Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
20142 × 100-Gb/s NRZ-OOK integrated transmitter for intradata center connectivity
Katopodis, V.; Groumas, P.; Zhang, Z.; Dupuy, J.-Y.; Miller, E.; Beretta, A.; Gounaridis, L.; Choi, J.H.; Pech, D.; Jorge, F.; Nodjiadjim, V.; Dinu, R.; Cangini, G.; Dede, A.; Vannucci, A.; Konczykowska, A.; Keil, N.; Bach, H.-G.; Grote, N.; Kouloumentas, C.; Avramopoulos, H.
Zeitschriftenaufsatz
201456Gbaud DP-QPSK receiver module with a monolithic integrated PBS and 90° hybrid InP chip
Zhang, R.Y.; Runge, P.; Zhou, G.; Klotzer, R.; Pech, D.; Bach, H.G.; Perez-Galacho, D.; Ortega-Murnox, A.; Halir, R.; Molina-Fernandez, I.
Konferenzbeitrag
2012Serial 100 Gb/s connectivity based on polymer photonics and InP-DHBT electronics
Katopodis, V.; Kouloumentas, C.; Konczykowska, A.; Jorge, F.; Groumas, P.; Zhang, Z.Y.; Beretta, A.; Dede, A.; Dupuy, J.Y.; Nodjiadjim, V.; Cangini, G.; Buren, G. von; Miller, E.; Dinu, R.; Choi, J.H.; Pech, D.; Keil, N.; Bach, H.G.; Grote, N.; Vannucci, A.; Avramopoulos, H.
Zeitschriftenaufsatz
2010Co-packaged 107 Gb/s photoreceiver for direct detection comprising InP-based pinTWA and DEMUX
Mekonnen, G.G.; Bach, H.-G.; Kunkel, R.; Schubert, C.; Pech, D.; Konczykowska, A.; Jorge, F.; Scavennec, A.; Riet, M.
Konferenzbeitrag
2010InP HBT demultiplexing ICs for over 100 Gb/s optical transmission
Konczykowska, A.; Jorge, F.; Dupuy, J.; Riet, M.; Godin, J.; Scavennec, A.; Bach, H.; Mekonnen, G.G.; Pech, D.; Schubert, C.
Konferenzbeitrag
2009107 Gbit/s demultiplexing photoreceivers comprising pin- and pinTWA frontends
Bach, H.-G.; Mekonnen, G.G.; Kunkel, R.; Schubert, C.; Pech, D.; Rosin, T.; Konczykowska, A.; Jorge, F.; Scavennec, A.; Riet, M.
Konferenzbeitrag
2009The Fraunhofer decision modeler
Pech, Daniel; John, Isabel
Konferenzbeitrag
2009Hybrid co-packaged receiver module with pin-photodiode chip and DEMUX-IC for 107 Gb/s data rates
Mekonnen, G.G.; Bach, H.-G.; Kunkel, R.; Schubert, C.; Pech, D.; Rosin, T.; Konczykowska, A.; Jorge, F.; Scavennec, A.; Riet, M.
Konferenzbeitrag
2009Multiuser product line variability management support
Hörning, Andreas
: Rombach, H. Dieter (Supervisor); Pech, Daniel (Supervisor); Silva, Adeline de Sousa (Supervisor); John, Isabel (Supervisor)
Bachelor Thesis
2009Scalable variability instantiation strategies
John, Isabel; Pech, Daniel
Konferenzbeitrag
2009Variability management in small development organizations - experiences and lessons learned from a case study
Pech, Daniel; Knodel, Jens; Carbon, Ralf; Schitter, Clemens; Hein, Dirk
Bericht
2009Variability management in small development organizations - experiences and lessons learned from a case study
Pech, Daniel; Knodel, Jens; Carbon, Ralf; Schitter, Clemens; Hein, Dirk
Konferenzbeitrag
2008Electromagnetic modeling and optimization of packaged photodetector modules for 100 Gbit/s applications
Jiang, C.; Krozer, V.; Johansen, T.K.; Bach, H-G.; Mekonnen, G-G.; Zhang, R.; Pech, D.
Konferenzbeitrag
2008InP waveguide-integrated pin-photodiode hybrid packaged with an HBT-DEMUX-chip for receiver modules of 80-100 Gb/s data rates
Mekonnen, G.G.; Hüttl, B.; Bach, H.-G.; Pech, D.; Rosin, T.; Schubert, C.; Konczykowska, A.; Jorge, F.; Riet, M.
Konferenzbeitrag
2008Integration potential of waveguide-integrated photodiodes
Bach, H.-G.; Kunkel, R.; Mekonnen, G.G.; Pech, D.; Rosin, T.; Schmidt, D.; Gärtner, T.; Zhang, R.
Konferenzbeitrag
2008Model-based design of product line components in the automotive domain
Yoshimura, Kentaro; Forster, Thomas; Muthig, Dirk; Pech, Daniel
Konferenzbeitrag
2008Understanding decision models - visualization and complexity reduction of software variability
Forster, Thomas; Muthig, Dirk; Pech, Daniel
Konferenzbeitrag
2007Experimenting with software testbeds for evaluating new technologies
Lindvall, M.; Rus, I.; Donzelli, P.; Memon, A.; Zelkowitz, M.V.; Ackermann, B.; Anders, S.; Asgari, S.; Basili, V.; Costa, P.; Fellmann, J.; Hirschbach, D.; Hochstein, L.; Shull, F.; Tvedt, R.; Pech, D.
Zeitschriftenaufsatz
2007Variability management support for large-scale software product lines
Pech, Daniel
: Knauber, Peter (Supervisor); Muthig, Dirk (Supervisor); Forster, Thomas (Supervisor)
Master Thesis
2005An evolutionary testbed for software technology evaluation
Lindvall, M.; Rus, I.; Shull, F.; Zelkowitz, M.; Donzelli, P.; Memon, A.; Basili, V.; Costa, P.; Tvedt, R.; Hochstein, L.; Asgari, S.; Ackermann, C.; Pech, D.
Zeitschriftenaufsatz
2000New reconfigurable fiber-chip coupling method for multipurpose packaging with up to 50 GHz modulation bandwidth
Fischer, U.H.P.; Peters, K.; Ziegler, R.; Pech, D.; Kilk, A.; Eckhardt, T.; Mekonnen, G.G.; Jacumeit, G.
Zeitschriftenaufsatz
1999A new fiber-chip coupling concept for reusable multipurpose packaging suitable for up to 45 GHz bandwidth
Fischer, U.H.P.; Eckhardt, T.; Jacumeit, G.; Kilk, A.; Mekonnen, G.G.; Pech, D.; Ziegler, R.
Konferenzbeitrag
1999Packaging of OEICs with tapered fibers for optical communications systems with up to 45 GHz modulation bandwidth
Fischer, U.H.P.; Peters, K.; Ziegler, R.; Pech, D.; Kilk, A.; Mekonnen, G.G.; Jacumeit, G.
Konferenzbeitrag
1996In situ observation of the self-alignment during FC-bonding under vacuum with and without H2
Kuhmann, J.F.; Pech, D.
Zeitschriftenaufsatz
1996Self-aligned, fluxless flip-chip bonding technology for photonic devices
Kuhmann, J.F.; Hensel, H.-J.; Pech, D.; Harde, P.; Bach, H.-G.
Konferenzbeitrag