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| 2020 | Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jaegle, Martin; Klengel, Sandy; Kappert, Holger | Konferenzbeitrag |
| 2019 | Micro-Transfer-Printing and Potential Process Optimizations by FEA
Bühler, K.; Lorenz, G.; Mittag, M.; Krieger, U.; Heise, N.; Wicht, S.; Gerbach, R.; Naumann, F. | Konferenzbeitrag |
| 2019 | Micro-transfer-printing for heterogeneous integration
Corbett, B.; Li, Z.; Bühler, K.; Naumann, F.; Krieger, U.; Wicht, S.; Bower, C.A. | Konferenzbeitrag |
| 2019 | On-turbine multisensors based on hybrid ceramic manufacturing technology
Ziesche, Steffen; Goldberg, Adrian; Partsch, Uwe; Kappert, Holger; Kind, Heidrun; Aden, Mirko; Naumann, Falk | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2018 | Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts
Klengel, R.; Naumann, F.; Tismer, S.; Klengel, S. | Konferenzbeitrag |
| 2018 | Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R. | Konferenzbeitrag |
| 2018 | Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic Waves
Brand, S.; Böttge, B.; Kögel, M.; Naumann, F.; Zijl, J.; Kersjes, S.; Behrens, T.; Altmann, F. | Konferenzbeitrag |
| 2018 | Surface integrity in ultra-precision grinding of transparent ceramics
Klocke, Fritz; Dambon, Olaf; Bletek, Thomas; Höche, Thomas; Naumann, Falk; Hutzler, Thomas | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2017 | On reproducing the copper extrusion of through-silicon-vias from the atomic scale
Liu, J.; Huang, Z.; Conway, P.P.; Altmann, F.; Petzold, M.; Naumann, F. | Konferenzbeitrag |
| 2016 | Correlation of PVD deposition parameters with electrical and mechanical properties of coated thin-glass compounds
Lorenz, G.; Naumann, F.; Westphalen, J.; Weller, S.; Junghähnel, M. | Konferenzbeitrag |
| 2016 | Entwicklung eines visuellen Konzepts zur Unterstützung des ARENA2036-Managements bei der Steuerung der Startprojekte
Trost, Renate; Naumann, Felix; Hyra, Robert; Weber, Marcel; Meyer, Jörg; Berthold, Maik | Aufsatz in Buch |
| 2016 | Evaluation of the bond quality of laser-joined sapphire wafers using a fresnoite-glass sealant
Pablos-Martin, A. de; Tismer, S.; Naumann, F.; Krause, M.; Lorenz, M.; Grundmann, M.; Höche, T. | Zeitschriftenaufsatz |
| 2016 | Fracture toughness of ultrashort pulse-bonded fused silica
Richter, S.; Naumann, F.; Zimmermann, F.; Tünnermann, A.; Nolte, S. | Zeitschriftenaufsatz |
| 2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Konferenzbeitrag |
| 2016 | Influence of thin-film properties on the reliability of flexible glass
Westphalen, J.; Junghähnel, M.; Weller, S.; Lorenz, G.; Naumann, F. | Konferenzbeitrag |
| 2016 | Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas | Konferenzbeitrag |
| 2016 | Numerical prototyping and defect evaluation of scanning acoustic microscopy for advanced failure diagnostics
Naumann, F.; Brand, S. | Konferenzbeitrag |
| 2016 | Reliability evaluation of Si-dies due to assembly issues
Naumann, F.; Gottschalk, V.; Burchard, B.; Altmann, F. | Zeitschriftenaufsatz |
| 2015 | Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M. | Konferenzbeitrag |
| 2015 | Failure analysis strategies for multistacked memory devices with TSV interconnects
Altmann, F.; Grosse, C.; Naumann, F.; Beyersdorfer, J.; Veches, T. | Konferenzbeitrag |
| 2014 | Efficient nondestructive 3D defect localization by lock-in thermography utilizing multi-harmonics analysis
Naumann, F.; Altmann, F.; Grosse, C.; Herold, R. | Konferenzbeitrag |
| 2014 | Mechanical characterization of bond wire materials in electronic devices at elevated temperatures
Lorenz, G.; Naumann, F.; Mittag, M.; Petzold, M. | Konferenzbeitrag |
| 2014 | Mechanical characterization of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T. | Konferenzbeitrag |
| 2014 | Microstructural study of the fatigue mechanism of aluminum cladded copper wires
