Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board
Sewergin, Alexander; Rittner, Martin; Burghardt, Andreas; Kriegel, Kai; Mitic, Gerhard; Zetterer, Thomas; Hutsch, Thomas; Neumann, Albert; Simon, Flaviu-Bogdan; Doncker, Rik W. de
Konferenzbeitrag
2020Power Cycling of SiC-MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination
Wagner, F.; Reber, G.; Rittner, M.; Guyenot, M.; Nitzsche, M.; Wunderle, B.
Konferenzbeitrag
2016Coupled electro-thermo-mechanical analyses on power cycling induced loadings in sintered silver IGBT-modules with and without overmolding
Dudek, R.; Döring, R.; Rzepka, S.; Stegmeier, S.; Ehrhardt, C.; Rittner, M.; Rudzki, J.
Konferenzbeitrag
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects
Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Konferenzbeitrag
2015Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects
Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.
Konferenzbeitrag
2010Knowledge matrix for power electronics - the approach of the ZVEI working group 'High Temperature and Power Electronics'
Rittner, M.; Roth, A.
Konferenzbeitrag
2006Untersuchung der Zuverlässigkeit hochtemperaturgeeigneter Baugruppen
Pape, U.; Nowottnick, M.; Rittner, M.; Neher, W.
Konferenzbeitrag