Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014Fracture toughness measurements for microelectronic packages
Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B.
Aufsatz in Buch
2014Rapid, inexpensive and accurate fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Michel, B.; Pape, H.
Aufsatz in Buch
2014Segmentation of thin section images for grain size analysis using region competition and edge-weighted region merging
Jungmann, M.; Pape, H.; Wisskirchen, P.; Clauser, C.; Berlage, T.
Zeitschriftenaufsatz
2013Determination of Interface Fracture Parameters: Energy Release Rate and Mode Mixity using FEA
Maus, I.; Pape, H.; Nabi, H.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; May, D.; Maus, I.; Pape, H.; Michel, B.
Konferenzbeitrag
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Maus, I.; Pape, H.; Michel, B.
Konferenzbeitrag
2012Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production
Maus, I.; Pape, H.; Nabi, H.S.; Goroll, M.; Preu, H.; Keller, J.; Ernst, L.J.; Michel, B.; Wunderle, B.
Konferenzbeitrag
2011Establishing the critical fracture properties of the die backside-to-molding compound interface
Schlottig, G.; Pape, H.; Wunderle, B.; Ernst, L.J.
Konferenzbeitrag
2011Fracture mechanical test methods for interface crack evaluation of electronic packages
Keller, J.; Maus, I.; Pape, H.; Wunderle, B.; Michel, B.
Konferenzbeitrag
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd
Zeitschriftenaufsatz, Konferenzbeitrag
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design An effcient and comprehensive method for critical mixed-mode data extraction
Wunderle, B.; Schulz, M.; Keller, J.; Schlottig, G.; Maus, I.; May, D.; Hölck, O.; Pape, H.; Michel, B.
Konferenzbeitrag
2011Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2010Delamination and combined compound cracking of EMC-copper interfaces
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2010Interface fracture mechanics evaluation by correlation of experiment and simulation
Keller, J.; Maus, I.; Schlottig, G.; Pape, H.; Wunderle, B.; Michel, B.
Konferenzbeitrag
2010Interfacial fracture parameters of silicon-to-molding compound
Schlottig, G.; Maus, I.; Walter, H.; Jansen, K.M.B.; Pape, H.; Wunderle, B.; Ernst, L.J.
Konferenzbeitrag
2010Interfacial strength of silicon-to-molding compound changes with thermal residual stress
Schlottig, G.; Xiao, A.; Pape, H.; Wunderle, B.; Ernst, L.J.
Konferenzbeitrag
2010Procedure to determine interfacial toughness of EMC-copper (oxide) interfaces
Xiao, A.; Pape, H.; Schlottig, G.; Wunderle; Leung, Y.Y.; Jansen, K.B.; Ernst, L.J.
Konferenzbeitrag
2010Temperature moisture and mode mixity dependent EMC- Copper (Oxide) interfacial toughness
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2009Establishing fracture properties of EMC-copper (-oxide) interfaces: Test procedures and simulations for establishing the interface toughness, depending on temperature, humidity and mode mixity
Ernst, L.J.; Xiao, A.; Vreugd, J. de; Jansen, K.M.B.; Pape, H.; Schlottig, G.; Wunderle, B.
Konferenzbeitrag
2009Establishing fracture properties of EMC-copper interfaces in the Visco-Elastic temperature region
Xiao, A.; Vreugd, J. de; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2009Establishing mixed mode fracture properties of EMC-Copper (-oxide) interfaces at various temperatures
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Sluis, O. van der; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2009How to fabricate specimens for silicon-to-molding compound interface adhesion measurements
Schlottig, G.; Pape, H.; Xiao, A.; Wunderle, B.; Ernst, L.
Konferenzbeitrag
2009Induced delamination of silicon-molding compound interfaces
Schlottig, G.; Pape, H.; Wunderle, B.; Ernst, L.J.
Konferenzbeitrag
2008Interface characterization and failure modeling for Semiconductor packages
Ernst, L.J.; Xiao, A.; Wunderle, B.; Jansen, K.M.B.; Pape, H.
Konferenzbeitrag
2008Interfacial Fracture Properties and Failure Modeling for Microelectronics
Xiao, A.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Vreugd, J. de; Ernst, L.J.
Konferenzbeitrag
2008Mixed mode interface characterization considering thermal residual stress
Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.
Konferenzbeitrag
2001Dehydroepiandrosterone decreases mortality rate and improves cellular immune function during polymicrobial sepsis
Oberbeck, R.; Dahlweid, M.; Koch, R.; Griensven, M. van; Emmendörffer, A.; Tscherne, H.; Pape, H.C.
Zeitschriftenaufsatz