Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019SAM3: New failure analysis methods for heterogeneous systems
Schweinböck, T.; Pressel, K.; Altmann, F.; Hoffrogge, P.; Grimm, M.; Keiper, B.
Konferenzbeitrag
2017Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B.
Zeitschriftenaufsatz
2016Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2015Characteristics and process stability of complete electrical interconnection structures for a low cost interposer technology
Dittrich, Michael; Steinhardt, Alexander; Heinig, Andy; Wojnowski, M.; Pressel, K.; Wolf, Jürgen
Konferenzbeitrag
2015Thermo-Mechanical characterization and reliability modelling of sintered silver based thermal interface materials
Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2014Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials
Heilmann, J.; Nikitin, I.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2014Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration
Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen
Konferenzbeitrag
2013Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Konferenzbeitrag
2013JEMSIP 3D. Major results & achievements from the project and exploitation thereof in future products
Wolf, M.J.; Kapitza, H.; Pressel, K.; Perrocheau, J.; Maquille, Y. de; Kwakman, L.F.T.; Rouzaud, A.
Konferenzbeitrag
2013Reliability of advanced thermal interface technologies based on sintered die-attach materials
Heilmann, J.; Nikitin, I.; May, D.; Pressel, K.; Wunderle, B.
Konferenzbeitrag
2013Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Konferenzbeitrag
2012High resolution analyzes of resistance behavior in eWLB metal contacts
Klengel, S.; Krause, M.; Berthold, L.; Petzold, M.; Förster, J.; Pressel, K.; Meyer, T.
Konferenzbeitrag
2006A SEM and TEM study of the interconnect microstructure and reliability for a new XFLGA package
Bennemann, S.; Graff, A.; Schischka, J.; Petzold, M.; Theuss, H.; Dangelmaier, J.; Pressel, K.
Konferenzbeitrag
2005A highly reliable flip chip solution based on electroplated AuSn bumps in a leadless package
Theuss, H.; Pressel, K.; Paulus, S.; Kilger, T.; Dangelmaier, J.; Lehner, R.; Eisener, B.; Kiendl, H.; Schischka, J.; Graff, A.; Petzold, M.
Konferenzbeitrag