Naumann, F.; März, B.; Klengel, R.; Schischka, J.; Petzold, M. | Konferenzbeitrag |
| 2013 | Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M. | Zeitschriftenaufsatz |
| 2013 | Characterization and modeling of copper TSVs for silicon interposers
Malta, D.; Gregory, C.; Lueck, M.; Lannon, J.; Lewis, J.; Temple, D.; DiFonzo, P.; Naumann, F.; Petzold, M. | Konferenzbeitrag |
| 2013 | Fracture mechanics life-time modeling of low temperature Si fusion bonded interfaces used for 3D MEMS device integration
Naumann, F.; Bernasch, M.; Siegert, J.; Carniello, S.; Petzold, M. | Konferenzbeitrag |
| 2013 | Packaging material issues in high temperature power electronics
Boettge, B.; Naumann, F.; Klengel, R.; Klengel, S.; Petzold, M. | Konferenzbeitrag |
| 2013 | Sample preparation strategies for fast and effective failure analysis of 3D devices
Kwakman, L.; Straw, M.; Coustillier, G.; Sentis, M.; Beyersdorfer, J.; Schischka, J.; Naumann, F.; Altmann, F. | Konferenzbeitrag |
| 2012 | Failure mechanisms and mechanical characterization of reactive bonded interfaces
Boettge, B.; Schippel, F.; Naumann, F.; Berthold, L.; Lorenz, G.; Gerbach, R.; Bagdahn, J.; Petzold, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2012 | Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel, K.; Wuensch, D.; Uhlig, S.; Froemel, J.; Naumann, F.; Wiemer, M.; Gessner, T. | Abstract |
| 2012 | Quality control of bond strength in low-temperature bonded wafers
Siegert, J.; Cassidy, C.; Schrank, F.; Gerbach, R.; Naumann, F.; Petzold, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2012 | Reliability characterization of heavy wire bonding materials
Naumann, F.; Schischka, J.; Koetter, S.; Milke, E.; Petzold, M. | Konferenzbeitrag |
| 2012 | A study of factors influencing micro-chevron-testing of glass frit bonded interfaces
Naumann, F.; Bernasch, M.; Brand, S.; Wünsch, D.; Vogel, K.; Czurratis, P.; Petzold, M. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2011 | Finite element modeling and raman study of strain distribution in patterned device islands on strained silicon-on-insulator (sSOI) substrates
Gu, D.; Baumgart, H.; Naumann, F.; Petzold, M. | Konferenzbeitrag |
| 2011 | Modification of second harmonic generation in silicon by strain and structuring
Schriever, C.; Bohley, C.; Naumann, F.; Boor, J. de; Lange, J.; Schilling, J. | Konferenzbeitrag |
| 2011 | Observation of free surface-induced bending upon nanopatterning of ultrathin strained silicon layer
Moutanabbir, O.; Reiche, M.; Zakharov, N.; Naumann, F.; Petzold, M. | Zeitschriftenaufsatz |
| 2011 | Strain nano-engineering: SSOI as a playground
Moutanabbir, O.; Hähnel, A.; Reiche, M.; Erfurth, W.; Tarun, A.; Hayazawa, N.; Kawata, S.; Naumann, F.; Petzold, M. | Konferenzbeitrag |
| 2011 | Strain stability in nanoscale patterned strained silicon-on-insulator
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Motohashi, M.; Tarun, A.; Hayazawa, N.; Kawata, S.; Naumann, F.; Patzold, M.; Holt, M.; Maser, J. | Konferenzbeitrag |
| 2010 | Fast transient temperature operating micromachined emitter for mid-infrared optical gas sensing systems. Design, fabrication, characterization and optimization
Hildenbrand, J.; Peter, C.; Lamprecht, F.; Kürzinger, A.; Naumann, F.; Ebert, M.; Wehrspohn, R.; Korvink, J.G.; Wöllenstein, J. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2010 | Finite element modeling and Raman study of strain distribution in patterned device islands on strained Silicon-on-Insulator (sSOI) substrates
Gu, D.; Baumgart, H.; Naumann, F.; Petzold, M. | Konferenzbeitrag |
| 2010 | Micromachined mid-infrared emitter for fast transient temperature operation for optical gas sensing systems
Hildenbrand, J.; Korvink, J.; Wollenstein, J.; Peter, C.; Kurzinger, A.; Naumann, F.; Ebert, M.; Lamprecht, F. | Zeitschriftenaufsatz |
