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| | Micromaterials and nanomaterials
: Michel, B. | Zeitschrift |
| 2020 | Special issue: International conference on applied system innovation (ICASI 2018)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2018 | Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016)
Khosla, A.; Furukawa, H.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2018 | Special Issue: International Conference on Applied System Innovation (ICASI 2016)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Zeitschriftenaufsatz |
| 2018 | Special Issue: International Conference on Applied System Innovation (ICASI 2017)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2018 | Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B. | Konferenzbeitrag |
| 2017 | Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L. | Konferenzbeitrag |
| 2017 | Editorial: Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31-Nov 2, 2014
Hsieh, W.H.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2017 | Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014)
Hsieh, W.H.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2017 | Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)
Khosla, A.; Furukawa, H.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2016 | Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, J.; Dehé, A.; Auerswald, E.; Dudek, R.; Vogel, D.; Michel, B.; Rzepka, S. | Zeitschriftenaufsatz |
| 2016 | Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components
Rost, F.; Arnold, B.; Vogel, D.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2016 | Processing-structure-property correlations of sintered silver
Ras, M.A.; May, D.; Heilmann, J.; Rzepka, S.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2016 | Reliability assessment of PCB for smart secure applications
Kaulfersch, E.; Albrecht, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2015 | "LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials
Abo Ras, M.; May, D.; Schacht, R.; Bast, M.; Eisele, R.; Michel, B.; Winkler, T.; Rzepka, R.; Wunderle, B. | Konferenzbeitrag |
| 2015 | FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact
Auersperg, J.; Breuer, D.; Machani, K.V; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2015 | FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact
Auersperg, J.; Breuer, D.; Machani, K.V.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2015 | A high-efficiency hybrid high-concentration photovoltaic system
Zimmermann, S.; Helmers, H.; Tiwari, M.K.; Paredes, S.; Michel, B.; Wiesenfarth, M.; Bett, A.W.; Poulikakos, D. | Zeitschriftenaufsatz |
| 2015 | Mechanical stress induced in Si sensors during bonding and packaging processes
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Vogel, D.; Michel, B.; Mehner, J.; Rzepka, S. | Konferenzbeitrag |
| 2015 | Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB. A numerical and experimental study
Schacht, R.; Punch, J.; Merten, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag, Poster |
| 2015 | Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
Bayat, P.; Vogel, D.; Rodriguez, R.D.; Sheremet, E.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | An accelerated interfacial characterization method for microelectronic packages under automotive testing conditions - methodology and sample preparation
Poshtan, E.A.; Silber, C.; Rzepka, S.; Michel, B.; Wunderle, B. | Aufsatz in Buch |
| 2014 | An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions
Poshtan, E.A.; Rzepka, S.; Michel, B.; Silber, C.; Wunderle, B. | Konferenzbeitrag |
| 2014 | Advances in micro-nano reliability research for smart systems integration using crack avoidance strategies
Michel, B.; Winkler, T.; Shirangi, H.; Wondrak, W.; Pufall, R. | Aufsatz in Buch |
| 2014 | Anti-counterfeiting technique in the micro region for micro and nano systems
Luczak, F.; Dost, M.; Seiler, B.; Winkler, T.; Michel, B. | Aufsatz in Buch |
| 2014 | Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
Maus, I.; Preu, H.; Niessner, M.; Fink, M.; Jansen, K.M.B.; Pantou, R.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2014 | Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution
Maus, I.; Preu, H.; Niessner, M.; Nabi, H.; Jansen, K.M.B.; Pantou, R.; Weiss, L.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2014 | Characterization of thermal interface materials (TIM)
Abo Ras, M.; May, D.; Schacht, R.; Wunderle, B.; Winkler, T.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Design for reliability of BEoL and 3-D TSV structures - a joint effort of FEA and innovative experimental techniques
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Determination of residual stresses by fib-DAC methodology
Auerswald, E.; Vogel, D.; Michel, B.; Rzepka, S. | Aufsatz in Buch |
| 2014 | Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering
Tsebo Simo, G.L.; Shirangi, H.; Nowottnick, M.; Dudek, R.; Kaulfersch, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Efficiency optimization for a frictionless air flow blade fan – design study
Schacht, R.K.B.; Hausdorf, A.; Wunderle, B.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | EUCEMAN - the European Center for MicroNanoReliability Research in Europe
Michel, B.; Winkler, T. | Aufsatz in Buch |
| 2014 | Experimental and numerical investigation of PCB vibration during drop impact
Tsebo Simo, G.L.; Shirangi, H.; Rzepka, S.; Michel, B.; Nowottnick, M. | Aufsatz in Buch |
| 2014 | Experimental testing of silicon die strength depending on the processing history
Brueckner, J.; Dudek, R.; Auerswald, E.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Fracture toughness measurements for microelectronic packages
Maus, I.; Pape, H.; Brämer, B.; Michel, B.; Wunderle, B. | Aufsatz in Buch |
| 2014 | German association of nanotechnology: Objectives and benefits
Nonninger, R.; Michel, B. | Aufsatz in Buch |
| 2014 | Improvement of yield and reliability of sub-30 nm structures with finite element analysis in BEOL stress engineering
Kaulfersch, E.; Brämer, B.; Breuer, D.; Rzepka, S.; Clauss, E.; Feustel, F.; Michel, B. | Aufsatz in Buch |
| 2014 | Integrated investigation approach for determining mechanical properties of poly-silicon membranes
Brueckner, J.; Dehe, A.; Auerswald, E.; Dudek, R.; Michel, B.; Rzepka, S. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | Interface characterisation at electronic packages by means af nanoscale deformation analysis
Keller, J.; Zander, T.; Schulz, M.; Springborn, M.; Lauenstein, T.; Dost, M.; Wunderle, B.; Michel, B. | Aufsatz in Buch |
| 2014 | Limitations and accuracy of steady state technique for thermal characterization of solid and composite materials
Aboras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Limitations and accuracy of steady state technique for thermal characterization of thermal interface materials and substrates
Abo Ras, M.; Wunderle, B.; May, D.; Schacht, R.; Winkler, T.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE
Rost, F.; Schindler-Saefkow, F.; Schaufuß, J.; Tsapkolenko, A.; Nossol, P.; Vogel, D.; Adli, A.R.; Jansen, K.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
Schindler-Saefkow, F.; Rost, F.; Schingale, A.; Wolf, D.; Wunderle, B.; Keller, J.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2014 | Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
Schindler-Saefkow, F.; Rost, F.; Rezaie-Adli, A.; Jansen, K.M.B.; Wunderle, B.; Keller, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Miniaturized frictionless fan concept for thermal management of electronics
Schacht, R.; Wunderle, B.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Modelling and testing of mechanical stresses by means of stress chips for the MERGE project
Rost, F.; Schindler-Saefkow, F.; Vogel, D.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | New methodology for lifetime prediction of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Michel, B. | Aufsatz in Buch |
| 2014 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | On the crack and delamination risk optimization towards 3D-IC-integration
Auersperg, J.; Auerswald, E.; Oswald, S.; Machani, K.V.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Parametrisches transientes thermo-elektrisches PSPICE Modell für ein Stromkabel
Schacht, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Rapid, inexpensive and accurate fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Michel, B.; Pape, H. | Aufsatz in Buch |
| 2014 | Reliability investigations for high temperature interconnects
Dudek, R.; Sommer, P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | Smart systems integration for micro- and nanotechnologies
: Michel, B. (Hrsg.); Gessner, T. | Buch |
| 2014 | Statistical Strength Investigation of Poly-Silicon Membranes using Microscopic Loading Tests and Numerical Simulation
Brueckner, J.; Auerswald, E.; Dudek, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Dehe, A. | Konferenzbeitrag |
| 2014 | Stress analyses of high spatial Resolution on TSV and BEoL structures
Vogel, D.; Auerswald, E.; Auersperg, J.; Bayat, P.; Rodriguez, R.D.; Zahn, D.R.T.; Rzepka, S.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2014 | Stress Analysis on Cu Through-Silicon Vias with Micro-Raman Spectroscopy
Bayat, Parisa; Vogel, D.; Rodriguez, Raul D.; Sheremet, E.; Zahn, Dietrich R.T.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2014 | Stress chip measurements during temperature cycling test
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Michel, B.; Rzepka, S. | Aufsatz in Buch |
| 2014 | Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2014 | Stress measurements at through silicon vias
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Aufsatz in Buch |
| 2014 | Thermal characterization of highly conductive die attach materials
Abo Ras, M.; May, D.; Winkler, T.; Michel, B.; Rzepka, S.; Wunderle, B. | Konferenzbeitrag |
| 2013 | The 2nd International Conference on Engineering of Technology Innovation (ICETI 2012) Kaohsiung, Taiwan, Nov. 2-6, 2012
Hsieh, W.-H.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2013 | Advanced liquid cooling in HCPVT systems to achieve higher energy efficiencies
Zimmermann, S.; Helmers, H.; Tiwari, M.K.; Escher, W.; Paredes, S.; Neves, P.; Poulikakos, D.; Wiesenfarth, M.; Bett, A.W.; Michel, B. | Konferenzbeitrag |
| 2013 | Advanced mixed-mode bending test experimental-numerical characterization of the critical energy release rate Gc including mixed-mode-angle psi in interfaces under independent external loads
Schulz, M.; Springborn, M.; Keller, J.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2013 | Advantage and current limitations of advanced fracture mechanics for 3D-integration and BEoL under CPI aspects
Auersperg, J.; Dudek, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Clean Sky European Technology Demonstration for greener Aviation
Kaulfersch, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Combined method for thermal characterization of high power semiconductors
Merten, E.; Abo Ras, M.; Essen, T. von; Schacht, R.; May, D.; Winkler, T.; Michel, B. | Konferenzbeitrag |
| 2013 | Determination of Interface Fracture Parameters: Energy Release Rate and Mode Mixity using FEA
Maus, I.; Pape, H.; Nabi, H.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2013 | Development and fabrication of thin film thermo test chip and its integration into a test system for thermal interface characterization
Abo Ras, M.; Engelmann, G.; May, D.; Rothermund, M.; Schacht, R.; Wunderle, B.; Winkler, T.; Michel, B.; Oppermann, H.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Effect of moisture swelling on MEMS packaging and integrated sensors
Keller, J.; Mrossko, R.; Dobrinski, H.; Stürmann, J.; Döring, R.; Dudek, R.; Rzepka, S.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2013 | Experimental Analysis of Mechanical Stresses and Material Properties in Multi-Layer Interconnect Systems by fibDAC
Vogel, D.; Auerswald, E.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Finite-Element-Modelling of Intermetallics in Solders
Sommer, J.-P.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2013 | Kombinierte Zuverlässigkeitstests für die Elektromobilität
Otto, A.; Matkowski, P.; Winkler, T.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Measuring techniques for deformation and stress analysis in micro-dimensions
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | New Reliability Testing Methods for Electromobility Applications
Otto, A.; Matkowski, P.; Brabandt, I.; Winkler, T.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Package Characterization with Stress Chip Measurements for Health Monitoring
Rost, F.; Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Parametric transient thermo-electrical PSPICE model for a power cable
Schacht, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Reliability Investigations for High Temperature Interconnects
Dudek, R.; Sommer, J.-P.; Fix, A.; Trodler, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Reliability issues for high temperature interconnections based on transient liquid phase soldering
Dudek, R.; Sommer, P.; Fix, A.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Review of experimental strength testing methods for Silicon dies
Brueckner, J.; Auerswald, E.; Dudek, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Strain and Stress Measurement for Reliability Analyses in Small Material Volumes. Invited plenary presentation
Vogel, D.; Auerswald, E.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Stress impact of moisture diffusion measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Pantou, R.; Mroßko, R.; Wunderle, B.; Michel, B.; Rzepka, S.; Keller, J. | Konferenzbeitrag |
