Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Zeitschriftenaufsatz
2019High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche,Carola; Ndip, Ivan; Kröhnert, Kevin; Lang, Klaus-Dieter
Konferenzbeitrag
2019High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D.
Konferenzbeitrag
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2018Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.
Konferenzbeitrag
2018Antennenmessplatz
Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan
Patent
2018Antennenvorrichtung mit Bonddrähten
Ndip, Ivan
Patent
2018Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
Ndip, Ivan
Patent
2018Bändchenbondantennen
Ndip, Ivan
Patent
2018A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.
Konferenzbeitrag
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Zeitschriftenaufsatz
2018Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Elektronisches Modul mit integrierter Antenne und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Konferenzbeitrag
2018Kombinationsantenne
Ndip, Ivan
Patent
2018Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Zeitschriftenaufsatz
2018Packaging for high frequency and reliability
Folk, E.; Ndip, I.
Zeitschriftenaufsatz
2018Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan
Patent
2017Antennenanordnung mit Richtstruktur
Ndip, Ivan; Curran, Brian
Patent
2017A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2017Effect of 3D stack-up integration on through silicon via characteristics
Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2017Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board
Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.
Konferenzbeitrag
2017Power plane filter using higher order virtual ground fence
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2016Broadband dielectric material characterization of epoxy molding compound
Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D.
Konferenzbeitrag
2016Determination of dielectric thickness, constant, and loss tangent from cavity resonators
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Konferenzbeitrag
2016Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A.
Konferenzbeitrag
2016Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Zeitschriftenaufsatz
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, Markus; Juergensen, Nils; Lutz, Mario; Wilke, Martin; Duan, Xiaomin; Ndip, Ivan; Töpper, Michael; Lang, Klaus-Dieter
Konferenzbeitrag
2016High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2016Higher-order virtual ground fence design for filtering power plane noise
Engin, A.E.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2016Non-overlapping power/ground planes for localized power distribution network design
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Konferenzbeitrag
2016On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Zeitschriftenaufsatz
2016On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Konferenzbeitrag
2016RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz
Iannacci, J.; Tschoban, C.; Reyes, J.; Maaß, U.; Huhn, M.; Ndip, I.; Pötter, H.
Konferenzbeitrag
2016A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C.
Zeitschriftenaufsatz
2015Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
Ndip, I.; Oz, A.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2015Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2015Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2015Efficient computation of localized fields for through silicon via modeling up to 500 GHz
Dahl, D.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Zeitschriftenaufsatz
2015Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2015Optimization of the return current paths of interposer TSVs for frequencies up to 110GHz
Curran, B.; Lang, K.-D.; Ndip, I.; Pötter, H.
Konferenzbeitrag
2015Through-the-wall detection with gated FMCW signals using optimized patch-like and Vivaldi antennas
Fioranelli, F.; Salous, S.; Ndip, I.; Raimundo, X.
Zeitschriftenaufsatz
2014Analysis and improvement of a spark plug for less radiated electromagnetic emissions
Marczok, C.; Maaß, U.; Hoene, E.; Ndip, I.; Lang, K.-D.; Hasselberg, D.
Konferenzbeitrag
2014Analysis of wave propagation along coaxial through silicon vias using a matrix method
Dahl, D.; Beyreuther, A.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Zeitschriftenaufsatz
2014Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter
Konferenzbeitrag
2014A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H.
Zeitschriftenaufsatz
2014On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H.
Konferenzbeitrag
2014Optimization of microstrip-to-via transition for high-speed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads
Duan, X.; Hardock, A.; Ndip, I.; Schuster, C.; Lang, K.-D.
Konferenzbeitrag
2014Thin glass characterization in the radio frequency range
Ebberg, A.; Meggers, J.; Rathjen, K.; Fotheringham, G.; Ndip, I.; Ohnimus, F.; Tschoban, C.; Pieper, I.; Kilian, A.; Methfessel, S.; Letz, M.; Fotheringham, U.
Konferenzbeitrag
2013Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2013Applying a physics-based via model for the simulation of Through Silicon Vias
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Konferenzbeitrag
2013Comparison of methods for impedance modeling of power distribution networks
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.
Konferenzbeitrag
2013Electrical modeling of the power delivery to an LED array packaged in a textile
Curran, B.; Öz, A.; Linz, Torsten; Ndip, Ivan; Guttowski, Stephan; Lang, Klaus-Dieter
Konferenzbeitrag
2013Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2013Introduction
Nowak, M.; Lee, C.; Ndip, I.; Goetz, M.
Konferenzbeitrag
2013Introduction
Ndip, I.; Yu, J.; Rouzaud, A.; Hoffmeyer, M.
