Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Analysis of the geometry of the growth ridges and correlation to the thermal gradient during growth of silicon crystals by the Czochralski-method
Stockmeier, Ludwig; Kranert, Christian; Fischer, Peter; Epelbaum, Boris; Reimann, Christian; Friedrich, Jochen; Raming, Georg; Miller, Alfred
Zeitschriftenaufsatz
2018Edge facet dynamics during the growth of heavily doped n-type silicon by the Czochralski-method
Stockmeier, Ludwig; Kranert, Christian; Raming, Georg; Miller, Alfred; Reimann, Christian; Rudolph, Peter; Friedrich, Jochen
Zeitschriftenaufsatz
2017Dislocation formation in heavily As-doped Czochralski grown silicon
Stockmeier, Ludwig; Lehmann, Lothar; Miller, Alfred; Reimann, Christian; Friedrich, Jochen
Zeitschriftenaufsatz, Konferenzbeitrag
2015Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel
Schröder, H.; Brusberg, L.; Pitwon, R.; Whalley, S.; Wang, K.; Miller, A.; Herbst, C.; Weber, D.; Lang, K.-D.
Konferenzbeitrag
2015PhoxTroT - a European initiative toward low cost and low power photonic interconnects for data centres
Hakansson, A.; Tekin, T.; Brusberg, L.; Pleros, N.; Vyrsokinos, C.; Apostolopoulos, D.; Pitwon, R.; Miller, A.; Wang, Kai; Tulli, D.; Dorrestein, S.; Smink, R.; Tuin, J.; Rijnbach, M. van; Duis, J.
Konferenzbeitrag
2015Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides
Pitwon, R.C.A.; Brusberg, L.; Schröder, H.; Whalley, S.; Wang, K.; Miller, A.; Stevens, P.; Worrall, A.; Messina, A.; Cole, A.
Zeitschriftenaufsatz
2014Electro-optical backplane demonstrator with gradient-index multimode glass waveguides for board-to-board interconnection
Brusberg, L.; Schröder, H.; Pitwon, R.; Whalley, S.; Miller, A.; Herbst, C.; Röder, J.; Weber, D.; Lang, K.-D.
Konferenzbeitrag
2013High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in through silicon vias
Phommahaxay, A.; Wolf, I. de; Hoffrogge, P.; Brand, S.; Czurratis, P.; Philipsen, H.; Civale, Y.; Vandersmissen, K.; Halder, S.; Beyer, G.; Swinnen, B.; Miller, A.; Beyne, E.
Konferenzbeitrag
2013Market drivers and architectural requirements for backplane inter-connect capacities in next generation PON head-end equipment in the access network
Dorward, R.M.; Symington, K.; Brusberg, L.; Kropp, J.-R.; Miller, A.; Pitwon, R.; Whalley, S.
Konferenzbeitrag
2013Optical backplane for board-to-board interconnection based on a glass panel gradient-index mulitmode waveguide technology
Brusberg, Lars; Schröder, Henning; Pitwon, Richard; Miller, Allen; Whalley, Simon; Herbst, Christian; Röder, Julia; Lang, Klaus-Dieter
Konferenzbeitrag
2010Mobile electrostatic carrier (MEC) evaluation for a GaAs wafer backside manufacturing process
Stieglauer, H.; Nösser, J.; Miller, A.; Lanz, M.; Öttlin, D.; Jonsson, G.; Behammer, D.; Landesberger, C.; Spöhrle, H.-P.; Bock, K.
Konferenzbeitrag
2004Cooperative problem solving in knowledge networks
Wagner, K.; Warschat, J.; Miller, A.
Konferenzbeitrag