Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Zeitschriftenaufsatz
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2015Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
Ndip, I.; Oz, A.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Zeitschriftenaufsatz
2014A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H.
Zeitschriftenaufsatz
2014On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H.
Konferenzbeitrag
2013Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications
Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.
Konferenzbeitrag, Zeitschriftenaufsatz
2013Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2013Modeling and minimizing the inductance of bond wire interconnects
Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Konferenzbeitrag
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Konferenzbeitrag
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Zeitschriftenaufsatz
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012Loss modeling in non-ideal transmission lines for optimal signal integrity
Curran, B.
: Reichl, H.
Dissertation
2012Modelling the shape, length and radiation characteristics of bond wire antennas
Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2012Systematic design and optimization of bond wire antennas using the M3-approach
Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.
Konferenzbeitrag
2012A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics
Krueger, Michael; Middendorf, Andreas; Nissen, Nils F.; Reichl, Herbert; Lang, Klaus-Dieter
Konferenzbeitrag
2011Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Konferenzbeitrag
2011Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications
Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.
Konferenzbeitrag
2011Efficient integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.
: Reichl, H. (Prüfer)
Dissertation
2011Effiziente Verifikation der Robustheit komplexer integrierter Schaltungen
Morgenstern, H.
: Reichl, H. (Prüfer)
Dissertation
2011Electromigration in electroplated gold micro contacts
Kleff, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Konferenzbeitrag
2011Entwicklung und Design von selbstatmenden Mikrobrennstoffzellen fur autarke Sensoren mit pulsformiger Last
Weiland, M.; Reichl, H.; Wagner, S.; Hahn, R.
Konferenzbeitrag
2011High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes
Ndip, I.; Curran, B.; Lobbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2011The impact of moisture absorption on the electrical characteristics of organic dielectric materials
Curran, B.; Ndip, I.; Bauer, J.; Guttowski, S.; Lang, K.D.; Reichl, H.
Konferenzbeitrag
2011Influences of current collector foils with different opening ratios in passive polymer electrolyte membrane fuel cells
Krumbholz, S.; Kaiser, J.; Weiland, M.; Hahn, R.; Reichl, H.
Zeitschriftenaufsatz
2011Integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D.
Zeitschriftenaufsatz
2011Interface formation in the US-wedge/wedge-bond process of AlSi1/CuNiAu contacts
Geissler, U.; Funck, J.; Schneider-Ramelow, M.; Engelmann, H.-J.; Rooch, I.; Müller, W.H.; Reichl, H.
Zeitschriftenaufsatz
2011Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2011Prospects and limits in wafer-level-packaging of image sensors
Wilke, M.; Wippermann, F.; Zoschke, K.; Toepper, M.; Ehrmann, O.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Zeitschriftenaufsatz
2011Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
Schreier-Alt, T.; Rehme, F.; Ansorge, F.; Reichl, H.
Zeitschriftenaufsatz
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.
Konferenzbeitrag
2010An adapted filament model for accurate modeling of printed coplanar lines with significant surface roughness and proximity effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Zeitschriftenaufsatz
2010Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.
Konferenzbeitrag
2010Analysis of the transient characteristics of a passive micro fuel cell for sensor applications
Weiland, M.; Reichl, H.; Wagner, S.
Konferenzbeitrag
2010Analytic model verification of the interfacial friction power in Al us w/w bonding on Au pads
Gaul, H.; Schneider-Ramelow, M.; Reichl, H.
Zeitschriftenaufsatz
2010Chip embedding technology developments leading to the emergence of miniaturized system-in-packages
Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2010A comparison of thin film polymers for wafer level packaging
Töpper, M.; Fischer, T.; Baumgartner, T.; Reichl, H.
Konferenzbeitrag
2010Contactless handling and precision positioning of smallest components for assembly of microelectronics
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Jung, E.; Koch, M.; Mollath, G.; Aschenbrenner, R.; Reichl, H.
Konferenzbeitrag
2010Contactless material deposition by jetting for heterogeneous system integration
Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.
Konferenzbeitrag
2010Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
Wolf, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Patent
2010Embedding of electronic and system in package using added manufacturing technologies
Ansorge, F.; Stigler, T.; Heumann, K.; Ifland, D.; Reichl, H.
Konferenzbeitrag
2010Embedding of electronic and system in package using generative processes
Ansorge, F.; Heumann, K.; Ifland, D.; Reichl, H.
Konferenzbeitrag
2010Employing solder joints of concave shape for monitoring electromigration independently of material interfaces
Jaeschke, J.; Müller, W.H.; Nissen, N.; Reichl, H.
Konferenzbeitrag
2010Equivalent circuit modeling of signal vias considering their return current paths
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2010Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.
Konferenzbeitrag
2010Future perspectives: From packaging to system integration
Wolf, M.J.; Reichl, H.; Lang, K.-D.
Aufsatz in Buch
2010Generative Herstelltechnologien im Mikro- und Nanobereich zu Aufbau und Kontaktierung von Mikro-Mechatronischen Systemen
Ansorge, F.; Stigler, T.; Heumann, K.; Ifland, D.; Reichl, H.
Konferenzbeitrag
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2010Heat-removal performance scaling of interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Cesar, W.; Leblebici, Y.; Wunderle, B.; Reichl, H.
Konferenzbeitrag
2010Hermeticity of eutectic bond layers for sensor packages on wafer-level
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Konferenzbeitrag
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2010Intermodulation Distortion as Indicator for Interconnect Degradation
Krüger, M.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2010Investigation of the solder joint fatigue life in combined vibration and thermal cycling tests
Eckert, T.; Krüger, M.; Müller, W.H.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2010Large area embedding for heterogeneous system integration
Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U.
Konferenzbeitrag