Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Zeitschriftenaufsatz, Konferenzbeitrag
2011Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Konferenzbeitrag
2011High channel-count neural interfaces for multiple degree-of-freedom neuroprosthetics
Rieth, L.; Franklin, R.; Tathireddy, P.; Sharma, R.; Williams, L.; Tenore, F.; Merugu, S.; Rothermund, M.; Jaeger, D.; Töpper, M.; Oppermann, H.; Harrison, R.; Solzbacher, F.
Konferenzbeitrag
2011Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Zeitschriftenaufsatz
2009Integrated wireless neural interface based on the Utah electrode array
Kim, S.; Bhandari, R.; Klein, M.; Negi, S.; Rieth, L.; Tathireddy, P.; Töpper, M.; Oppermann, H.; Solzbacher, F.
Zeitschriftenaufsatz
2008Effect of thermal and deposition processes on surface morphology, crystallinity, and adhesion of Parylene-C
Hsu, J.-M.; Rieth, L.; Kammer, S.; Orthner, M.; Solzbacher, F.
Zeitschriftenaufsatz
2007Characterization of a-SiCx:H thin films as an encapsulation material for integrated silicon based neural interface devices
Hsu, J.-M.; Tathireddy, P.; Rieth, L.; Normann, A.R.; Solzbacher, F.
Zeitschriftenaufsatz
2007Characterization of parylene-C film as an encapsulation material for neural interface devices
Hsu, J.-M.; Rieth, L.; Kammer, S.; Jung, E.; Norman, A.R.; Solzbacher, F.
Konferenzbeitrag
2007System integration of the utah electrode array using a biocompatible flip chip under bump metallization scheme
Bhandari, R.; Negi, S.; Rieth, L.; Toepper, M.; Kim, S.; Klein, M.; Oppermann, H.; Normann, R.A.; Solzbacher, F.
Konferenzbeitrag
2007Wafer level processing of silicon arrays for implantable medical devices
Bhandari, R.; Negi, S.; Rieth, L.; Töpper, M.; Normann, R.A.; Solzbacher, F.
Konferenzbeitrag
2006Biocompatible hybrid system integration of silicon based neural interface devices
Tathireddy, P.; Chakravarthy, S.; Hsu, J.; Klein, M.; Oppermann, H.; Rieth, L.; Harrison, R.; Normann, R.A.; Solzbacher, F.
Konferenzbeitrag