| 2013 | Stress impact of thermal-mechanical loads measured with the stress chip
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Keller, J.; Winkler, T.; Wunderle, B.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2013 | Stress Measurement in Thin Multilayer Systems by Stress Relief
Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2013 | Toolbox for visco-elastic material modeling of smart lightweight structures
Rzepka, S.; Pantou, R.; Bormann, F.; Brämer, B.; Brabandt, I.; Michel, B. | Konferenzbeitrag |
| 2013 | Transient thermal response as failure analytical tool - a comparison of different techniques
May, D.; Wunderle, B.; Schacht, R.; Michel, B. | Konferenzbeitrag |
| 2013 | Unterstützung von Haftfestigkeitsuntersuchungen am Interface zwischen Barriere und Dielektrikum FE-Simulation des 4-Punkt-Biegeversuches
Braemer, B.; Hartwig, I.; Auersperg, J.; Hecker, M.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; May, D.; Maus, I.; Pape, H.; Michel, B. | Konferenzbeitrag |
| 2012 | Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Maus, I.; Pape, H.; Michel, B. | Konferenzbeitrag |
| 2012 | Battery management network for fully electrical vehicles featuring smart systems at cell and pack level
Otto, A.; Rzepka, S.; Mager, T.; Michel, B.; Lanciotti, C.; Günther, T.; Kanoun, O. | Konferenzbeitrag |
| 2012 | Capturing interface toughness parameters from shear testing using different fracture mechanics approaches
Auersperg, J.; Dudek, R.; Brämer, B.; Pufall, R.; Seiler, B.; Michel, B. | Konferenzbeitrag |
| 2012 | Chances and limits of computer tomography in materialographic investigations
Faust, W.; Noack, E.; Michel, B. | Zeitschriftenaufsatz |
| 2012 | Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Michel, Bernd; Wunderle, Bernhard | Zeitschriftenaufsatz |
| 2012 | Delamination modeling for power packages by the cohesive zone approach
Dudek, R.; Doering, R.; Pufall, R.; Kanert, W.; Seiler, B.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package
Poshtan, E.A.; Rzepka, S.; Wunderle, B.; Silber, C.; Bargen, T. von; Michel, B. | Konferenzbeitrag |
| 2012 | Experimental and numerical methods for evaluation of interface cracks in electronics systems
Keller, J.; Schulz, M.; Wunderle, B.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2012 | Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H. | Konferenzbeitrag |
| 2012 | FIB/SEM analysis for smart systems integration
Waechtler, T.; Auerswald, E.; Hoebelt, I.; Nowack, M.; Noack, E.; Gollhardt, A.; Vogel, D.; Michel, B.; Schulz, S.E.; Gessner, T. | Konferenzbeitrag |
| 2012 | Frictionless air flow blade fan for thermal management of electronics
Schacht, R.; Hausdorf, A.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2012 | Hochgenaue Bestimmung mechanischer Spannungen in Elektronik- und MEMS-Komponenten durch ein Stressmesschip
Schindler-Saefkow, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2012 | Humidity effects on the fatigue of fiber reinforced polymers in micro/nano functional systems
Pantou, R.; Shah, D.L.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2012 | Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production
Maus, I.; Pape, H.; Nabi, H.S.; Goroll, M.; Preu, H.; Keller, J.; Ernst, L.J.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2012 | Local deformation and stress analysis in the micro-nano interface regions
Vogel, D.; Auerswald, E.; Dudek, R.; Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | Miniaturized frictionless fan concept for thermal management of electronic
Schacht, R.; Hausdorf, A.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2012 | Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bereichen Automobil, Luftfahrt und Elektronik
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 2012 | Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages
Keller, J.; Schulz, M.; Mrossko, R.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2012 | Nonlinear copper behavior of TSV and the cracking risks during BEoL-built-up for 3D-IC-integration
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2012 | Novel architecture for battery management systems in fully electrical cars
Rzepka, S.; Otto, A.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2012 | Quantitative determination of the mechanical stresses in BEoL films and structures on Si wafers with sub-micron spatial resolution by fibDAC
Rzepka, S.; Vogel, D.; Auerswald, E.; Michel, B. | Konferenzbeitrag |
| 2012 | Stress chip measurements of the internal package stress for process characterization and health monitoring
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Faust, W.; Wunderle, B.; Michel, B.; Rzepka, S. | Konferenzbeitrag |
| 2012 | Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B. | Zeitschriftenaufsatz |
| 2012 | Transient thermal analysis as failure analytical tool in electronic packaging
May, D.; Wunderle, B.; Schacht, R.; Michel, B. | Konferenzbeitrag |
| 2011 | Accelerated fatigue testing methodology for reliability assessments of fiber reinforced composite polymer materials in micro/nano systems
Rzepka, S.; Walter, H.; Pantou, R.; Freed, Y.; Michel, B. | Konferenzbeitrag |
| 2011 | Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H. | Konferenzbeitrag |
| 2011 | Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens
Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd | Konferenzbeitrag |
| 2011 | Aspects of chip/package interaction and 3-D integration assessed by the investigation of crack and damage phenomena in low-k BEoL stacks
Auersperg, J.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2011 | Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials
AboRas, M.; Haug, R.; Schacht, R.; Monory-Plantier, C.; May, D.; Wunderle, B.; Winkler, T.; Michel, B. | Konferenzbeitrag |
| 2011 | Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2011 | Combined and accelerated in-situ measurement method for reliability and aging analyses of thermal interface materials
AboRas, M.; Haug, R.; Schacht, R.; Monory-Plantier, C.; May, D.; Wunderle, B.; Winkler, T.; Michel, B. | Konferenzbeitrag |
| 2011 | Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2011 | Correlation based local measurement of small CTE for high temperature power electronics packaging
Hammacher, J.; Dost, M.; Seiler, B.; Scheiter, L.; Noack, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2011 | DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Rost, F.; Otto, A.; Rzepka, S.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2011 | Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard | Konferenzbeitrag |
| 2011 | Formulation of percolating thermal underfill by sequential convective gap filling
Branschwiler, T.; Goicochea, J.V.; Matsumoto, K.; Wolf, H.; Kiimin, C.; Michel, B.; Wunderle, B.; Faust, W. | Konferenzbeitrag |
| 2011 | Fracture mechanical test methods for interface crack evaluation of electronic packages
Keller, J.; Maus, I.; Pape, H.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2011 | Fracture-mechanical interface characterisation for thermo-mechanical co-design
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2011 | Fracture-mechanical interface characterisation for thermo-mechanical co-design An effcient and comprehensive method for critical mixed-mode data extraction
Wunderle, B.; Schulz, M.; Keller, J.; Schlottig, G.; Maus, I.; May, D.; Hölck, O.; Pape, H.; Michel, B. | Konferenzbeitrag |
| 2011 | High density packaging for automotive applications
Sommer, J.-P.; Michel, B.; Hofmann, T.; Gottwald, T.; Neumann, A.; Podlasly, A. | Konferenzbeitrag |
| 2011 | Interaction integral and mode separation for BEoL-cracking and -delamination investigations under 3D-IC integration aspects
Auersperg, J.; Dudek, R.; Oswald, J.; Michel, B. | Konferenzbeitrag |
| 2011 | Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
Vogel, D.; Rzepka, S.; Michel, B.; Gollhardt, A. | Konferenzbeitrag |
| 2011 | Mechanism and prevention of defect formation during hydrophilic silicon direct bonding at low temperatures
Eichler, M.; Michel, B.; Hennecke, P.; Klages, C.-P. | Konferenzbeitrag |
| 2011 | Niedrigtemperatur-Direktbonden von Silizium-, Borosilikat- und Quarzglaswafern und der Einfluss von Funktionsschichten
Eichler, M.; Hennecke, P.; Michel, B.; Klages, C.-P. | Konferenzbeitrag |
| 2011 | Nonlinear copper behavior of TSV for 3D-IC-integration and cracking risks during BEoL-built-up
Auersperg, J.; Vogel, D.; Auerswald, E.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2011 | Photon Management Structures Based on Interference Lithography and Nanoimprint Processes
Bläsi, B.; Hauser, H.; Walk, C.; Michel, B.; Mellor, A.; Guttowski, A.; Jüchter, S.; Wellens, C.; Peters, M.; Kübler, V.; Wolf, A.J. | Konferenzbeitrag |
| 2011 | Physikalisch-chemische Eigenschaften von SiO2-Schichten auf plasmabehandelten Siliziumoberflächen
Michel, B. | Dissertation |
| 2011 | Project VISA: Fully integrated power electronic systems for automotive electronics
Hofmann, T.; Sommer, J.-P.; Michel, B. | Konferenzbeitrag |
| 2011 | Reliability analysis of low temperature low pressure Ag-sinter die attach
Mroßko, R.; Oppermann, H.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2011 | Studies on the reliability of power packages based on strength and fracture criteria
Dudek, R.; Pufall, R.; Seiler, B.; Michel, B. | Konferenzbeitrag |
| 2011 | Three-dimensional deformation analysis of MEMS/NEMS by means of X-ray computer-tomography
Hammacher, J.; Dost, M.; Faust, W.; Scheiter, L.; Erb, R.; Michel, B. | Konferenzbeitrag |
| 2010 | Adhesion of moulding compounds on various surfaces: A study on moisture influence and degradation after high temperature storage
Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B. | Konferenzbeitrag |
| 2010 | Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?
Pufall, R.; Michel, B.; Kaulfersch, E. | Konferenzbeitrag |
| 2010 | Advanced virtual qualification methods to reduce the time-to-market of microelectronic assemblies
Shirangi, M.H.; Koyuncu, M.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2010 | Advanced virtual testing of structural integrity in microelectronic assemblies
Shirangi, M.H.; Otto, C.; Fischer, A.; Staa, P. van; Müller, W.H.; Michel, B. | Konferenzbeitrag |
| 2010 | Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2010 | Combination of FE simulation and micro deformation measurements - A promising approach to consider reliability aspects right from the start
Sommer, J.-P.; Michel, B.; Brämer, B.; Kugler, A.; Rank, H. | Konferenzbeitrag |
| 2010 | Comparative study of residual stress measurement techniques with high spatial resolution
Vogel, D.; Maus, I.; Schindler-Saefkow, F.; Michel, B. | Konferenzbeitrag |
| 2010 | Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2010 | Crack and damage in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.D.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2010 | Design and development of a miniaturized black body device for in-situ IR-camera calibration
Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2010 | Design of low loss beam forming networks - supported by numerical simulation and materials characterisation
Sommer, J.-P.; Uhlig, P.; Kulke, R.; Michel, B. | Konferenzbeitrag |
| 2010 | DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2010 | fibDAC stress relief - A novel stress measurement approach for BEoL structures
Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2010 | fibDAC stress relief - A novel stress measurement approach with high spatial resolution
Vogel, D.; Maus, I.; Michel, B. | Konferenzbeitrag |
| 2010 | Heat-removal performance scaling of interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Cesar, W.; Leblebici, Y.; Wunderle, B.; Reichl, H. | Konferenzbeitrag |
| 2010 | Highly integrated advanced power electronic systems for automotive applications
Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B. | Konferenzbeitrag |
| 2010 | Influence of moisture on humidity sensitive material parameters of microelectronics relevant polymers
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2010 | Influence of moisture on humidity sensitive material parameters of polymers used in microelectronic applications
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2010 | Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials
Abo Ras, M.; Wunderle, B.; May, D.; Oppermann, H.; Schacht, R.; Michel, B. | Konferenzbeitrag |
| 2010 | An integrated experimental and theoretical approach to evaluate Si strength dependent on the processing history
Brueckner, J.; Dudek, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2010 | Interface fracture mechanics evaluation by correlation of experiment and simulation
Keller, J.; Maus, I.; Schlottig, G.; Pape, H.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2010 | Investigation of the Reliability of Electronic Components Under Combined Loads (Vibration, Humidity, Temperature)
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Konferenzbeitrag |
| 2010 | Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
Kallmayer, C.; Walter, H.; Aschenbrenner, R.; Michel, B. | Konferenzbeitrag |
| 2010 | Local stress measurement methods for packaging purposes- a comparison
Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2010 | Localized high-resolution stress measurements on MEMS structures
Vogel, D.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2010 | Low-temperature direct bonding of borosilicate, fused silica, and functional coatings
Eichler, M.; Michel, B.; Hennecke, P.; Gabriel, M.; Klages, C.-P. | Konferenzbeitrag |
