Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Determining adhesion of critical interfaces in microelectronics - A reverse Finite Element Modelling approach based on nanoindentation. Part I
Reuther, G.M.; Albrecht, J.; Pufall, R.; Dudek, R.; Rzepka, S.
Konferenzbeitrag
2018Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, R.; Goroll, M.; Reuther, G.M.; Pflügler, N.; Udiljak, D.; Dudek, R.
Konferenzbeitrag
2016Brittle fracture and damage in bond pad stacks - a study of parameter influences in coupled XFEM and delamination simulation of nanoindentation
Albrecht, J.; Auersperg, J.; Reuther, G.M.; Kudella, P.W.; Brueckner, J.; Rzepka, S.; Pufall, R.
Konferenzbeitrag
2016Brittle fracture and damage in bond pad stacks: Novel approaches for simulation-based risk assessment
Reuther, G.M.; Kudella, P.W.; Albrecht, J.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R.
Konferenzbeitrag
2016Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling
Albrecht, J.; Reuther, G.M.; Brueckner, J.; Auersperg, J.; Rzepka, S.; Pufall, R.
Konferenzbeitrag