Konferenzbeitrag
2013Modeling and minimizing the inductance of bond wire interconnects
Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Konferenzbeitrag
2013Modeling, fabrication and measurement of TSVs for advanced integration of RF/high-speed components
Lang, K.-D.; Ndip, I.; Guttowksi, S.
Konferenzbeitrag
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Zeitschriftenaufsatz
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2012Introduction: 2011 International Symposium on Microelectronics
Sigliano, R.; Chiang, K.-N.; Ndip, I.; Chan, B.
Konferenzbeitrag
2012Modeling and optimization of electronic packaging structures for signal and power integrity
Scogna, A.C.; Engin, A.E.; Ndip, I.
Konferenzbeitrag
2012Modelling the shape, length and radiation characteristics of bond wire antennas
Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2012Novel conformal antenna concept for security applications
Tschoban, Christian; Maaß, Uwe; Ndip, Ivan; Guttowski, Stefan; Lang, Klaus-Dieter
Konferenzbeitrag
2012Optmized patch-like antennas for through the wall radar imaging and preliminary results with frequency modulated interrupted continuous wave
Fioranelli, F.; Salous, S.; Ndip, I.
Konferenzbeitrag
2012Packaging and integration concept for high-performance and cost-effective IQM-based transmitter module for 160 Gb/s applications
Delrosso, G.; Curran, B.; Rothermund, M.; Maaß, U.; Oppermann, H.; Ndip, I.
Konferenzbeitrag
2012Systematic design and optimization of bond wire antennas using the M3-approach
Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.
Konferenzbeitrag
2012Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter
Konferenzbeitrag
2011From the technical chairs
Sigliano, R.; Chan, B.; Ndip, I.; Chiang, K.-N.
Zeitschriftenaufsatz
2011High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes
Ndip, I.; Curran, B.; Lobbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Zeitschriftenaufsatz
2011The impact of moisture absorption on the electrical characteristics of organic dielectric materials
Curran, B.; Ndip, I.; Bauer, J.; Guttowski, S.; Lang, K.D.; Reichl, H.
Konferenzbeitrag
2011Integration and evaluation of electrically small 868 MHz PCB antennas for wireless USB stick
Ohnimus, F.; Hoherz, C.; Hampicke, M.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.; Lumbeck, D.; Kreitmair, M.
Konferenzbeitrag
2011Integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D.
Zeitschriftenaufsatz
2011Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.
Konferenzbeitrag
2011Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.
Konferenzbeitrag
2010An adapted filament model for accurate modeling of printed coplanar lines with significant surface roughness and proximity effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Zeitschriftenaufsatz
2010Design and Characterization of a Low Profile Miniaturized UHF PIFA for Compact Wireless Sensor Nodes
Ohnimus, F.; Erxleben, R.; Tschoban, C.; Ndip, I.; Niedermayer, M.; Scholtz, H.; Bonim, T.; Guttowski, S.; Lang, K.-D.
Konferenzbeitrag
2010Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D.
Konferenzbeitrag
2010Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D.
Zeitschriftenaufsatz
2010Equivalent circuit modeling of signal vias considering their return current paths
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2010Managing the return-currents of signal vias in organic and silicon substrates
Ndip, I.; Löbicke, K.; Bierwirth, M.; Tschoban, C.; Curran, B.; Erxleben, R.; Ohnimus, F.; Maaß, U.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2010A methodology for combined modeling of skin, proximity, edge, and surface roughness effects
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Zeitschriftenaufsatz
2010Modeling and analysis of coplanar bonding wires for high-speed applications
Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.
Konferenzbeitrag
2010Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2010Modeling, quantification, and reduction of the impact of uncontrolled return currents of vias transiting multilayered packages and boards
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Bierwirth, M.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Zeitschriftenaufsatz
2010Eine neue planare Funktionsstruktur zur Entkopplung hochfrequenter Störungen auf Schaltungsträgern
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2010Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
Gieser, H.A.; Bonfert, D.; Hengelmann, H.; Wolf, H.; Bock, K.; Zollmer, V.; Werner, C.; Domann, G.; Bahr, J.; Ndip, I.; Curran, B.; Oehler, F.; Milosiu, H.
Konferenzbeitrag
2010RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Zeitschriftenaufsatz
2010Simulation, measurement and analysis of electromagnetic band gap structures for noise suppression in electronic systems
Ndip, I.; Bierwirth, M.; Tschoban, C.; Maab, U.; Erxleben, R.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2010A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.
Konferenzbeitrag
2010Eine systematische Entwurfsmethode zur Sicherstellung der elektromagnetischen Zuverlässigkeit in Mikrosystemen
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2010TSV modeling considering signal integrity issues
Ndip, I.; Curran, B.; Löbbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Konferenzbeitrag
2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Comparison of electromagnetic field distribution in vicinity of patch and slot antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Design and integration of a planar EBG for UWB applications
Ndip, I.; Bierwirth, M.; Engin, E.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layers
Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes
Reichl, H.; Ndip, I.