| 2010 | Mechanism of moisture diffusion, hygroscopic swelling, and adhesion degradation in epoxy molding compounds
Shirangi, M.H.; Michel, B. | Aufsatz in Buch |
| 2010 | Miniaturized black body radiator for IR- Detector calibration - Design and development
Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2010 | Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2010 | Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 - property prediction in microelectronic packaging
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2010 | Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B. | Konferenzbeitrag |
| 2010 | Networking in micro/nano reliability research encouraged by EUCEMAN, the European center for micro- and nanoreliability
Hammacher, J.; Michel, B.; Winkler, T.; Kaulfersch, E. | Konferenzbeitrag |
| 2010 | Eine neue Methode zur Charakterisierung und Detektion der Degradation von Die-Attach Materialien durch In-Situ Zustandsüberwachung der thermischen Eigenschaften
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Konferenzbeitrag |
| 2010 | A new Method for Detection of Degradation in Die-Attach Materials by In-Situ Monitoring of Thermal Properties
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Aufsatz in Buch |
| 2010 | Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B. | Konferenzbeitrag |
| 2010 | Self-contained microfluidic cartridges for in-vitro diagnostic applications: Recent advances and improvements
Nestler, J.; Otto, T.; Sommer, J.-P.; Michel, B.; Gessner, T.; Bier, F.F. | Konferenzbeitrag |
| 2010 | Simulationsgestützte Zuverlässigkeitsbewertung im Mikro-Nano Übergangsbereich
Wittler, O.; Huber, S.; Mroßko, R.; Walter, H.; Auerswald, E.; Michel, B. | Konferenzbeitrag |
| 2010 | Smart Systems Integration and Reliability. Honorary Volume on the Occasion of Herbert Reichl's 65th Birthday
: Michel, B.; Lang, K.-D. | Buch |
| 2010 | Special issue of the 8th International Workshop on High Aspect Ratio Micro Structure Technology, HARMST 2009
Achenbach, S.; Klymyshyn, D.; Michel, B. | Zeitschriftenaufsatz |
| 2010 | Theoretical analysis on the shear test
Dudek, R.; Doering, R.; Kreyssig, K.; Michel, B. | Konferenzbeitrag |
| 2010 | VCCT and integral concepts of Bi-material interface fracture in low-K structures - going to understand relation
Auersperg, J.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2010 | Verfahren zur Bestimmung von Deformationen im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Maus, I.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2010 | Virtual prototyping advanced by statistic and stochastic methodologies
Rzepka, S.; Müller, A.; Michel, B. | Konferenzbeitrag |
| 2010 | Zerstörungsfreie Beobachtung von Rissen in Leiterplattendurchkontaktierungen - Quantisierung der Risslänge mittels Impulsthermographie und FEM-Simulation
Schacht, R.; Abo Ras, M.; May, D.; Wunderle, B.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2009 | Active components embedded into organic boards - Accelerated design by means of finite element simulation and micro deformation measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B. | Konferenzbeitrag |
| 2009 | Active components embedded into organic boards-accelerated design by means of finite element simulation and micro deformation measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B. | Konferenzbeitrag |
| 2009 | Advanced experimental and simulation approaches to meet reliability challenges of new electronics systems
Vogel, D.; Auersperg, J.; Michel, B. | Zeitschriftenaufsatz |
| 2009 | Advanced package design for electronic and MEMS applications supported by FE analyses and deformation measurements
Sommer, J.P.; Michel, B.; Kugler, A.; Rank, H. | Konferenzbeitrag |
| 2009 | Atmospheric-pressure plasma activation of silicon for MEMS packaging
Eichler, M.; Michel, B.; Hennecke, P.; Thomas, M.; Klages, C.-P. | Konferenzbeitrag |
| 2009 | Bondenergie-Messung in situ während des Temperns beim Direktbonden von Glas und Silizium
Eichler, M.; Michel, B.; Hennecke, P.; Klages, C.-P. | Konferenzbeitrag |
| 2009 | Characterisation and modelling of the nanoindentation experiment in Au layers
Wittler, O.; Mrossko, R.; Huber, S.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2009 | Comparison of bonding kinetics for borosilicate glass and silicon wafers by in situ fracture surface energy measurements during annealing
Eichler, M.; Michel, B.; Hennecke, P.; Klages, C.-P. | Konferenzbeitrag |
| 2009 | Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2009 | Crack and damage evaluation in low-k BEoL structures under CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2009 | Crack and delamination risk evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Konferenzbeitrag |
| 2009 | Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation
May, D.; Wunderle, B.; Schacht, R.; Michel, B. | Konferenzbeitrag |
| 2009 | Density and aging behavior of primary amino groups on afterglow plasma-treated low-density polyethylene (LDPE)
Lachmann, K.; Michel, B.; Klages, C.-P. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2009 | Detection of degradation in die-attach materials by in-situ monitoring of thermal properties
Wittler, O.; Nejadari, A.M.; Michel, B. | Konferenzbeitrag |
| 2009 | Determination of copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages
Shirangi, M.H.; Müller, W.H.; Michel, B. | Konferenzbeitrag |
| 2009 | Effect of nonlinear hygro-thermal and residual stresses on the interfacial fracture in plastic IC packages
Shirangi, M.H.; Müller, W.H.; Michel, B. | Konferenzbeitrag |
| 2009 | Effects of dielectric barrier discharges on silicon surfaces: Surface roughness, cleaning, and oxidation
Michel, B.; Giza, M.; Krumrey, M.; Eichler, M.; Grundmeier, G.; Klages, C.-P. | Zeitschriftenaufsatz |
| 2009 | Effects on silanol condensation during low temperature silicon fusion bonding
Eichler, M.; Michel, B.; Hennecke, P.; Klages, C.-P. | Zeitschriftenaufsatz |
| 2009 | Einsatz von Mikroplasmen für die Herstellung von Silizium-Mehrlagenaufbauten
Eichler, M.; Michel, B.; Gabriel, M.; Klages, C.-P. | Zeitschriftenaufsatz |
| 2009 | EUCEMAN - recent activities from the European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 2009 | Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2009 | Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
Courtois, B.; Michel, B. | Zeitschriftenaufsatz |
| 2009 | Hotspot-optimized interlayer cooling in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Reichl, H. | Konferenzbeitrag |
| 2009 | Influence of moisture on the time and temperature dependent properties of polymer systems
Walter, H.; Dermitzaki, E.; Shirangi, H.; Wunderle, B.; Hartmann, S.; Michel, B. | Konferenzbeitrag |
| 2009 | Influence of nano composites on reliability and mechanical properties of moisture sensors
Hammacher, J.; Saettler, P.; Kreyßig, K.; Martin, J.; Seiler, B.; Michel, B. | Konferenzbeitrag |
| 2009 | Interlayer cooling potential in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2009 | Investigations on the effect of dielectric barrier discharge (DBD) treatment as a preconditioning method for low temperature silicon wafer bonding
Michel, B.; Eichler, M.; Klages, C.-P. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2009 | Investigations on the plasma-surface interaction during DBD-treatment for low-temperature direct silicon wafer bonding
Michel, B.; Eichler, M.; Klages, C.-P. | Konferenzbeitrag |
| 2009 | Lifetime modelling for microsystems integration: From nano to systems
Wunderle, B.; Michel, B. | Zeitschriftenaufsatz |
| 2009 | Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
Michel, B.; Dudek, R.; Auersperg, J.; Winkler, T. | Zeitschriftenaufsatz |
| 2009 | Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages
Wunderle, B.; Wittler, O.; Walter, H.; Michel, B.; Shirangi, M.H. | Konferenzbeitrag |
| 2009 | Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2009 | Molecular dynamics simulation and mechanical characterisation for the establishment of structure-property correlations for epoxy resins in microelectronics packaging applications
Wunderle, B.; Dermitzaki, E.; Holck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Ratzke, K.; Faupel, F.; Michel, B. | Konferenzbeitrag |
| 2009 | MST special issue on the conference MicroNanoReliability 2007. Editorial
Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2009 | Multipin ac corona treatment - a new surface activation method for low temperature direct bonding
Michel, B.; Eichler, M.; Klages, C.-P. | Konferenzbeitrag |
| 2009 | Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz |
| 2009 | Reliability concepts of microsystem integration
Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2009 | Simulation based analysis of secondary effects on solder fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2009 | Simulation Based Analysis of Secondary Effects on Solder Fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B. | Konferenzbeitrag |
| 2009 | Structure Property Correlation of epoxy resins under the influence of moisture; and comparison of Diffusion coefficient with MD-simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B. | Konferenzbeitrag |
| 2009 | Study on the effect of moisture and elevated temperature on the fracture properties of visco elastic polymers
Walter, H.; Shirangi, H.; Dermitzaki, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2009 | Surface reactions controlled by dielectric barrier discharge at atmospheric pressure for high performance large-scale production
Eichler, M.; Thomas, M.; Borris, J.; Michel, B.; Klages, C.-P. | Konferenzbeitrag |
| 2009 | Testing and reliability issues in nanomechanics
Michel, B. | Konferenzbeitrag |
| 2009 | Thermo-mechanical reliability assessment for 3D through-Si stacking
Dudek, R.; Brämer, B.; Irsigler, R.; Rzepka, S.; Michel, B. | Konferenzbeitrag |
| 2009 | Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz |
| 2009 | Untersuchung der Aktivierungseffekte durch DBD bei Atmosphärendruck für das Tieftemperatur-Direktbonden
Michel, B.; Eichler, M.; Klages, C.-P. | Konferenzbeitrag |
| 2009 | Verfahren und Vorrichtung zur thermischen Ueberwachung von Ausfallprozessen
Wittler, O.; Wunderle, B.; Mazloum Nejadari, S.; Schacht, R.; Michel, B. | Patent |
| 2009 | Verfahren zum zwischenschichtfreien Verbinden von Substraten, Vorrichtung zur Durchfuehrung einer Plasmabehandlung sowie deren Verwendung
Klages, C.-P.; Michel, B.; Eichler, M. | Patent |
| 2009 | Virtual prototyping in microelectronics and packaging
Rzepka, S.; Dudek, R.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2008 | Advanced adhesives based on carbon nanotube technology
Fecht, H.-J.; Leson, A.; Michel, B.; Werner, M. | Zeitschriftenaufsatz |
| 2008 | Advanced adhesives based on carbon nanotube technology
Fecht, H.-J.; Leson, A.; Michel, B.; Werner, M. | Konferenzbeitrag |
| 2008 | Approaches of local stress measurement on microsystem devices
Vogel, D.; Auerswald, E.; Gollhardt, A.; Luczak, F.; Sabate, N.; Michel, B. | Konferenzbeitrag |
| 2008 | Atmospheric-pressure plasma pretreatment for direct bonding of silicon wafers at low temperatures
Eichler, M.; Michel, B.; Thomas, M.; Gabriel, M.; Klages, C.-P. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2008 | Challenges for multi-scale modeling of multiple failure modes in microelectronics
Auersperg, J.; Wunderle, B.; Dudek, R.; Walter, H.; Michel, B. | Konferenzbeitrag |
| 2008 | Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging
Auersperg, J.; Dudek, R.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2008 | Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds
Shirangi, H.; Auersperg, J.; Koyuncu, M.; Walter, H.; Müller, W.H.; Michel, B. | Konferenzbeitrag |
| 2008 | Deformation and stress measurement on electronic components with high spatial resolution
Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | Editorial to MST special issue: Colloquium on Micro-Production, Karlsruhe, Germany, November 2007
Kraft, O.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs
Schacht, R.; Wunderle, B.; May, D.; Abo Ras, M.; Faust, W.; Michel, B.; Reichel, H. | Konferenzbeitrag |
| 2008 | Experimental Methods of Thermal Validation and Optimization for Micro-electronic Assemblies Focusing on the Non-Destructive Failure Analysis Using Passive and Active IR-Thermography
Schacht, R.; May, D.; Kreyßig, K.; Wittler, O.; Wunderle, B.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2008 | FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings
Dudek, R.; Kaulfersch, E.; Rzepka, S.; Röllig, M.; Michel, B. | Konferenzbeitrag |
| 2008 | Forced Convection Interlay Cooling in Vertically Integrated Packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H. | Konferenzbeitrag |
| 2008 | High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2008 | In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2008 | Incorporating Advanced Fatigue and Fracture Mechanics Based Failure Analysis into Design-Optimization of Electronics Components
Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2008 | Investigation of fracture toughness and displacement fields of copper/polymer interface using image correlation technique
Shirangi, M.H.; Gollhardt, A.; Fischer, A.; Müller, W.H.; Michel, B. | Konferenzbeitrag |
| 2008 | Investigations of Reliability of Lead-Free Solder Joints
Faust, W.; Poller, T.; Dudek, R.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2008 | Kinetics of silanol condensation for low-temperature direct bonding
Eichler, M.; Michel, B.; Thomas, M.; Klages, C.-P. | Konferenzbeitrag |
| 2008 | Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2008 | Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography
