döring, R.; Scheiter, L.; Armengaud, E. | Konferenzbeitrag |
| 2016 | Analyses of thermo-mechanical reliability issues for power modules designed in planar technology
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Sommer, V.; Mitic, G.; Weidner, K. | Konferenzbeitrag |
| 2016 | Best practice approaches for stress measurements on thin layer stacks
Auerswald, E.; Vogel, D.; Sebastiani, M.; Lord, J.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Brittle fracture and damage in bond pad stacks - a study of parameter influences in coupled XFEM and delamination simulation of nanoindentation
Albrecht, J.; Auersperg, J.; Reuther, G.M.; Kudella, P.W.; Brueckner, J.; Rzepka, S.; Pufall, R. | Konferenzbeitrag |
| 2016 | Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment
Reuther, G.M.; Kudella, P.W.; Albrecht, J.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R. | Konferenzbeitrag |
| 2016 | Electro-thermal-mechanical analyses on stress in silver sintered power modules with different copper interconnection technologies
Dudek, R.; Döring, R.; Hildebrandt, M.; Rzepka, S.; Stegmeier, S.; Kiefl, S. | Konferenzbeitrag |
| 2016 | Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments
Vogel, D.; Auerswald, E.; Gadhiya, G.; Rzepka, S. | Zeitschriftenaufsatz |
| 2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Konferenzbeitrag |
| 2016 | An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Zeitschriftenaufsatz |
| 2016 | Intrinsic stress measurement by FIB ion milling becomes an industrial-strength method
Vogel, D.; Auerswald, E.; Gadhiya, G.; Auersperg, J.; Sebastiani, M.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S. | Zeitschriftenaufsatz |
| 2016 | Master curve synthesis by effective viscoelastic plastic material modeling
Schindler-Saefkow, F.; Pantou, R.; Schlottig, G.; Kumar, S.; Brunschwiler, T.; Keller, J.; Wunderle, B.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components
Rost, F.; Arnold, B.; Vogel, D.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Next generation drivetrain concept featuring self-learning capabilities enabled by extended information technology functionalities
Otto, A.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Processing-structure-property correlations of sintered silver
Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2016 | Reliability assessment of a smart and compact inverter developed for electrically powered construction vehicles
Otto, A.; Gadhiya, G.; Rzepka, S.; Kaulfersch, E.; Hilpert, F.; Brabandt, I. | Konferenzbeitrag |
| 2016 | Reliability assessment of PCB for smart secure applications
Kaulfersch, E.; Albrecht, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2016 | Reliability investigation on SiC BJT power module
Otto, A.; Kaulfersch, E.; Frankeser, S.; Brinkfeldt, K.; Zschieschang, O.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling
Albrecht, J.; Reuther, G.M.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R. | Konferenzbeitrag |
| 2016 | Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit
Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg | Konferenzbeitrag |
| 2015 | Accelerated determination of interfacial fracture toughness in microelectronic packages under cyclic loading
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Konferenzbeitrag |
| 2015 | Effects of board design parameters on failure mechanisms of PCB/BGA assemblies under drop impact
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M. | Konferenzbeitrag |
| 2015 | Evaluation of pattern scale stress effects of 28nm technology during wire bond and Cu pillar flip chip assembly
Kaulfersch, E.; Auersperg, J.; Breuer, D.; Brämer, B.; Rzepka, S. | Konferenzbeitrag |
| 2015 | FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact
Auersperg, J.; Breuer, D.; Machani, K.V; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2015 | FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact
Auersperg, J.; Breuer, D.; Machani, K.V.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2015 | Finite-Elemente-Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen
Dudek, R.; Döring, R.; Rzepka, S.; Seiler, B.; Kreyßig, K. | Konferenzbeitrag |
| 2015 | An improved micromechanical method for investigating the statistical strength of poly-silicon membranes
Brückner, J.; Pfaff, H.; Dehe, A.; Rzepka, S. | Abstract |
| 2015 | An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages
Poshtan, E.A.; Rzepka, S.; Silber, C.; Wunderle, B. | Konferenzbeitrag |
| 2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Konferenzbeitrag |
| 2015 | Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M. | Konferenzbeitrag |
| 2015 | Mechanical characterization of poly-silicon membranes by efficient experimental tests and numerical simulations
Brückner, J.; Auerswald, E.; Vogel, D.; Dudek, R.; Rzepka, S.; Dehe, A. | Konferenzbeitrag |
| 2015 | Mechanical stress induced in Si sensors during bonding and packaging processes
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Miniaturisierte On-Chip Teststrukturen zur Festigkeitsüberwachung von Poly-Silizium
Brückner, J.; Auerswald, E.; Hildebrandt, M.; Vogel, D.; Rzepka, S.; Glacer, C.; Dehe, A. | Konferenzbeitrag |
