Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Fine-Pitch 3D Stacking Technologies for High-performance Heterogeneous Integration and Chiplet-based Architectures
Ramm, Peter; Badaroglu, Mustafa; Franzon, Paul; Garrou, Phil; Vivet, Pascal
Aufsatz in Buch
2021Heterogeneous integration and chiplet assembly - all between 2D and 3D
Ramm, Peter; Franzon, Paul; Garrou, Philip; Swaminathan, Raja; Vivet, Pascal; Badaroglu, Mustafa
Zeitschriftenaufsatz
20203DIC: Past, Present and Future - a European Perspective
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Braun, Tanja; Vivet, Pascal; Engelhard, Manfred
Vortrag, Audiovisuelles Material
2020Review - Energy Autonomous Wearable Sensors for Smart Healthcare: A Review
Dahiya, A.S.; Thireau, J.; Boudaden, J.; Lal, S.; Gulzar, U.; Zhang, Y.; Gil, T.; Azemard, N.; Ramm, P.; Kiessling, T.; O'Murchu, C.; Sebelius, F.; Tilly, J.; Glynn, C.; Geary, S.; O'Dwyer, C.; Razeeb, K.M.; Lacampagne, A.; Charlot, B.; Todri-Sanial, A.
Zeitschriftenaufsatz
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Konferenzbeitrag
2019Fraunhofer's Initial and Ongoing Contributions to 3D IC Integration
Ramm, Peter; Klumpp, Armin; Landesberger, Christof; Weber, Josef; Heinig, Andy; Schneider, Peter; Elst, Guenter; Engelhardt, Manfred
Vortrag
2019Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits
Franzon, Paul D.; Marinissen, Erik Jan; Bakir, Muhannad S.; Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Buch
2019Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Aufsatz in Buch
20183D integration processes for advanced sensor systems and high-performance RF components
Weber, Josef; Fernandez-Bolanos, Montserrat; Ionescu, Adrian; Ramm, Peter
Konferenzbeitrag
2018Advanced sensor systems by low-temperature heterogeneous 3D integration processes
Fernandez-Bolanos, Montserrat; Muller, Andrei; Weber, Josef; Ramm, Peter
Konferenzbeitrag
2018Vision 2030 - Flagship Proposal Health-EU
Ramm, Peter; Bose, Indranil; Kutter, Christoph
Vortrag
2017The Advancement of Device Packaging - A Resume on IMAPS DPC 2017
Ramm, Peter; Poupon, Gilles; Couderc, Pascal; Leitgeb, Markus; Taklo, Maaike M.V.
Zeitschriftenaufsatz
2017Highly integrated chips
Ramm, P.; Weber, J.
Zeitschriftenaufsatz
2017Low-temperature 3D integration processes for advanced sensor systems
Ramm, P.; Fernandez-Bolanos, M.; Weber, J.
Vortrag
20163D TSV based high frequency components for RF IC and RF MEMS applications
Fernandez-Bolanos, M.; Vitale, W.A.; López, M.M.; Ionescu, A.M.; Klumpp, A.; Merkel, R.; Weber, J.; Ramm, P.; Ocket, I.; Raedt, W. de; Enayati, A.
Konferenzbeitrag
2015Current and future 3D activities at Fraunhofer
Heinig, A.; Chaudhary, M.W.; Schneider, P.; Ramm, P.; Weber, J.
Konferenzbeitrag
2015The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems
Ramm, P.; Klumpp, A.; Weber, J.; Mathewson, A.; Razeeb, K.M.; Pufall, R.
Konferenzbeitrag
2015Fine pitch 3D-TSV based high frequency components of RF MEMS applications
Vitale, W.A.; Fernandez-Bolanos, M.; Merkel, R.; Enayati, A.; Ocker, I.; Raedt, W. de; Weber, J.; Ramm, P.; Ionescu, A.M.
Konferenzbeitrag
2015Ultra fine-pitch TSV technology for ultra-dense high-Q RF inductors
Vitale, W.A.; Fernandez-Bolanos, M.; Klumpp, A.; Weber, J.; Ramm, P.; Ionescu, A.M.
Konferenzbeitrag
20143D heterogeneous system integration
Ramm, Peter; Schneider, Peter; Dal Molin, Renzo
Zeitschriftenaufsatz
20143D IC Integration Since 2008
Garrou, P.; Ramm, P.; Koyanagi, M.
Aufsatz in Buch
2014Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R.
Konferenzbeitrag
2014Handbook of 3D integration. Vol.3
: Garrou, P.; Koyanagi, M.; Ramm, P.
Buch
2014Key Applications and Market Trends for 3D Integration and Interposer Technologies
Beica, R.; Eloy, J.-C.; Ramm, P.
Aufsatz in Buch
2014Low-temperature bonding technologies for MEMS and 3D-IC
Taklo, M.M.V.; Schjolberg-Henriksen, K.; Malik, N.; Tofteberg, H.R.; Poppe, E.; Vella, D.O.; Borg, J.; Attard, A.; Hajdarevic, Z.; Klumpp, A.; Ramm, P.
Konferenzbeitrag
2014Overview of Bonding and Assembly for 3D Integration
Lu, J.J.-Q.; Zhang, D.; Ramm, P.
Aufsatz in Buch
2014Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
Zschenderlein, U.; Vogel, D.; Auerswald, E.; Hölck, O.; Rajendran, H.; Ramm, P.; Pufall, R.; Wunderle, B.