May, D.; Wunderle, B.; Abo Ras, M.; Faust, W.; Gollhard, A.; Schacht, R.; Michel, B. | Konferenzbeitrag |
| 2008 | Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2008 | Mechanism of moisture diffusion, hygroscopic swelling and adhesion degradation in Epoxy Molding Compounds
Shirangi, M.H.; Fan, X.J.; Michel, B. | Konferenzbeitrag |
| 2008 | A method for reliability characterisation of die attach materials
Wittler, O.; Mazloum Nejadari, S.A.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | Micro- and nanoscale deformation measurements at interface crack tips
Keller, J.; Mayer, S.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2008 | MicroCar 2008: Micro materials, nano materials for automotives. Volume of abstracts
: Michel, B. | Tagungsband |
| 2008 | Microsecurity and nanosecurity - Security research using the advantages of smart system integration
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 2008 | Modelling Guidelines and Non-Destructive Analysis for Thermal and Mechanical Behaviour of Via-Structures in Organic Boards
Schacht, R.; Wunderle, B.; May, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2008 | Nano-Computertomographie - ein wertvolles Hilfsmittel bei metallographischen Untersuchungen zur Schadensanalyse mikroelektronischer und mikrotechnischer Komponenten
Faust, W.; Noack, E.; Michel, B. | Konferenzbeitrag |
| 2008 | Nanoreliability - Reliability Research for Microsystem Technology on the way from Micro to Nano
Michel, B.; Winkler, T.; Werner, M.; Fecht, H. | Zeitschriftenaufsatz |
| 2008 | Nanoscale deformation measurements - concepts for failure and reliability assessment at the nanoscale
Michel, B.; Gollhardt, A.; Keller, J. | Konferenzbeitrag |
| 2008 | Nanoscale resolution deformation measurements at crack tips of nanostructured materials and interface cracks
Keller, J.; Vogel, D.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2008 | Numerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology
Sommer, J.-P.; Noack, E.; Michel, B.; Becker, K.-F. | Konferenzbeitrag |
| 2008 | Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Kittel, H.; Michel, B. | Konferenzbeitrag |
| 2008 | Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B. | Konferenzbeitrag |
| 2008 | Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2008 | Reliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings
Dudek, R.; Ratchev, R.; Faust, W.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2008 | Reliability-solutions and concepts for applications in high-tech regions
Michel, B. | Aufsatz in Buch |
| 2008 | Residual stress measurements of high spatial resolution
Vogel, D.; Luczak, F.; Michel, B. | Konferenzbeitrag |
| 2008 | Residual Stress Measurements on Semiconductor Layers Utilizing Stress Relief Techniques
Vogel, D.; Lehr, M.U.; Grillberger, M.; Jaschke, V.; Geisler, H.; Gollhardt, A.; Luczak, F.; Michel, B. | Konferenzbeitrag |
| 2008 | Special Issue of the Conference Smart Sensors, Actuators and MEMS, Maspalomas, Gran Canaria, Spain, 2-4 May 2007
Michel, B.; Becker, T.; Schmid, U. | Zeitschriftenaufsatz |
| 2008 | Special issue of the high-aspect-ratio micro-structure technology workshop, HARMST'07. Editorial
Malek, C.K.; Saile, V.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2008 | Structure Property Correlation of Epoxy Resins Under the Influence of Moisture and Temperature; and Comparison of Diffusion Coefficient with MD-Simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B. | Konferenzbeitrag |
| 2008 | Study of Moisture Diffusion of Eppoxy Molding Compounds for Reliability Assessments of Plastic IC Packages
Shirangi, H.; Müller, W.H.; Michel, B. | Konferenzbeitrag |
| 2008 | Thermal test- and field cycling induced degradation and its Fe-based prediction for different SAC solders
Dudek, R.; Faust, W.; Ratchev, R.; Roellig, M.; Albrecht, H.-J.; Michel, B. | Konferenzbeitrag |
| 2008 | Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B. | Konferenzbeitrag |
| 2008 | Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B. | Konferenzbeitrag |
| 2008 | Through silicon via technology - processes and reliability for wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Klumpp, A.; Wieland, R.; Wunderle, B.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2008 | Vibration, Deformation and Reliability - an Overview about Measuring Techniques
Rümmler, N.; Schnitzer, R.; Michel, B. | Konferenzbeitrag |
| 2008 | Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A. | Konferenzbeitrag |
| 2008 | Zuverlässigkeits-Lösungsansätze und Konzepte für Anwendungen im Hightech Bereich
Michel, B. | Aufsatz in Buch |
| 2007 | Charakterisierungsmethodik für dünne Schichten im Sub-Mikrometerbereich
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B. | Konferenzbeitrag |
| 2007 | Design, test, integration and packaging of MEMS/MOEMS, 2006
Michel, B.; Courtois, B. | Konferenzbeitrag |
| 2007 | Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B. | Konferenzbeitrag |
| 2007 | Effects of dielectric barrier discharge treatment on the surface of silicon wafers
Michel, B.; Eichler, M.; Klages, C.-P. | Konferenzbeitrag |
| 2007 | Einsatz von Atmosphärendruck-Mikroplasmen für die Aufbau- und Verbindungstechnik
Eichler, M.; Michel, B.; Thomas, M.; Klages, C.-P. | Konferenzbeitrag |
| 2007 | EUCEMAN - The European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2007 | EUCEMAN - The European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Experimental characterization of thin Copper foils
Auerswald, E.; Walter, H.; Wittler, O.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2007 | Experimental Determination of Fracture Parameters Within Small Regions by AFM Techniques
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | Experimental Vibration Analyses by Laser Vibrometer under Vacuum Conditions
Schnitzer, R.; Rümmler, N.; Dost, Mi.; Michel, B.; Hauck, T. | Konferenzbeitrag |
| 2007 | Experimental Vibration and Deformation Analyses for Increase Micro-Structure Reliability
Rümmler, N.; Schnitzer, R.; Michel, B. | Konferenzbeitrag |
| 2007 | Failure Analysis of Microelectronic Packages by Pulse IR Thermography
Wunderle, B.; May, D.; Schacht, R.; Michel, B. | Abstract |
| 2007 | Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B. | Konferenzbeitrag |
| 2007 | Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B. | Zeitschriftenaufsatz |
| 2007 | FIB Based Local Residual Stress Measurement - Potentials and Challenges
Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | FIB-based technique for stress characterization on thin films for reliability purposes
Sabaté, N.; Vogel, D.; Keller, J.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cané, C.; Michel, B. | Zeitschriftenaufsatz |
| 2007 | Focused Ion Beam (FIB) as an Analytical Tool in Micro- and Nanotechnology
Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2007 | Fracture, delamination and fatigue evaluation within RSM/DOE concepts of enhanced smart systems
Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2007 | Fully integrated one phase liquid cooling system for organic boards
May, D.; Wunderle, B.; Schindler-Saefkow, F.; Nguyen, B.; Schacht, R.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | HARMST, High Aspect Ratio Micro Structure Technology Workshop. Editorial
Kwon, T.H.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | In die Leiterplatte integrierte ICs - Verformungsanalyse mit numerischen und messtechnischen Methoden
Sommer, J.-P.; Noack, E.; Seiler, B.; Michel, B. | Konferenzbeitrag |
| 2007 | In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Dudek, R.; Faust, W.; Döring, R.; Michel, B. | Konferenzbeitrag |
| 2007 | Localized stress measurements - a new approach covering needs for advanced micro and nanoscale system development
Vogel, D.; Gollhardt, A.; Sabate, N.; Keller, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Lokale Eigenspannungsmessung im FIB - Potential und Herausforderung
Vogel, D.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions
Dudek, R.; Faust, W.; Wiese, S.; Röllig, M.; Michel, B. | Konferenzbeitrag |
| 2007 | Measurement of stresses in MEMS structures by stress release
Vogel, D.; Sabate, N.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2007 | Messung von Bruchkenngrößen in sehr kleinen Werkstoffbereichen mit dem AFM
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | A methodology to characterise thin films in the sub-micron range
Wittler, O.; Mroßke, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Micro- and Nanosecurity - Security by Miniaturization in MST
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 2007 | Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique, in Micro- and Opto-Electronic Materials and Structures
Michel, B.; Keller, J. | Aufsatz in Buch |
| 2007 | Microsecurity, Nanosecurity - Security Research in Europa Utilizing Advanced Micro- and Nanotechnologies
Michel, B.; Winkler, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Microsecurity, Nanosecurity - Sicherheitsforschung in Europa unter Verwendung von Methoden der Mikro- und Nanotechnologien
Michel, B.; Winkler, T. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Microstucture of Damaged Solder
Faust, W.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2007 | MMCB - The Micro Materials Center Berlin and Chemnitz at Fraunhofer IZM
Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Molecular Dynamics Simulation and Mechanical Characterisation of Epoxy Resins Examined at Different Temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Molecular dynamics simulation for the diffusion of water in amorphous polymers examined at different temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Nano-Reliability within the Framework of Fraunhofer Marked-Oriented Nano-Scale Activities
Sommer, J.-P.; Michel, B.; Petzold, M.; Schönecker, A.; Kusnezoff, M.; Wunderle, B. | Konferenzbeitrag |
| 2007 | NanoDAC - Object deformation measurements for micro and nanotechnology applications
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | Nanodeformation Measurements for Reliability Studies of Nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | Nanoreliability - Reliability Concepts for Micro-Nano Interface Regions
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Nanoreliability - Zuverlässigkeitskonzepte für den Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Nanoscale deformation measurements for reliability assessment of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2007 | Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Numerical Analysis for Thermo-Mechanical Reliability of Polymers in Electronic Packaging
Dudek, R.; Walter, H.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2007 | Optimization and robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Klein, M.; Michel, B. | Konferenzbeitrag |
| 2007 | Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
Auersperg, J.; Klein, M.; Michel, B. | Konferenzbeitrag |
| 2007 | Progressing from Micro to Nanoreliability in System Integration
Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2007 | Pulse and Lock-In Infrared Thermography - Possibilities for Non-Destructive Reliability Analysis of Micro-Electronic Assemblies
May, D.; Schacht, R.; Wunderle, B.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Reliability analysis for smart systems on the way from micro to nano
Michel, B.; Auersperg, J.; Vogel, D. | Konferenzbeitrag |
| 2007 | Reliability of SnPb and Pb-free flip-chips under different test conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B. | Zeitschriftenaufsatz |
| 2007 | Reliablility of SnPb and Pb-Free Flip-Chips under Different Test Conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B. | Zeitschriftenaufsatz |
| 2007 | Residual stress measurement on a MEMS structure with high-spatial resolution
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B. | Zeitschriftenaufsatz |
| 2007 | Schadensanalyse in der AVT am Beispiel bleifreier Lotverbindungen
Faust, W.; Dudek, R.; Michel, B.; Poller, T. | Konferenzbeitrag |
| 2007 | Silizium-Aktivierung für das Tieftemperatur-Waferbonden mit Barrierenentladung
Michel, B.; Eichler, M.; Klages, C.-P. | Konferenzbeitrag |
| 2007 | System Integration on Wafer Level - Requirements and Technical Solutions
Wolf, M.J.; Michel, B.; Ramm, P.; Reichl, H. | Konferenzbeitrag |
| 2007 | A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2007 | Testing of Microcomponents
Michel, B.; Walter, H. | Aufsatz in Buch |
| 2007 | Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2007 | Towards a robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2007 | Zuverlässigkeit für elektronische Bauelemente mit hoher Packungsdichte
Sommer, J.-P.; Dudek, R.; Michel, B.; Noack, E.; Seiler, B. | Konferenzbeitrag |
| 2007 | Zuverlässigkeitsprobleme im Hightech-Bereich - Lösungsansätze und Konzepte
Michel, B. | Aufsatz in Buch |
| 2006 | 3D-PCB-Packages mit Wasserkühlung für High-Power-Anwendungen
Schindler-Saefkow, F.; Schramm, H.; Schacht, R.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2006 | 3D-PCB-packaging technology for high power applications with water cooling
Schindler-Saefkow, F.; May, D.; Wunderle, B.; Schacht, R.; Michel, B. | Konferenzbeitrag |
| 2006 | Accelerated active high-temperature cycling test for power MOSFETs
Schacht, R.; Wunderle, B.; Auerswald, E.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2006 | Advanced packages with buried dies
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B. | Konferenzbeitrag |
| 2006 | AFM based fracture analysis in micro- and nanomaterials
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2006 | Ambient pressure plasma activation for low temperature bonding