| 2010 | Numerical investigations of the strain behavior in nanoscale patterned strained silicon structures
Naumann, F.; Moutanabbir, O.; Reiche, M.; Schriever, C.; Schilling, J.; Petzold, M. | Konferenzbeitrag |
| 2010 | Numerische Analyse der Spannungsrelaxation nanostrukturierter sili-ziumbasierter optischer Wellenleiter zur Erzeugung nichtlinearer optischer Effekte
Naumann, F.; Schriever, C.; Bohley, C.; Schilling, J.; Petzold, M. | Konferenzbeitrag |
| 2010 | Strain stability in nanoscale patterned strained silicon-on-insulator
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Tarun, A.; Hayazawa, N.; Kawata, S.; Naumann, F.; Petzold, M. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2009 | The complex evolution of strain during nanoscale patterning of 60 nm thick strained silicon layer directly on insulator
Moutanabbir, O.; Reiche, M.; Erfurth, W.; Naumann, F.; Petzold, M.; Gösele, U. | Zeitschriftenaufsatz |
| 2009 | Fast transient temperature operating micromachined emitter for mid-infrared for optical gas sensing systems
Hildenbrand, J.; Peter, C.; Lamprecht, F.; Kürzinger, A.; Naumann, F.; Ebert, M.; Wehrspohn, R.; Wöllenstein, J. | Konferenzbeitrag |
| 2009 | Investigation of strain relaxation in patterned strained silicon-on-insulator structures by Raman spectroscopy and computer simulation
Gu, D.; Naumann, F.; Petzold, M.; Zhu, M.; Baumgart, H. | Konferenzbeitrag |
| 2009 | Probing the strain states in nanopatterned strained SOI
Moutanabbir, O.; Reiche, M.; Hähnel, A.; Erfurth, W.; Naumann, F.; Petzold, M.; Gösele, U. | Konferenzbeitrag |
| 2009 | Thermal and mechanical design optimisation of a micro machined mid-infrared emitter for optical gas sensing systems
Naumann, F.; Ebert, M.; Hildenbrand, J.; Moretton, E.; Peter, C.; Wöllenstein, J. | Konferenzbeitrag |
| 2009 | Thermal simulation of defect localisation using lock-in thermography in complex and fully packaged devices
Schmidt, C.; Naumann, F.; Altmann, F.; Martens, S.; Wilde, J. | Konferenzbeitrag |
| 2008 | Application of lock-in-thermography for 3D defect localisation in complex devices
Schmidt, C.; Altmann, F.; Grosse, C.; Naumann, F.; Lindner, A. | Konferenzbeitrag |
| 2008 | Micromachined mid-infrared emitter for fast transient temperature operation for optical gas sensing systems
Hildenbrand, J.; Kürzinger, A.; Peter, C.; Moretton, E.; Wöllenstein, J.; Naumann, F.; Ebert, M.; Korvink, J. | Konferenzbeitrag |
| 2007 | Dynamic analyses of membranes and thin films on wafer level
Gerbach, R.; Naumann, F.; Ebert, M.; Bagdahn, J.; Klattenhoff, J.; Rembe, C. | Konferenzbeitrag |
| 2007 | Measurement of dynamic properties of MEMS and the possibilities of parameter identification by simulation
Ebert, M.; Naumann, F.; Gerbach, R.; Bagdahn, J. | Konferenzbeitrag |
| 2004 | Semantic overlay clusters within super-peer networks
Löser, A.; Naumann, F.; Nejdl, W.; Siberski, W.; Thaden, U. | Konferenzbeitrag |
| 1995 | Damage characterization of ion beam exposed metal-oxide-semiconductor varactor cells by charge to breakdown measurements
Brünger, W.H.; Buchmann, L.-M.; Naumann, F.; Friedrich, D.; Finkelstein, W.; Mohondro, R. | Konferenzbeitrag |
| 1994 | Growth kinetics and electrical performance of silicon oxide layer grown by RTP in pure N2O ambient
Lange, P.; Hartmannsgruber, E.; Naumann, F. | Konferenzbeitrag |
| 1994 | Growth rate and characterization of silicon oxide films grown in N2O atmosphere in a rapid thermal processor
Lange, P.; Bernt, H.; Hartmannsgruber, E.; Naumann, F. | Zeitschriftenaufsatz |
| 1993 | Schnelle thermische Oxidation von Silizium in N2O-Atmosphäre
Lange, P.; Hartmannsgruber, E.; Naumann, F.; Windbracke, W. | Konferenzbeitrag |
| 1990 | Comparison between surface channel PMOS transistors processed with optical and X-ray lithography with regard to X-ray damage
Naumann, F.; Bernt, H.; Friedrich, D.; Kaatz, A.; Windbracke, W. | Konferenzbeitrag |