| 2015 | Parameteridentifikation von Material und Prozessparametern im Package mit Hilfe des Stresschips
Schindler-Saefkow, F.; Rost, F.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification
Merten, E.; Essen, T. von; Luczack, F.; Otto, A.; Lunding, A.; Lürkens, P.; Bast, M.; Abo Ras, M.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Stress measurements on TSVs and BEoL structures with high spatial resolution
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications
Albrecht, J.; Dudek, R.; Auersperg, J.; Pantou, R.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB. A numerical and experimental study
Schacht, R.; Punch, J.; Merten, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag, Poster |
| 2015 | Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
Bayat, P.; Vogel, D.; Rodriguez, R.D.; Sheremet, E.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions - methodology and sample preparation
Poshtan, E.A.; Silber, C.; Rzepka, S.; Michel, B.; Wunderle, B. | Aufsatz in Buch |
| 2014 | An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions
Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B. | Konferenzbeitrag |
| 2014 | Characterization of thermal interface materials (TIM)
Abo Ras, M.; May, D.; Schacht, R.; Wunderle, B.; Winkler, T.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Determination of residual stresses by fib-DAC methodology
Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S. | Aufsatz in Buch |
| 2014 | Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Dudek, R.; Kaulfersch, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Efficiency optimization for a frictionless air flow blade fan – design study
Schacht, R.K.B.; Hausdorf, A.; Wunderle, B.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Experimental and numerical investigation of PCB vibration during drop impact
Tsebo Simo, G.L.; Shirangi, H.; Rzepka, S.; Michel, B.; Nowottnick, M. | Aufsatz in Buch |
| 2014 | Experimental testing of silicon die strength depending on the processing history
Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Improvement of yield and reliability of sub-30 nm structures with finite element analysis in BEOL stress engineering
Kaulfersch, E.; Brämer, B.; Breuer, D.; Rzepka, S.; Clauss, E.; Feustel, F.; Michel, B. | Aufsatz in Buch |
| 2014 | In-situ analysis of an industrial material compound package by means of X-ray micro tomography and digital volume correlation
Haase, S.; Noack, E.; Scheiter, L.; Seiler, B.; Dost, M.; Rzepka, S. | Konferenzbeitrag |
| 2014 | Integrated investigation approach for determining mechanical properties of poly-silicon membranes
Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials
Aboras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
Abo Ras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2014 | Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Miniaturized frictionless fan concept for thermal management of electronics
Schacht, R.; Wunderle, B.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Modelling and testing of mechanical stresses by means of stress chips for the MERGE project
Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | New methodology for lifetime prediction of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Michel, B. | Aufsatz in Buch |
| 2014 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | On the crack and delamination risk optimization towards 3D-IC-integration
Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Parametrisches transientes thermo-elektrisches PSPICE Modell für ein Stromkabel
Schacht, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Reliability investigations for high temperature interconnects
Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | Reliability of new SiC BJT power modules for fully electric vehicles
Otto, A.; Kaulfersch, E.; Brinkfeldt, K.; Neumaier, K.; Zschieschang, O.; Andersson, D.; Rzepka, S. | Konferenzbeitrag |
| 2014 | Solder fatigue acceleration prediction and testing results for different thermal test- and field cycling environments
Dudek, R.; Hildebrandt, M.; Doering, R.; Rzepka, S.; Trageser, H.; Kohl, R.; Wang, C. | Konferenzbeitrag |
| 2014 | Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation
Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A. | Konferenzbeitrag |
| 2014 | Strategies for responding to the reliability challenges of future smart systems
Rzepka, S.; Andersson, D.; Vandevelde, B. | Konferenzbeitrag |
| 2014 | Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2014 | Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Bayat, Parisa; Vogel, D.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Stress chip measurements during temperature cycling test
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Michel, B.; Rzepka, S. | Aufsatz in Buch |
| 2014 | Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | Stress measurements at through silicon vias
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Thermal characterization of highly conductive die attach materials
Abo Ras, M.; May, D.; Winkler, T.; Michel, B.; Rzepka, S.; Wunderle, B. | Konferenzbeitrag |