Eichler, M.; Michel, B.; Thomas, M.; Klages, C.-P.; Ruddy, C.; Reinecke, H.; Reiche, M.; Radu, I.; Gabriel, M. | Konferenzbeitrag |
| 2006 | Bestimmung der Querkontraktionszahl von Polymeren in Abhängigkeit von der Temperatur mit Hilfe des UNIDAC-Verfahrens
Walter, H.; Seiler, B.; Bombach, C.; Michel, B. | Konferenzbeitrag |
| 2006 | Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications
Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2006 | Characterization of thermal interface materials
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2006 | Characterization of thermal interface materials to support thermal simulation
Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2006 | Colloquium on Micro Production, Aachen, Germany, 2-3 March 2005
Gatzen, H.H.; Michel, B. | Abstract |
| 2006 | Combined fracture, delamination risk and fatigue evaluation of advanced microelectronics applications towards RSM/DOE concepts
Auersperg, J.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2006 | Deformation and fatigue behaviour of AuSn interconnects
Wittler, O.; Walter, H.; Dudek, R.; Faust, W.; Jun, W.; Michel, B. | Konferenzbeitrag |
| 2006 | Design, test, integration and packaging of MEMS/MOEMS, 2005
Courtois, B.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2006 | Diffusion of water in amorphous polymers at different temperatures using molecular dynamics simulation
Dermitzaki, E.; Bauer, J.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2006 | Digital image correlation of nanoscale deformation fields for local stress measurement in thin films
Sabate, N.; Vogel, D.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cane, C.; Michel, B. | Zeitschriftenaufsatz |
| 2006 | Effects of dielectric barrier discharge treatment on surface chemistry of silicon wafers
Michel, B.; Eichler, M.; Klages, C.-P. | Konferenzbeitrag |
| 2006 | Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A. | Konferenzbeitrag |
| 2006 | Energy dispersive X-ray diffraction
Kämpfe, B.; Luczak, F.; Michel, B. | Zeitschriftenaufsatz |
| 2006 | Experimental investigation for fracture analysis of solder joints in microelectronic and mems applications
Walter, H.; Bombach, C.; Dudek, R.; Faust, W.; Michel, B. | Konferenzbeitrag |
| 2006 | Experimentelle Charakterisierung von Thermischen Interface Materialien für die thermische Simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2006 | Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B. | Konferenzbeitrag |
| 2006 | A FE-study of solder fatigue compared to microstructural damage evaluation by in-situ laser scanning and FIB microscopy
Dudek, R.; Faust, W.; Gollhard, A.; Michel, B. | Konferenzbeitrag |
| 2006 | FIB based measurement of local residual stresses on microsystems
Vogel, D.; Sabate, N.; Gollhardt, A.; Keller, J.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2006 | FibDAC - residual stress determination by combination of focused ion beam technique and digital image correlation
Keller, J.; Gollhardt, A.; Vogel, D.; Auerswald, E.; Sabate, N.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2006 | High-resolution stress measurements for microsystem and semiconductor applications
Vogel, D.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2006 | Interface-Risse in Komponenten der Mikro- und Nanoelektronik
Auersperg, J.; Michel, B.; Walter, H. | Konferenzbeitrag |
| 2006 | Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale
Wunderle, B.; Dudek, R.; Vogel, D.; Michel, B. | Abstract |
| 2006 | Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysis
Deplanque, S.; Nüchter, W.; Wunderle, B.; Schacht, R.; Michel, B. | Konferenzbeitrag |
| 2006 | Measurement of residual stress by slot milling with focused ion-beam equipment
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B. | Zeitschriftenaufsatz |
| 2006 | Measurement of residual stresses in micromachined structures in a microregion
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B.; Cane, C.; Gracia, I.; Morante, J.R. | Zeitschriftenaufsatz |
| 2006 | Microelectronics to Nanoelectronics - Reliability and Packaging Considerations
Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2006 | NanoDAC/fibDAC - Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2006 | Nanoscale Deformation Measurements for Reliability Assessment of Material Interfaces
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2006 | Nanoscale Deformation Measurements to Improve Reliability Assessment of Sensors and MEMS
Michel, B.; Keller, J.; Walter, H. | Konferenzbeitrag |
| 2006 | A new method for local strain field analysis near cracks in micro- and nanotechnology applications
Michel, B.; Vogel, D.; Sabaté, N.; Lieske, D. | Konferenzbeitrag |
| 2006 | Patterned DBD pretreatment at ambient pressure for low temperature wafer bonding
Eichler, M.; Michel, B.; Thomas, M.; Ruddy, C.; Reinecke, H.; Reiche, M.; Gabriel, M.; Klages, C.-P. | Konferenzbeitrag |
| 2006 | Progress in reliability research in the micro and nano region
Wunderle, B.; Michel, B. | Konferenzbeitrag, Zeitschriftenaufsatz |
| 2006 | Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging
Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2006 | Simulation of Interface Cracks in Microelectronic Packaging
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2006 | Solder Fatigue at High-Power IGBT Modules
Sommer, J.-P.; Licht, T.; Berg, H.; Appelhoff, K.; Michel, B. | Konferenzbeitrag |
| 2006 | Thermal management in a 3D-PCB-package with water cooling
Schindler-Saefkow, F.; Wittler, O.; May, D.; Michel, B. | Konferenzbeitrag |
| 2006 | Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging
Dudek, R.; Walter, H.; Döring, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H. | Konferenzbeitrag |
| 2006 | Verfahren zur Erfassung von lokalen Eigenspannungen in Festkoerperobjekten mit einer Ionenstrahltechnik
Auersperg, J.; Lieske, D.; Keller, J.; Vogel, D.; Michel, B.; Gollhardt, A.; Dost, M. | Patent |
| 2006 | Zuverlässige Bauteile mit neuen Werkstoffen
Michel, B. | Aufsatz in Buch |
| 2006 | Zuverlässigkeitsprognostik von in der Leiterplatte integrierten Chips
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B. | Konferenzbeitrag |
| 2005 | "Microreliability", "Nanoreliability" - Zuverlässigkeitsbewertung von Mikro- und Nanokomponenten unter Anwendung der Bruchmechanik
Michel, B. | Konferenzbeitrag |
| 2005 | 3D deformation analysis of flow and gas sensors membranes for reliability assessment
Sabate, N.; Keller, J.; Gollhardt, A.; Vogel, D.; Gracia, I.; Cane, C.; Morante, J.R.; Michel, B. | Konferenzbeitrag |
| 2005 | Accelerated failure test for high temperature applications of power MOSFETs by power cycling
Schacht, R.; Auerswald, E.; Sommer, J.-P.; Wunderle, B.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2005 | Characterization of nanoscale modified polymers for automotive applications
Vogel, D.; Gollhardt, A.; Keller, J.; Holst, M.; Muzic, M.; Michel, B. | Abstract |
| 2005 | Characterization of thermal interface materials for thermal simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2005 | Combination of nanoDAC and FEM for reliability analysis of materials in the micro-nano-transition scale
Kaulfersch, E.; Keller, J.; Michel, B. | Abstract |
| 2005 | A combined simulative and experimental approach to reliability optimization of MEMS
Wittler, O.; Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2005 | A comparative study of solder fatigue evaluated by microscopic in-situ analysis, on-line resistance measurement and FE calculations
Dudek, R.; Faust, W.; Vogel, J.; Michel, B. | Konferenzbeitrag |
| 2005 | Crack and delamination risk evaluation of thin silicon based microelectronics devices
Auersperg, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2005 | Damage and failure analysis of lead-free solder interconnects in automotive electronics
Faust, W.; Kreyßig, K.; Michel, B. | Abstract |
| 2005 | Deformation field measurement on micro and nanotechnology components utilizing SFM and FIB equipment
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2005 | Design methodology of microstructures for enhanced mechanical reliability
Wittler, O.; Walter, H.; Vogel, D.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2005 | Digital image correlation - a versatile experimental tool to improve reliability, security and lifetime
Dost, M.; Seiler, B.; Erb, R.; Michel, B. | Abstract |
| 2005 | Experimental mechanics on the way from micro to nano
Michel, B. | Zeitschriftenaufsatz |
| 2005 | FE analysis and experimental testing of a 4-pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints
Spraul, M.; Nüchter, W.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2005 | FIB based Measurements for Material Characterization on MEMS Structures
Vogel, D.; Lieske, D.; Gollhardt, A.; Keller, J.; Sabaté, N.; Morante, J.R.; Michel, B. | Konferenzbeitrag |
| 2005 | fibDAC - A new Approach of Material Characterization for the Transition from Micro to Nano Scale
Vogel, D.; Sabaté, N.; Keller, J.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2005 | Fracture and Fatigue Behaviour of MEMS related Micro Materials
Walter, H.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2005 | Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2005 | Identification of Fitted Viscoelastic Material Parameters of Adhesives in Automotive Applications for Numerical Simulations using Genetic Algorithms
Göhler, J.; Michel, B.; Schaper, M.K. | Konferenzbeitrag |
| 2005 | Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes
Schreier-Alt, T.; Sehnert, J.; Rebholz, C.; Michel, B.; Ansorge, F. | Konferenzbeitrag |
| 2005 | Micro and nanomechanical Deformation Analysis at Materials Interfaces
Keller, J.; Michel, B. | Konferenzbeitrag |
| 2005 | Microreliability, Nanoreliability - Reliability approach for the micro-nano interface region
Michel, B. | Konferenzbeitrag |
| 2005 | Microreliability, Nanoreliability- Zuverlässigkeitsbewertung von Polymer-Verbundsystemen im Mikro- und Nanobereich
Michel, B. | Konferenzbeitrag |
| 2005 | Mikroprüftechnik
Michel, B.; Walter, H. | Aufsatz in Buch |
| 2005 | Die Möglichkeiten der FIB-Technik bei der Schadensanalyse bleifreier Lote
Faust, W.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2005 | Nanodac - a method for fracture mechanical characterization on the nanoscale
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2005 | Nanodeformation analysis near small cracks by means of nanoDAC technique
Michel, B.; Keller, J. | Konferenzbeitrag |
| 2005 | Nanoreliability - lifetime estimation for nanotechnology applications based on nanoDAC and FIBDAC techniques
Michel, B.; Keller, J. | Konferenzbeitrag |
| 2005 | Nanoreliability for mechanically loaded devices
Vogel, D.; Sabate, N.; Wunderle, B.; Keller, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2005 | Nanoreliability-combined simulation and testing
Michel, B. | Konferenzbeitrag |
| 2005 | Nanoscale deformation measurements for reliability analysis of sensors
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2005 | A new approach to micro deformation analysis by finite element based digital image correlation
Kühnert, R.; Meyer, R.; Vogel, D.; Michel, B. | Abstract |
| 2005 | Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Roellig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B. | Konferenzbeitrag |
| 2005 | Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Röllig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B. | Konferenzbeitrag |
| 2005 | Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A. | Konferenzbeitrag |
| 2005 | Packaging reliability research on the way from micro to nano
Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2005 | Probabilistic Approaches for Fracture and Reliability Estimations of Microsystems
Winkler, T.; Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2005 | Prüfung und Zuverlässigkeitsbewertung für die Mikrosystemtechnik im Mikro- und Nanobereich
Michel, B.; Keller, J. | Konferenzbeitrag |
| 2005 | Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
Déplanque, S.; Nüchter, W.; Spraul, M.; Wunderle, B.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2005 | Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F. | Konferenzbeitrag |
| 2005 | Reliability on the Micro- and Nano-Scale - Experiment and Simulation
Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2005 | Reliability Testing of Polytronics Components in the Micro-Nano Region
Michel, B.; Dudek, R.; Walter, H. | Konferenzbeitrag |
| 2005 | Testing at Micro and Nanoscale
Michel, B. | Konferenzbeitrag |
| 2005 | Thermal Analysis of Electronic Components and Systems
Wittler, O.; Schacht, R.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2005 | Thermal and mechanical reliability analysis of an anisotropic magneto-resistive current measurement sensor
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Doering, R.; Hoelzl, J.; Michel, B. | Konferenzbeitrag |
| 2005 | Thermal Lap Shear Tests on MEMS Interconnect Solder joints
Vogel, J.; Dudek, R.; Faust, W.; Dost, M.; Michel, B. | Konferenzbeitrag |
| 2005 | Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2005 | Thermo-mechanical and fracture mechanical characterization of lead-free solder joints in microelectronics
Walter, H.; Déplanque, S.; Nüchter, W.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2005 | Thermo-mechanical design for reliability of WLPs with compliant interconnects
Dudek, R.; Walter, H.; Doering, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H. | Konferenzbeitrag |
| 2005 | Thermo-mechanical reliability analysis on solder joints of ceramic components
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F. | Konferenzbeitrag |