Konferenzbeitrag
2014Technology, simulation and design for 3D integrated heterogeneous sensor systems
Schneider, Peter; Heinig, Andy; Bayer, Christian; Ramm, Peter; Dal Molin, Renzo; Fleischer, Maximilian
Konferenzbeitrag
2013The common ground of interposer and 3D integration technology - hand in hand to face production concerns?
Ramm, P.
Zeitschriftenaufsatz
2012Handbook of wafer bonding
: Ramm, P.; Lu, J.J.-Q.; Taklo, M.M.V.
Buch
2012Temporary adhesive bonding with reconfiguration of known good dies for three-dimensional integrated systems
Klumpp, A.; Ramm, P.
Aufsatz in Buch
2012Three-Dimensional Integration
Garrou, P.; Lu, J.J.-Q.; Ramm, P.
Aufsatz in Buch
2012Verfahren zur Herstellung eines Chips
Klumpp, Armin; Ramm, Peter
Patent
2011Characterization and failure analysis of 3D integrated systems using a novel plasma-FIB system
Kwakman, L.; Franz, G.; Taklo, M.M.V.; Klumpp, A.; Ramm, P.
Konferenzbeitrag
2011Failure analysis and reliability of 3D integrated systems
Ramm, P.; Klumpp, A.; Franz, G.; Kwakman, L.
Konferenzbeitrag
2011Reliability testing and failure analysis of 3D integrated systems
Klumpp, A.; Ramm, P.; Franz, G.; Rue, C.; Kwakman, L.
Konferenzbeitrag
20103D integration technology: Status and application development
Ramm, P.; Klumpp, A.; Weber, J.; Lietaer, N.; Taklo, M.; Raedt, W. de; Fritzsch, T.; Couderc, P.
Konferenzbeitrag
20103D interconnect technologies for advanced MEMS/NEMS applications
Lietaer, N.; Taklo, M.M.V.; Schjolberg-Henriksen, K.; Ramm, P.
Konferenzbeitrag
20103D System-on-Chip technologies for More than Moore systems
Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.
Zeitschriftenaufsatz
20103D-integration of silicon devices: A key technology for sophisticated products
Klumpp, A.; Ramm, P.; Wieland, R.
Konferenzbeitrag
2010Enabling technologies for 3D integration
Klumpp, A.; Ramm, P.
Aufsatz in Buch
2010The European 3D technology platform (e-CUBES)
Ramm, P.; Lietaer, N.; Raedt, W. de; Fritzsch, T.; Hilt, T.; Couderc, P.; Val, C.; Mathewson, A.; Razeeb, K.M.; Stam, F.; Klumpp, A.; Weber, J.; Taklo, M.
Zeitschriftenaufsatz
2010High performance 3D interconnects based on electrochemical etch and liquid metal fill
Hedler, H.; Scheiter, T.; Schieber, M.; Klumpp, A.; Ramm, P.
Konferenzbeitrag
2010IEEE 3D System Integration Conference 2010 (3DIC)
Ramm, P.; Beyne, E.
Konferenzbeitrag
2010Miniaturization of a wireless sensor node by means of 3D interconnects
Prainsack, J.; Stolle, J.; Weber, J.; Dielacher, M.; Flatscher, M.; Herndl, T.; Matischek, R.; Ramm, P.; Weber, W.
Konferenzbeitrag
2010Processing, materials, and integration of damascene and 3D interconnects: Preface
Flake, J.; Ritzdorf, T.; Koyangi, M.; Leonte, O.; Mathad, G.S.; Ramm, P.; Rathore, H.S.; Roozeboom, F.
Konferenzbeitrag
2010Reliability of through silicon via technologies
Klumpp, A.; Ramm, P.
Konferenzbeitrag
2010Welcome to the IEEE International: 3D system integration conference (3DIC)
Ramm, P.; Beyne, E.
Konferenzbeitrag
20093D integration technologies
Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.
Konferenzbeitrag
20093D integration technologies for MEMS/IC systems
Ramm, P.; Klumpp, A.; Weber, J.
Konferenzbeitrag
20093D integration technologies for miniaturized Tire Pressure Monitor System (TPMS)
Lietaer, N.; Taklo, M.M.V.; Klumpp, A.; Weber, J.; Ramm, P.
Konferenzbeitrag
20093D MEMS and IC integration
Taklo, M.M.V.; Lietaer, N.; Tofteberg, H.R.; Seppanen, T.; Prainsack, J.; Weber, J.; Ramm, P.
Konferenzbeitrag
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Konferenzbeitrag
20093D stacked MEMS and ICs in a miniaturized sensor node
Taklo, M.M.V.; Lietaer, N.; Tofteberg, H.; Seppänen, T.; Ramm, P.; Weber, W.
Konferenzbeitrag
2009Design support for 3D system integration by multi physics simulation
Schneider, P.; Reitz, S.; Stolle, J.; Martin, R.; Wilde, A.; Ramm, P.; Weber, J.
Konferenzbeitrag
2009Electrostatic carrier technique for thin wafer processing
Landesberger, C.; Wieland, R.; Ramm, P.; Bock, K.
Zeitschriftenaufsatz
2009Electrostatic wafer handling for thin wafer processing
Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K.
Konferenzbeitrag
2009Miniaturised sensor node for tire pressure monitoring (e-CUBES)
Schjølberg-Henriksen, K.; Taklo, M.M.V.; Lietaer, N.; Prainsack, J.; Dielacher, M.; Klein, M.; Wolf, M.J.; Weber, J.; Ramm, P.; Seppänen, T.
Konferenzbeitrag