| 2014 | Thermo-mechanical behavior and reliability issues for high temperature interconnections
Dudek, R.; Sommer, P.; Döring, R.; Herberholz, T.; Fix, A.; Seiler, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Advantage and current limitations of advanced fracture mechanics for 3D-integration and BEoL under CPI aspects
Auersperg, J.; Dudek, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Clean Sky European Technology Demonstration for greener Aviation
Kaulfersch, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | COSIVU Compact, Smart and Reliable Drive Unit for Fully Electric Vehicles
Rzepka, S.; Otto, A. | Konferenzbeitrag |
| 2013 | Development and fabrication of thin film thermo test chip and its integration into a test system for thermal interface characterization
Abo Ras, M.; Engelmann, G.; May, D.; Rothermund, M.; Schacht, R.; Wunderle, B.; Winkler, T.; Michel, B.; Oppermann, H.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Effect of moisture swelling on MEMS packaging and integrated sensors
Keller, J.; Mrossko, R.; Dobrinski, H.; Stürmann, J.; Döring, R.; Dudek, R.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2013 | Experimental Analysis of Mechanical Stresses and Material Properties in Multi-Layer Interconnect Systems by fibDAC
Vogel, D.; Auerswald, E.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Finite Element Analysis for BEOL Stress Engineering to Improve Yield and Reliability of sub-30 nm Structures
Kaulfersch, E.; Braemer, B.; Rzepka, S.; Breuer, D.; Cluass, E.; Feustel, F. | Konferenzbeitrag |
| 2013 | Investigation of the failure mode formation in BGA components subjected to JEDEC drop test
Kraemer, F.; Wiese, S.; Rzepka, S.; Lienig, J. | Konferenzbeitrag |
| 2013 | Kombinierte Zuverlässigkeitstests für die Elektromobilität
Otto, A.; Matkowski, P.; Winkler, T.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Measuring techniques for deformation and stress analysis in micro-dimensions
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers
Roschner, F.; Otto, A.; Döring, R.; Ihle, M.; Ziesche, S.; Rzepka, S.; Wiemer, M. | Konferenzbeitrag |
| 2013 | New Reliability Testing Methods for Electromobility Applications
Otto, A.; Matkowski, P.; Brabandt, I.; Winkler, T.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | New Test Bench for Active Power Cycling Tests
Otto, A.; Vohra, A.; Rzepka, S. | Konferenzbeitrag |
| 2013 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Package Characterization with Stress Chip Measurements for Health Monitoring
Rost, F.; Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Parametric transient thermo-electrical PSPICE model for a power cable
Schacht, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Reliability Investigations for High Temperature Interconnects
Dudek, R.; Sommer, J.-P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Reliability issues for high temperature interconnections based on transient liquid phase soldering
Dudek, R.; Sommer, P.; Fix, A.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Review of experimental strength testing methods for Silicon dies
Brueckner, J.; Auerswald, E.; Dudek, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Strain and Stress Measurement for Reliability Analyses in Small Material Volumes. Invited plenary presentation
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J. | Konferenzbeitrag |
| 2013 | Stress impact of thermal-mechanical loads measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Winkler, T.; Wunderle, B.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Stress Measurement in Thin Multilayer Systems by Stress Relief
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Toolbox for visco-elastic material modeling of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Brabandt, I.; Michel, B. | Konferenzbeitrag |
| 2013 | Unterstützung von Haftfestigkeitsuntersuchungen am Interface zwischen Barriere und Dielektrikum FE-Simulation des 4-Punkt-Biegeversuches
Braemer, B.; Hartwig, I.; Auersperg, J.; Hecker, M.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | Battery management network for fully electrical vehicles featuring smart systems at cell and pack level
Otto, A.; Rzepka, S.; Mager, T.; Michel, B.; Lanciotti, C.; Günther, T.; Kanoun, O. | Konferenzbeitrag |
| 2012 | Delamination modeling for power packages by the cohesive zone approach
Dudek, R.; Doering, R.; Pufall, R.; Kanert, W.; Seiler, B.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package
Poshtan, E.A.; Rzepka, S.; Wunderle, B.; Silber, C.; Bargen, T. von; Michel, B. | Konferenzbeitrag |
| 2012 | FEM stress analysis in BGA components subjected to JEDEC drop test applying high strain rate lead-free solder material models
Kraemer, F.; Meier, K.; Wiese, S.; Rzepka, S. | Konferenzbeitrag |
| 2012 | Health Monitoring durch In-situ Messung der Eigenspannungen im Package
Rost, F.; Schindler-Saefkow, F.; Schulz, M.; Otto, A.; Rzepka, S. | Konferenzbeitrag |
| 2012 | Hochgenaue Bestimmung mechanischer Spannungen in Elektronik- und MEMS-Komponenten durch ein Stressmesschip
Schindler-Saefkow, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2012 | Humidity effects on the fatigue of fiber reinforced polymers in micro/nano functional systems