| 2005 | A Tribute to Albert Einstein
: Michel, B. | Zeitschriftenheft |
| 2005 | Vibration Analyses for Function and Reliability Estimation of Automotive Sensors by Laser Vibrometry
Rümmler, N.; Schnitzer, R.; Dost, Mi.; Michel, B. | Konferenzbeitrag |
| 2005 | Vibration measurements on smart electronic structures by means of laser techniques
Ruemmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E. | Konferenzbeitrag |
| 2005 | Zuverlässigkeit von Komponenten der Mikrosystemtechnik durch Einbeziehung von Nanoanalytik und Nanomechanik
Michel, B.; Wunderle, B.; Gollhardt, A.; Bombach, C.; Keller, J. | Konferenzbeitrag |
| 2005 | Zuverlässigkeitskonzepte von "Mikro bis Nano" - Neue Anforderungen und Möglichkeiten der Zuverlässigkeitsbewertung für die Mikrosystemtechnik
Michel, B. | Konferenzbeitrag |
| 2004 | Bragg Gitter in Polymer- und Glasfasern
Alt, T.; Badstübner, K.; Ansorge, F.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2004 | Characterization approaches of nanoscale modified plastics
Vogel, D.; Keller, J.; Michel, B.; Holst, M.; Muzic, M. | Konferenzbeitrag |
| 2004 | Characterization of materials with nanoscopic filler particles by AFM techniques
Vogel, D.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2004 | Characterization of microcracks by application of digital image correlation to SPM images
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches
Auersperg, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Determination of local stress intensity factor at crack tip using image correlation techniques
Tsai, Y.; Keller, J.; Eylon, D.; Vogel, D.; Michel, B.; Meyendorf, N. | Konferenzbeitrag |
| 2004 | Displacement and strain field measurements from SPM images
Keller, J.; Vogel, D.; Schubert, A.; Michel, B. | Aufsatz in Buch |
| 2004 | Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimen
Deplanque, S.; Nüchter, W.; Wunderle, B.; Walter, H.; Michel, B. | Konferenzbeitrag |
| 2004 | FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Dudek, R.; Walter, H.; Döring, R.; Michel, B. | Aufsatz in Buch |
| 2004 | Fracture mechanical characterization of micro- and nano-filled polymers by a combined experimental and simulative procedure
Wunderle, B.; Dermitzaki, E.; Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | In-situ solder fatigue studies using a thermal lap shear test
Dudek, R.; Faust, W.; Vogel, J.; Michel, B. | Konferenzbeitrag |
| 2004 | Investigations on the reliability of lead-free CSP subjected to harsh environments
Dudek, R.; Döring, R.; Michel, B. | Konferenzbeitrag |
| 2004 | Materials mechanics for system integration and packaging
: Michel, B. | Zeitschriftenheft |
| 2004 | MicroDAC - ein Messverfahren zur Ermittlung von Werkstoffeigenschaften im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Microreliability, nanoreliability - issues for MEMS
Michel, B. | Aufsatz in Buch |
| 2004 | Microsecurity - important capabilities for homeland security challenges
Michel, B.; Winkler, T. | Zeitschriftenaufsatz |
| 2004 | Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B. | Zeitschriftenaufsatz |
| 2004 | Nanodac - an SPM-based nanodeformation measurement technique for reliability assessment of micro- and nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Parametric FE-approach to flip-chip reliability under various loading conditions
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz |
| 2004 | Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2004 | Reliability in Experiment and Simulation on the Micro- and Nano Scale
Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2004 | Reliability of SnPb and PB-free flip-chips under different test conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B. | Konferenzbeitrag |
| 2004 | Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F. | Konferenzbeitrag |
| 2004 | Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F. | Konferenzbeitrag |
| 2004 | Thermal fatigue modelling for SnAgCu and SnPb solder joints
Dudek, R.; Walter, H.; Döring, R.; Michel, B. | Konferenzbeitrag |
| 2004 | Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B. | Konferenzbeitrag |
| 2004 | Thermo-mechanical reliability of power flip-chip cooling concepts
Wunderle, B.; Dudek, R.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2004 | Vibration and Deformation Measurements of smart Electronic Structures by means of Laser Techniques
Rümmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E. | Aufsatz in Buch |
| 2004 | The world of electronic packaging and system integration
: Michel, B.; Aschenbrenner, R. | Buch |
| 2004 | Zuverlässigkeitsaspekte in Chip-in-Polymer-Applikationen
Auersperg, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2004 | Zuverlässigkeitsbewertung elektronischer Baugruppen mit modernen Mikro- und Nanomesstechniken in Kopplung zur Simulation
Michel, B.; Dudek, R.; Keller, J.; Luczak, F. | Konferenzbeitrag |
| 2003 | Bestimmung der Querkontraktionszahl von Polymeren mittels Laserextensometrie und Grauwertkorrelationsanalyse
Walter, H.; Vogel, D.; Michel, B.; Grellmann, W.; Bierögel, C. | Konferenzbeitrag |
| 2003 | Challenges of advanced mechanical micro testing techniques
Walter, H.; Grellmann, W.; Seidler, S.; Michel, B. | Abstract |
| 2003 | Combining DIC techniques and finite element analysis for reliability assessment on micro and nano scale
Vogel, D.; Dudek, R.; Keller, J.; Michel, B. | Konferenzbeitrag |
| 2003 | Comparison of lifetime predictions with 3D finite element models of a high density flip chip without underfill on LTCC
Spraul, M.; Nüchter, W.; Möller, A.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2003 | Continuation and change
Michel, B.; Bhushan, B. | Zeitschriftenaufsatz |
| 2003 | Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Konferenzbeitrag |
| 2003 | Design von Kunststoffbaugruppen mit Unterstützung durch Finite-Elemente-Analysen
Michel, B.; Sommer, J.-P. | Konferenzbeitrag |
| 2003 | Evaluating microdefect structures by AFM-based deformation measurement
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2003 | Fluidisch-Elektrisch-Thermisches 3D-Package mit Match-X Schnittstelle
Schindler-Saefkow, F.; May, D.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 2003 | High temperature degradation of Pt/Ti electrodes in micro-hotplate gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R. | Zeitschriftenaufsatz |
| 2003 | How to detect Edgar Allan Poe's 'purloined letter' - Or: Cross correlation algorithms in digitised video images for object identification, movement evaluation and deformation analysis
Dost, M.; Vogel, D.; Winkler, T.; Vogel, J.; Erb, R.; Kieselstein, E.; Michel, B. | Konferenzbeitrag |
| 2003 | Investigations on low cycle fatigue of electrodeposited thin copper and nickel films
Dudek, R.; Walter, H.; Michel, B.; Zapf, J. | Konferenzbeitrag |
| 2003 | The Micro Materials Center Berlin (MMCB)
Michel, B.; Winkler, T. | Abstract |
| 2003 | Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments
Kaulfersch, E.; Vogel, D.; Michel, B. | Zeitschriftenaufsatz |
| 2003 | Morphologie-Zähigkeits-Korrelationen an modifizierten Epoxidharzsystemen mittels bruchmechanischer Prüfmethoden an Miniaturprüfkörpern
Walter, H.; Michel, B.; Bierögel, C.; Grellmann, W. | Konferenzbeitrag |
| 2003 | nanoDAC - A Method of Reliability Analysis for Micro and Nano Technology
Vogel, D.; Michel, B. | Abstract |
| 2003 | Nanomechanics for Electronics in Automotive Application
Keller, J.; Michel, B. | Konferenzbeitrag |
| 2003 | Reliability Evaluations of Lead Free Soldered Packages
Walter, H.; Auerswald, E.; Schubert, A.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2003 | Reliability of micro- and nanosystems
Michel, B. | Konferenzbeitrag |
| 2003 | Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B. | Zeitschriftenaufsatz |
| 2003 | Schadensanalyse an Komponenten der Mikrosystemtechnik und Mikroelektronik
Faust, W.; Dost, M.; Michel, B. | Konferenzbeitrag |
| 2003 | A severe loss. In memoriam Dr.-Ing. Andreas Schubert
Michel, B. | Zeitschriftenaufsatz |
| 2003 | Simulation and reliability on the way from micro to nano
Michel, B.; Wunderle, B. | Konferenzbeitrag |
| 2003 | Thermal and mechanical analysis of micromachined gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R. | Zeitschriftenaufsatz |
| 2003 | Thermal management in stacks of MATCH-X MOEMS
Schindler-Saefkow, F.; Wittler, O.; May, D.; Schacht, R.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 2003 | Thermal performance, mechanical reliability and technological features of different cooling concepts for high power chip modules
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2003 | Thermo-mechanical reliability aspects and finite element simulation in packaging
Dudek, R.; Auersperg, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2003 | Zuverlässigkeitsbewertung von MEMS-Komponenten im Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Auersperg, J. | Konferenzbeitrag |
| 2002 | a46Parametric FE-approach to flip chip reliability under various loading situations
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2002 | Delamination risk evaluation for plastic packages based on mixed mode fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Zeitschriftenaufsatz |
| 2002 | Determination of packaging material properties utilizing image correlation techniques
Vogel, D.; Kühnert, R.; Dost, M.; Michel, B. | Zeitschriftenaufsatz |
| 2002 | Displacement and strain field measurements for nanotechnology applications
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2002 | Fracture mechanical characterization of polymers on nano scale by means of grey scale correlation
Keller, J.; Vogel, D.; Gollhardt, A.; Bauer, M.; Michel, B. | Konferenzbeitrag |
| 2002 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 2001/2002
: Michel, B. | Elektronische Publikation, Jahresbericht |
| 2002 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2001/2002
: Michel, B.; Winkler, T.; Hinkel, O. | Jahresbericht |
| 2002 | Generalized fracture mechanical integral concept J/sub G/ and its application in microelectronic packaging technology
Badri Ghavifekr, H.; Michel, B. | Zeitschriftenaufsatz |
| 2002 | Lead-free solder interconnects - characterization, testing and reliability
Schubert, A.; Dudek, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.; Schuch, B. | Konferenzbeitrag |
| 2002 | Micro & nanoDAC - A powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D. | Konferenzbeitrag |
| 2002 | Micro andnanoDAC - a powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D. | Konferenzbeitrag |
| 2002 | Micro Materials Center Berlin - materials research for MEMS packaging
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 2002 | Micro Materials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 2002 | Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B. | Zeitschriftenaufsatz |
| 2002 | Micro/nanoDAC deformation measurement to analyze packaging components response to thermo-mechanical load
Vogel, D.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2002 | Micromaterials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 2002 | A modular fluidic demonstrator for the Match-X framework
Schindler-Saefkow, F.; Amiri Jam, K.; Luczak, F.; Großer, V.; Michel, B.; Günther, G. | Konferenzbeitrag |
| 2002 | NanoDAC - A powerful method for nanomechanical analysis of polymeric materials
Keller, J.; Vogel, D.; Bauer, M.; Michel, B. | Konferenzbeitrag |
| 2002 | Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
Auersperg, R.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2002 | Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2002 | Special issue containing selected papers from the E-MRS proceedings of symposium-j - materials in microtechnologies and microsystems - Strasbourg, France - june 5-8, 2001. Preface
Morante, J.R.; Barbier, D.; Michel, B. | Zeitschriftenaufsatz |
| 2002 | Special issue on Poly'2000, London - Foreword
Michel, B.; Kishimoto, K. | Zeitschriftenaufsatz |
| 2002 | Studies on moisture diffusion and popcorn cracking
Dudek, R.; Walter, H.; Michel, B. | Konferenzbeitrag |
| 2002 | Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 2001 | Application of electroplating in MEMS-micromachining exemplified by a microrelay
Becker, M.; Notarp, D.L.; Vogel, J.; Kieselstein, E.; Sommer, J.P.; Brämer, K.; Grosser, V.; Benecke, W.; Michel, B. | Zeitschriftenaufsatz |
| 2001 | Characterization of electronic packaging materials and components by image correlation methods
Vogel, D.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2001 | Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Meusel, E.; Michel, B. | Konferenzbeitrag |
| 2001 | Deformations- und Bruchverhalten von Mikrobauteilen aus Polymerverbunden
Michel, B.; Vogel, D.; Auersperg, J. | Konferenzbeitrag |
| 2001 | Experimentelle und numerische Methoden zur Charakterisierung von Mikrobauteilen
Sommer, J.-P.; Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B. | Konferenzbeitrag |
| 2001 | Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O.; Sprafke, P.; Auersperg, J.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | Fracture mechanics characterisation of epoxy resins by means of mini-compact-tension-specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Henning, H.; Michel, B. | Konferenzbeitrag |
| 2001 | Fracture mechanics testing of modified epoxy resins with mini-compact tension (CT) specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Fedtke, M.; Michel, B. | Aufsatz in Buch |
| 2001 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2000
: Michel, B.; Winkler, T.; Hinkel, O. | Jahresbericht |
| 2001 | From modular MEMS to a modular microfactory - the hybrid microfactory?