Konferenzbeitrag
2009The impacts of dimensions and return current path geometry on coupling in single ended through silicon vias
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N.F.; Reichl, H.
Konferenzbeitrag
2009Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed-Signal Systems
Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Modeling and analysis of electromagnetic field distribution in vicinity of patch antennas at millimeter-wave frequencies
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Modeling and comparison of patch antenna configurations for 77 GHz radar applications
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Modeling and Measurement of Coplanar Transmission Lines with Significant Proximity and Surface Roughness Effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Konferenzbeitrag
2009Modeling and quantification of conventional and Coax-TSVs for RF applications
Ndip, I.; Curran, B.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009A novel Interconnected Patch-Ring (IPR) structure for noise isolation
Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009On the quantification and improvement of the models for surface roughness
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009On the quantification of the state-of-the-art models for skin-effect in conductors, including those with non-rectangular cross-sections
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Parameterization of bent coils on curved flexible surface substrates for RFID applications
Fotheringham, G.; Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2009Reduction of signal line to power plane coupling using controlled-return- current transmission lines
Engin, A.E.; Ndip, I.
Konferenzbeitrag
2009RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Aufsatz in Buch
2009Study on shielding effectiveness of mushroom-type electromagnetic bandgap structures in close proximity to patch antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2008Design and Analysis of a Bent Antenna-coil for a HF RFID Transponder
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2008An efficient and broadband slot antenna for 60 GHz Wireless applications
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2008Managing losses in through silicon vias with different return current path configurations
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Konferenzbeitrag
2008Minimizing electromagnetic interference in power-ground cavities
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2008Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2008Novel multimodal high-speed structures using substrate integrated waveguides with shielding walls in thin film technology
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Konferenzbeitrag
2008On the interactions between mushroom-type EBGs and striplines
Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2008Studying the interactions between mushroom-type EBGs, transmission lines and vias
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2008Vorrichtung zur Unterdrueckung der Ausbreitung einer elektromagnetischen Stoerung in einem elektrischen System und ein elektrisches System mit derselben
Ndip, I.; Guttowski, S.; Reichl, H.
Patent
2007Accurate characterization of package and board components for efficient system level signal integrity analysis
Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2007Development of an M3-approach for optimal electromagnetic reliability in system packages
Ndip, I.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2007Linking geometrical and electrical parameters of flex substrate vertical interconnects for 2.5D system-in-package design
Maaß, U.; Polityko, D.-D.; Richter, C.; Ndip, I.; Hefer, J.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2007Novel methodologies for efficient and accurate modeling and optimization of system-in-package modules for RF/High-Speed applications
Ndip, I.N.
Dissertation
2007Optimal Electrical Design of System Packages and Integrated Components using the M3-Approach
Ndip, I.; Salhi, F.; Maaß, U.; Fotheringham, G.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Konferenzbeitrag
2006Mikroantenne fuer Nahfeldkommunikation
Niedermayer, M.; Ndip, I.; Hahn, R.; Guttowski, S.
Patent
2006A novel methodology for defining the boundaries of geometrical discontinuities in electronic packages
Ndip, I.; Reichl, H.; Guttowski, S.
Konferenzbeitrag
2006RF/Microwave Modeling of SiP Modules - A novel approach
Ndip, I.; Reichl, H.; Guttowski, S.
Konferenzbeitrag
2005Characterization of bump arrays at RF/microwave frequencies
Ndip, I.N.; Sommer, G.; John, W.; Reichl, H.
Zeitschriftenaufsatz
2005Effects of discontinuities and technological fluctuations on the RF performance of BGA packages
Ndip, I.; John, W.; Reichl, H.
Konferenzbeitrag
2005Efficient RF/microwave modeling of discontinuities in chip packages and boards
Ndip, I.; John, W.; Reichl, H.
Konferenzbeitrag
2005Minimizing reflections and cross-talk in chip packages
Ndip, I.; John, W.; Reich, H.
Konferenzbeitrag
2005A novel approach for RF/microwave modeling and optimization of BGA packages
Ndip, I.; John, W.; Reichl, H.; Thiede, A.
Konferenzbeitrag
2004Methodology for Efficient Modeling of BGA Packages at RF/microwave Frequencies
Ndip, I.; Sommer, G.; John, W.; Reichl, H.
Konferenzbeitrag
2004RF/microwave modeling and comparison of buried, blind and through-hole vias
Ndip, I.; John, W.; Reichl, H.
Konferenzbeitrag
2003A novel modelling methodology of bump arrays for RF and high-speed applications
Ndip, I.; Sommer, G.; John, W.; Reichl, H.
Konferenzbeitrag