Pantou, R.; Shah, D.L.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2012 | Local deformation and stress analysis in the micro-nano interface regions
Vogel, D.; Auerswald, E.; Dudek, R.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | Nonlinear copper behavior of TSV and the cracking risks during BEoL-built-up for 3D-IC-integration
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | Novel architecture for battery management systems in fully electrical cars
Rzepka, S.; Otto, A.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2012 | Quantitative determination of the mechanical stresses in BEoL films and structures on Si wafers with sub-micron spatial resolution by fibDAC
Rzepka, S.; Vogel, D.; Auerswald, E.; Michel, B. | Konferenzbeitrag |
| 2012 | Stress chip measurements of the internal package stress for process characterization and health monitoring
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2011 | Accelerated fatigue testing methodology for reliability assessments of fiber reinforced composite polymer materials in micro/nano systems
Rzepka, S.; Walter, H.; Pantou, R.; Freed, Y.; Michel, B. | Konferenzbeitrag |
| 2011 | Aspects of chip/package interaction and 3-D integration assessed by the investigation of crack and damage phenomena in low-k BEoL stacks
Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2011 | Correlation based local measurement of small CTE for high temperature power electronics packaging
Hammacher, J.; Dost, M.; Seiler, B.; Scheiter, L.; Noack, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2011 | DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Rzepka, S.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2011 | An implementation of an accelerated testing methodology to obtain static, creep and fatigue master curves of a T300/913 unidirectional composite material
Freed, Y.; Rzepka, S. | Konferenzbeitrag |
| 2011 | Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
Vogel, D.; Rzepka, S.; Michel, B.; Gollhardt, A. | Konferenzbeitrag |
| 2011 | Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2010 | BGA lifetime prediction in JEDEC drop tests accounting for copper trace routing effects
Kraemer, F.; Wiese, S.; Rzepka, S.; Lienig, J. | Konferenzbeitrag |
| 2010 | A detailed investigation of the failure formation of copper trace cracks during drop tests
Kraemer, F.; Wiese, S.; Rzepka, S.; Faust, W.; Lienig, J. | Konferenzbeitrag |
| 2010 | DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2010 | The effect of copper trace routing on the drop test reliability of BGA modules
Kraemer, F.; Rzepka, S.; Wiese, S.; Lienig, J. | Konferenzbeitrag |
| 2010 | An integrated experimental and theoretical approach to evaluate Si strength dependent on the processing history
Brueckner, J.; Dudek, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2010 | Realistic stress representation in 2nd level interconnections of productive BGA components during drop test simulations
Kraemer, F.; Rzepka, S.; Wiese, S.; Lienig, J. | Konferenzbeitrag |
| 2010 | Virtual prototyping advanced by statistic and stochastic methodologies
Rzepka, S.; Müller, A.; Michel, B. | Konferenzbeitrag |
| 2009 | Accelerating the temperature cycling tests of FBGA memory components with lead-free solder joints without changing the damage mechanism
Reichelt, J.; Gromala, P.; Rzepka, S. | Konferenzbeitrag |
| 2009 | Accurate thermal cycle lifetime estimation for BGA memory components with lead-free solder joints
Gromala, P.; Reichelt, J.; Rzepka, S. | Konferenzbeitrag |
| 2009 | Comprehensive material characterization of organic packaging materials
Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J. | Konferenzbeitrag |
| 2009 | Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components
Falat, T.; Jansen, K.M.B.; Vreugd, J. de; Rzepka, S. | Konferenzbeitrag |
| 2009 | Lifetime modeling for JEDEC drop tests
Krämer, F.; Rzepka, S.; Lienig, J. | Konferenzbeitrag |
| 2009 | Modeling, simulation and calibration of the chip encapsulation molding process
Roellig, M.; Meyer, S.; Thiele, M.; Rzepka, S.; Wolter, K.J. | Konferenzbeitrag |
| 2009 | Thermo mechanical characterization of packaging polymers
Boehme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.J. | Konferenzbeitrag |
| 2009 | Thermo-mechanical reliability assessment for 3D through-Si stacking
Dudek, R.; Brämer, B.; Irsigler, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2009 | Virtual prototyping in microelectronics and packaging
Rzepka, S.; Dudek, R.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2008 | FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings
Dudek, R.; Kaulfersch, E.; Rzepka, S.; Röllig, M.; Michel, B. | Konferenzbeitrag |
| 2007 | Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B. | Konferenzbeitrag |
| 2007 | The Effect of Visco-elasticity on the Result Accuracy of FEM Panel Warpage Simulations Supporting Industrial Microelectronics Packaging
Rzepka, S.; Müller, A. | Konferenzbeitrag |
| 2007 | Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B. | Konferenzbeitrag |
| 2006 | Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B. | Konferenzbeitrag |