Großer, V.; Michel, B.; Schuenemann, M.; Reichl, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | Gains and challenges of parameterized finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | In-situ-Messungen an Komponenten der Mikroelektronik und Mikrosystemtechnik mit optischen Methoden
Faust, W.; Bombach, C.; Pritzke, B.; Michel, B. | Konferenzbeitrag |
| 2001 | Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Zeitschriftenaufsatz |
| 2001 | Interface cracks and reliability in microsystems
Michel, B.; Auersperg, J.; Schubert, A.; Kühnert, R. | Konferenzbeitrag |
| 2001 | Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2001 | Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | Life time prediction on polymer encapsulated components
Sonner, M.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | Lifetime prediction of extended flip-chip packages under thermal and mechanical loading
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2001 | Mechanical reliability of MEMS-structures under shock load
Wagner, U.; Franz, J.; Schweiker, M.; Bernhard, W.; Müller-Fiedler, R.; Michel, B.; Paul, O. | Zeitschriftenaufsatz |
| 2001 | Messung von Materialkennwerten an Komponenten der Mikrotechnik
Vogel, D.; Sommer, J.-P.; Großer, V.; Michel, B. | Zeitschriftenaufsatz |
| 2001 | Micro materials Center Berlin
Michel, B.; Schubert, A.; Winkler, T. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | Microcrack evaluation for electronics components by AFM nano-DAC deformation measurements
Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2001 | The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability
Michel, B.; Dudek, R.; Vogel, D. | Konferenzbeitrag |
| 2001 | MicroDAC strain measurement for electronics packaging structures
Vogel, D.; Grosser, V.; Schubert, A.; Michel, B. | Zeitschriftenaufsatz |
| 2001 | Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2001 | Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2001 | mTest - A new approach to measure material properties from microscopic specimens
Vogel, D.; Gollhardt, A.; Walter, H.; Dudek, R.; Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 2001 | Ongoing research in the NanoMechanicsLab Berlin-Adlershof
Vogel, D.; Gollhardt, A.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | Preface. Editorial
Michel, B.; Schubert, A. | Zeitschriftenaufsatz |
| 2001 | Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B. | Konferenzbeitrag |
| 2001 | Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R. | Konferenzbeitrag |
| 2001 | Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2001 | Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders
Schubert, A.; Walter, H.; Dudek, R.; Michel, B.; Lefranc, G.; Otto, J.; Mitic, G. | Konferenzbeitrag |
| 2001 | Verbundwerkstoffe und Werkstoffverbunde in der Mikrosystemtechnik
Michel, B. | Konferenzbeitrag |
| 2001 | Vibration measurements of micro assemblies by means of laser techniques
Rümmler, N.; Schnitzer, R.; Michel, B. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2000 | Analyses of flip-chip attach reliability
Dudek, R.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2000 | Aufbau-, Verbindungs- und Verkapselungstechnik in der Mechatronik. Neuartige Systemlösungen
Ansorge, F.; Becker, K.-F.; Großer, V.; Michel, B.; Braun, T. | Zeitschriftenaufsatz |
| 2000 | Automated optical measurements under vacuum
Hillmann, V.; Großer, V.; Gentzsch, S.; Bloch, H.; Michel, B. | Konferenzbeitrag |
| 2000 | Characterisation of micromaterials and microcomponents by combination of microbending test and UNIDAC
Seiler, B.; Kieselstein, E.; Dost, M.; Wielage, B.; Michel, B. | Konferenzbeitrag |
| 2000 | Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC
Michel, B.; Seiler, B.; Dost, M.; Wielage, B.; Kieselstein, E.; Winkler, T.; Dudek, R.; Auersperg, J.; Schubert, A.; Schneider, W. | Konferenzbeitrag |
| 2000 | Database for materials in micro systems
Villain, J.; Müller, T.; Michel, B.; Totzauer, W. | Konferenzbeitrag |
| 2000 | Deformation behavior of micro mirror arrays under optical power
Kurth, S.; Kehr, K.; Kaufmann, C.; Faust, W.; Dötzel, W.; Michel, B. | Konferenzbeitrag |
| 2000 | Determination of Materials Properties on Micro Components
Vogel, D.; Sommer, J.-P.; Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 2000 | Evaluation and testing of microsystems using optical methods
Großer, V.; Bombach, C.; Gentzsch, S.; Hillmann, V.; Sommer, J.-P.; Michel, B. | Konferenzbeitrag |
| 2000 | Evaluation of GlobTop materials for COB applications
Walter, H.; Schubert, A.; Schneider, W.; Kieselstein, E.; Auerswald, E.; Michel, B. | Konferenzbeitrag |
| 2000 | Experimental and numerical analyses of flip-chip attach reliability
Schubert, A.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2000 | Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B. | Konferenzbeitrag |
| 2000 | Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
Schubert, A.; Dudek, R.; Kloeser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K. | Konferenzbeitrag |
| 2000 | Finite-element investigation on testing devices for solder joint reliability evaluation
Kaulfersch, E.; Vogel, J.; Sommer, J.-P.; Michel, B. | Konferenzbeitrag |
| 2000 | Fracture electronics and thermomechanical compatibility (TMC) of microcomponents in high tech systems
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 2000 | Fracture mechanics characterization of epoxy resins with Mini-Compact-Tension(CT)-Specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Fedtke, M.; Michel, B. | Konferenzbeitrag |
| 2000 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 1999
: Michel, B. | Jahresbericht |
| 2000 | From Modular MEMS to a Modular Microfactory - the Hybrid Microfactory?
Großer, V.; Michel, B.; Schünemann, M.; Reichl, H. | Konferenzbeitrag |
| 2000 | In situ measurement of deformations on microelectronic components by microscopic methods
Faust, W.; Bombach, C.; Michel, M.; Michel, B. | Konferenzbeitrag |
| 2000 | Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Konferenzbeitrag |
| 2000 | Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Konferenzbeitrag |
| 2000 | Interface fracture investigations on micro components
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2000 | Investigation of interface cracking in electronic packages
Kieselstein, E.; Seiler, B.; Winkler, T.; Auersperg, J.; Dudek, R.; Schubert, A.; Schneider, W.; Michel, B. | Konferenzbeitrag |
| 2000 | Material Characterization and FE Analysis of Electroplated Microrelays
Vogel, J.; Sommer, J.-P.; Faust, W.; Kieselstein, E.; Michel, B. | Konferenzbeitrag |
| 2000 | Materials science and engineering - a major topic in the future of microelectronic packaging
Reichl, H.; Michel, B.; Schubert, A. | Konferenzbeitrag |
| 2000 | Measurement of material properties by a modified microDAC approach
Vogel, D.; Luczak, F.; Wittler, O.; Gollhardt, A.; Walter, H.; Michel, B. | Konferenzbeitrag |
| 2000 | Measurement of Thermal Expansion in Micromaterials - cTest Microscopy
Kühnert, R.; Tränkner, K.; Herrmann, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2000 | Measurement of thermally induced strains on flip chip and chip scale packages
Vogel, D.; Kaulfersch, E.; Simon, J.; Kuehnert, R.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2000 | Mechanical design support by means of FEA for advanced millimeter wave communication devices
Sommer, J.-P.; Michel, B.; Döring, R.; Hager, W.; Rehme, F. | Konferenzbeitrag |
| 2000 | MicroDAC strain measurement for FEA support
Vogel, D.; Gollhardt, A.; Schubert, A.; Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 2000 | Mixed mode interfacial fracture toughness investigations for thermo-mechanical reliability enhancement of plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2000 | Mode shape analysis of microstructures by means of laser-optical methods
Rümmler, N.; Schnitzer, R.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 2000 | Modular loading and measuring system for material characterization of microcomponents
Vogel, J.; Dost, M.; Seebacher, S.; Osten, W.; Fassler, R.; Köpp, N.; Döring, R.; Sommer, J.-P.; Michel, B. | Konferenzbeitrag |
| 2000 | New investigations in materials research by confocal laser scanning microscopy
Kunath-Fandrei, G.; Faust, W.; Ullmann, P.; Michel, B. | Konferenzbeitrag |
| 2000 | Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R. | Konferenzbeitrag |
| 2000 | Package reliability studies by experimental and numerical analysis
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 2000 | Parameterization in finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B. | Aufsatz in Buch |
| 2000 | Rapid prototyping of microcomponents and demonstrators in micro system technology
Fleischer, L.; Faust, W.; Dost, M.; Michel, B.; Vogel, J.; Zeidler, H. | Konferenzbeitrag |
| 2000 | Reliability investigations of FCOB assemblies with process-induced defects
Schubert, K.; Dudek, R.; Klöser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K. | Konferenzbeitrag |
| 2000 | Reliability investigations of vibration excited circuit boards
Rümmler, N.; Schnitzer, R.; Döring, R.; Kaulfersch, E.; Faust, W.; Michel, B. | Konferenzbeitrag |
| 2000 | Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism
Dudek, R.; Berek, H.; Fritsch, T.; Michel, B. | Zeitschriftenaufsatz |
| 2000 | Results of Experimental Vibration Measurements as Input of Numerical Reliability Valuations
Schnitzer, R.; Rümmler, N.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 2000 | Simulation for fatigue, crack and delamination
Dudek, R.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2000 | Simulation for fatigue, cracks and delamination
Dudek, R.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2000 | Strain measurement in solder interconnects of advanced electronic packages
Gollhardt, A.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2000 | Thermally optimised millimeter wave package on an LTCC ceramic board
Sommer, J.-P.; Michel, B.; Goebel, U.; Jelonnek, J. | Zeitschriftenaufsatz, Konferenzbeitrag |
| 2000 | Thermo-mechanical reliability enhancement of microelectronics
Auersperg, J.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2000 | Thermo-mechanical reliability of microcomponents
Dudek, R.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 2000 | Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications
Wittler, O.; Walter, H.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B. | Konferenzbeitrag |
| 2000 | UNIDAC: Cross correlation based deformation analysis at digitised micrographs to study material behaviour and parameters in MST
Dost, M.; Kieselstein, E.; Erb, R.; Seiler, B.; Vogel, J.; Bombach, C.; Großer, V.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 2000 | Usage of Fracture Mechanical Integral Concept T* in Microelectronic Packaging Technique
Badri Ghavifekr, H.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 2000 | X-ray diffraction at elevated temperatures in microsystem technology
Auerswald, E.; Anhöck, S.; Kieselstein, E.; Vogel, J.; Michel, B. | Konferenzbeitrag |
| 1999 | Analysis of field coupling effects in fracture by combining infrared thermography and FE-calculation
Vogel, J.; Dost, M.; Auersperg, J.; Faust, W.; Michel, B. | Zeitschriftenaufsatz |
| 1999 | Charakterisierung galvanisch abgeschiedener Sensorstrukturen
Auerswald, E.; Sommer, J.-P.; Michel, B.; Kieselstein, E.; Brämer, B. | Konferenzbeitrag |
| 1999 | Consideration of parameter scattering in thermo-mechanical characterization of advanced packages
Winkler, T.; Schubert, A.; Kaulfersch, E.; Michel, B. | Zeitschriftenaufsatz |
| 1999 | Damage and fracture evaluation in microelectronics assemblies by FEA and experimental investigations
Auersperg, J.; Winkler, T.; Michel, B. | Aufsatz in Buch |
| 1999 | A design and production framework for modular microsystems
Großer, V.; Schünemann, M.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1999 | Determination of material properties by the optical measuring procedure UNIDAC
Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B. | Zeitschriftenaufsatz |
| 1999 | An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H. | Aufsatz in Buch |
| 1999 | Facilities and results of micro deformation measurements
Faust, W.; Bombach, C.; Michel, B. | Aufsatz in Buch |
| 1999 | Flip chip solder joint reliability
Schubert, A.; Dudek, R.; Vogel, D.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1999 | Fracture and damage evaluation in microelectronic assemblies by FEA
Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 1999 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 1998
: Michel, B. | Jahresbericht |
| 1999 | Investigation of thermomechanical field coupling effects near crack tips by combining thermal emission analysis and FE-simulation
Vogel, J.; Auersperg, J.; Dost, M.; Faust, W.; Michel, B. | Aufsatz in Buch |
| 1999 | Investigations on popcorn cracking of T-QFP packages
Dudek, R.; Sommer, J.-P.; Michel, B.; Alpern, P.; Birzer, C.; Tilgner, R. | Aufsatz in Buch |
| 1999 | Lasermetrological measurement of transient strain fields in Hopkinson-bar experiments
Vogel, D.; Michel, B.; Totzauer, W.; Schreppel, U.; Clos, R. | Aufsatz in Buch |
| 1999 | Materials mechanics and thermo-mechanical reliability of flip chip area array packages
Schubert, A.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1999 | Mechanische Zuverlässigkeit von Werkstoffverbunden in der Mikrosystemtechnik
Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1999 | MicroDAC deformation analysis on solder interconnects for flip chip
Vogel, D.; Luczak, F.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1999 | Microscopic deformation field measurement supporting FEA based reliability analysis in electronic packaging
Vogel, D.; Gollhardt, A.; Kühnert, R.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 1999 | Optical measurement methods for MEMS applications
Großer, V.; Bombach, C.; Faust, W.; Vogel, D.; Michel, B. | Aufsatz in Buch |
| 1999 | Packaging and thermomechanical challenges for high temperature electronics
Michel, B.; Vogel, D. | Konferenzbeitrag |
| 1999 | Reliability aspects of microassembly in microfactories
Großer, V.; Michel, B.; Reichl, H. | Aufsatz in Buch |
| 1999 | Stochastic FEM for parameter scattering in numerical simulation of advanced packages
Winkler, T.; Skurt, L.; Kaulfersch, E.; Michel, B. | Aufsatz in Buch |
| 1999 | Strain measurement in micrometrology
Vogel, D.; Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 1999 | Thermo-mechanical FE analysis and micro deformation measurement
Sommer, J.-P.; Kaulfersch, E.; Hussack, J.; Schubert, A.; Michel, B. | Aufsatz in Buch |
| 1999 | Vibration measurement of microstructures by means of laseroptical modalanalysis
Schnitzer, R.; Rümmler, N.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 1998 | Consideration of parameter scattering in thermo-mechanical characterization of advanced packages
Winkler, T.; Schubert, A.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1998 | Crack avoidance and crack evaluation in microsystems
Michel, B. | Konferenzbeitrag |
| 1998 | Damage and fracture evaluation in microelectronic assemblies by FEA and experimental investigations
Auersperg, J.; Winkler, T.; Vogel, D.; Michel, B. | Konferenzbeitrag |
| 1998 | The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1998 | The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1998 | Der Einsatz von Mikro- und Nanowerkstoffen. Grundlage für die Miniaturisierung von Komponenten und Systemen
Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1998 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 1997
: Michel, B. | Jahresbericht |
| 1998 | Improvement of the thermo-mechanical performance of advanced packages by experimentally assisted FE-analysis
Michel, B.; Dudek, R.; Schubert, A. | Konferenzbeitrag |
| 1998 | Investigation of a rigid carrier CSP with the microDAC method
Simon, J.; Vogel, D.; Faust, W.; Gollhardt, A.; Michel, B. | Konferenzbeitrag |
| 1998 | Laseroptische Modalanalyse an Mikrobauteilen
Rümmler, N.; Schnitzer, R.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 1998 | Microdeformation analysis of packages and interconnects by the MicroDAC method
Vogel, D.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1998 | Nonlinear FEA for thermo-mechanical reliability. Estimation of advanced electronic packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1998 | Reliability and testability of stacked 3D modules
Großer, V.; Sommer, J.-P.; Leutenbauer, R.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1998 | Reliability aspects of microassembly in microfactories
Michel, B.; Großer, V.; Reichl, H. | Konferenzbeitrag |
| 1998 | Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B. | Konferenzbeitrag |
| 1998 | Thermo-mechanical analysis of microelectronics components and chipcards
Michel, B.; Vogel, D. | Konferenzbeitrag |
| 1998 | Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1998 | Thermomechanical behavior of metal contacts and interconnects for information technology
Kaulfersch, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1998 | Thermomechanische Untersuchungen zur Zuverlässigkeitserhöhung von Mikrosystemen
Michel, B.; Faust, W.; Auersperg, J. | Konferenzbeitrag |
| 1998 | Werkstoffeinsatz und Zuverlässigkeit von Mikrosystemen
Michel, B. | Konferenzbeitrag |
| 1997 | Advanced deformation and failure analysis on flip chip assemblies
Vogel, D.; Caers, J.; Auersperg, J.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | Characterization of composite materials by means of correlation analysis of grey scale patterns
Kieselstein, E.; Penno, M.; Wielage, B.; Dost, M.; Michel, B. | Konferenzbeitrag |
| 1997 | Characterization of packages for laser diodes
Auerswald, E.; Döring, R.; Nechansky, H.; Kämpfe, B.; Michel, B. | Konferenzbeitrag |
| 1997 | Charakterisierung von Werkstoffverbunden für neue Einsatzmöglichkeiten im Bereich der Mikrosystemtechnik
Michel, B.; Schubert, A.; Winkler, T.; Reichl, H. | Konferenzbeitrag |
| 1997 | Comparison of different CSP approaches by means of numerical simulations
Auersperg, J.; Simon, J.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | Confocal laser scanning microscopy for testing of microsystems
Faust, W.; Michel, B. | Konferenzbeitrag |
| 1997 | CTE matched and mismatched heat-spreader materials for high power laser diode attachment. Thermal and mechanical optimization
Kaulfersch, E.; Töpfer, M.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Deformation analysis on flip chip solder interconnects by MicroDAC
Vogel, D.; Auersperg, J.; Schubert, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder
Weiß, S.; Kaulfersch, E.; Töpfer, M.; Zakel, E.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Fatigue life studies on Flip Chip, PBGA and PQFP solder joints
Dudek, R.; Nylen, M.; Gustavsson, U.; Michel, B. | Konferenzbeitrag |
| 1997 | FE-Simulation for polymeric packaging materials
Dudek, R.; Scherzer, M.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC
Auersperg, J.; Schubert, A.; Vogel, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Fracture electronics. Concepts of fracture mechanics for reliability
Michel, B. | Konferenzbeitrag |
| 1997 | Investigation of crack temperature fields by means of infrared thermography and FE calculations
Vogel, J.; Auersperg, J.; Dost, M.; Michel, B. | Konferenzbeitrag |
| 1997 | Laseroptical deformation measurements on SAA-materials
Faust, W.; Bombach, C.; Oehmigen, M.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.; Jiang, H. | Konferenzbeitrag |
| 1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Zeitschriftenaufsatz |
| 1997 | Mechanical characterization of polymers in microelectronics
Walter, H.; Faust, W.; Schubert, A.; Grellmann, W.; Michel, B. | Konferenzbeitrag |
| 1997 | Mechanical reliability study of FCOB and CSP assemblies by FEA and MicroDAC
Schubert, A.; Dudek, R.; Vogel, D.; Auersperg, J.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | MicroDAC deformation measurement in packaging components
Vogel, D.; Langheinrich, M.; Auersperg, J.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | MicroDAC deformation measurement on microelectronic products
Vogel, D.; Bombach, C.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 1997 | The microDAC method. A powerful means for microdeformation analysis in electronic packaging
Michel, B.; Vogel, D.; Schubert, A.; Auersperg, J.; Reichl, H. | Konferenzbeitrag |
| 1997 | Miniaturisierung und Werkstoffverbunde. Probleme und Lösungsmöglichkeiten im Bereich Chip-Leiterplatte
Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Optical analysis of 3D-microstructures produced by additive technologies
Bombach, C.; Großer, V.; Gentzsch, S.; Engelmann, G.; Michel, B. | Konferenzbeitrag |
| 1997 | Predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Problem-adapted 3D finite element modelling for VLSI components
Döring, R.; Sommer, J.-P.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1997 | Reliability evaluation of chip scale packages by FEA and MicroDAC
Auersperg, J.; Vogel, D.; Simon, J.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | Reliability evaluation of components using fracture machanics in spite of uncertain data
Winkler, T.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1997 | Residual stress analysis in microcomponents
Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | SEM shape and deformation analysis by micro DAC
Kühnert, R.; Tränkner, K.; Franke, H.; Michel, B. | Konferenzbeitrag |
| 1997 | A simple method to reduce thermomechanical stress in GaAs Assemblies including diamond heat spreaders and AuSn solders
Töpfer, M.; Kaulfersch, E.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Testing devices for well defined mechanical and thermal loading of microcomponents
Dost, M.; Dietrich, D.; Vogel, J.; Sommer, J.-P.; Großer, V.; Michel, B. | Konferenzbeitrag |
| 1997 | Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Thermo-mechanical reliability issues of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1997 | Thermomechanical aspects of modular vertical integration technique (TB2GA)
Leutenbauer, R.; Großer, V.; Reichl, H.; Michel, B. | Konferenzbeitrag |
| 1997 | Thermomechanical behaviour of chipcard materials
Michel, B.; Schubert, A.; Winkler, T. | Konferenzbeitrag |
| 1997 | Thermomechanical simulation of advanced packages in spite of uncertain characteristics
Winkler, T.; Kaulfersch, E.; Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1997 | Verfahren zur Bestimmung von Abstaenden zwischen einkristallinen Prueflingen und flaechenhaften Detektionseinrichtungen fuer Roentgenstrahlung
Kaempfe, B.; Goldenbogen, S.; Michel, B.; Krause, F.; Diezko, R.H. | Patent |
| 1997 | Verfahren zur Ermittlung von Materialkennwerten in mikroskopisch dimensionierten Prueflingsbereichen
Dost, M.; Kaempfe, B.; Kuehnert, R.; Michel, B.; Traenkner, K. | Patent |
| 1997 | Verfahren zur feldmaessigen Bestimmung von Deformationszustaenden in mikroskopisch dimensionierten Prueflingsbereichen
Kuehnert, R.; Schubert, A.; Dost, M.; Vogel, D.; Kaempfe, B.; Michel, B. | Patent |
| 1996 | Die Finite-Elemente Methode als Analysewerkzeug in der Mikrotechnik
Sommer, J.-P.; Dudek, R.; Michel, B. | Aufsatz in Buch |
| 1996 | Mechanisch-thermische Zuverlässigkeit von Chipkarten
Schubert, A.; Dudek, R.; Faust, W.; Vogel, D.; Michel, B.; Reichl, H. | Aufsatz in Buch |
| 1996 | MicroDAC - ein neues Verfahren zur quantitativen Mikroverformungsanalyse
Vogel, D.; Schubert, A.; Michel, B. | Aufsatz in Buch |
| 1996 | Stress analysis using an area detector
Schubert, A.; Michel, B.; Kämpfe, B. | Konferenzbeitrag |
| 1995 | Anwendungen der Laser Scanning Mikroskopie in der Mikrosystemtechnik
Faust, W.; Dudek, R.; Michel, B.; Dost, M. | Konferenzbeitrag |
| 1995 | Anwendungen der Laser Scanning Mikroskopie in der Mikrosystemtechnik
Faust, W.; Dudek, R.; Michel, B.; Dost, M. | Konferenzbeitrag |
| 1995 | Bewertung der mechanischen Zuverlässigkeit mikrotechnischer Aufbauten mittels in-situ-Verformungsexperimenten im REM
Kühnert, R.; Tränkner, K.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 1995 | Bruchmechanische Untersuchungen zur Zuverlässigkeitsbewertung mikrotechnischer Aufbauten
Michel, B.; Sommer, J.-P.; Krause, F.; Winkler, T.; Faust, W. | Konferenzbeitrag |
| 1995 | Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik
Michel, B. | Konferenzbeitrag |
| 1995 | FEM-Anwendungen auf mechanisch-thermische Probleme in der Mikrotechnik
Auersperg, J.; Kaulfersch, E.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1995 | Laseroptische Analysen von Miniaturbauelementen
Bombach, C.; Großer, V.; Faust, W.; Michel, B. | Konferenzbeitrag |
| 1995 | Laseroptische Verformungsmessungen an Mikroaufbauten
Großer, V.; Lindemann, G.; Faust, W.; Bombach, C.; Michel, B. | Konferenzbeitrag |
| 1995 | Measurement of thermal microdeformations in bumps
Kühnert, R.; Michel, B. | Konferenzbeitrag |
| 1995 | Mechanisch-thermische Simulation und Lebensdauerbewertung von mikrotechnischen Komponenten
Sommer, J.-P.; Dudek, R.; Faust, W.; Michel, B. | Aufsatz in Buch |
| 1995 | Mechanisch-thermische Versagensdetektion an Leiterplatten mittel numerischer und laseroptischer Verfahren
Großer, V.; Sommer, J.-P.; Faust, W.; Bombach, C.; Michel, B. | Konferenzbeitrag |
| 1995 | Micro Materials, Micro Mat 1995. Abstracts
: Michel, B.; Winkler, T. | Tagungsband |
| 1995 | Das MicroDAC-Verfahren - eine Methode zur quantitativen Verformungsbewertung von Mikrokomponenten im Rasterelektronenmikroskop
Michel, B.; Kühnert, R. | Konferenzbeitrag |
| 1995 | Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
Sommer, J.-P.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1995 | Probalistische Methoden zur Charakterisierung mikrotechnischer Aufbauten
Winkler, T.; Michel, B.; Kaulfersch, E. | Konferenzbeitrag |
| 1995 | Thermal and mechanical characterization of electronic packages in extremely high frequency applications by means of finite element analysis
Sommer, J.-P.; Dudek, R.; Michel, B.; Boheim, M.; Hager, W. | Konferenzbeitrag |
| 1995 | Thermische Verformungsuntersuchungen an Polymer-Abdeckmassen für Si-Chips - Simulation Tauchlötvorgang
Grosser, V.; Vogel, D.; Bombach, C.; Dudek, R.; Michel, B. | Aufsatz in Buch |
| 1995 | Thermomechanische Analysen mikrotechnischer Komponenten
Faust, W.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1995 | Werkstoffmechanische Untersuchungen an Chipkarten
Vogel, D.; Schubert, A.; Faust, W.; Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1994 | Application of fracture machanics to micromechanics and microsystem technology
Michel, B.; Sommer, J.-P.; Großer, V. | Konferenzbeitrag |
| 1994 | Application of solid mechanics in the fields of microelectronics and micro system technology
Michel, B.; Sommer, J.-P. | Konferenzbeitrag |
| 1994 | Damage structures due to thermal fatigue - development of a stochastic simulation model
Winkler, T.; Kullig, E.; Oppermann, H.; Foit, A.; Michel, B. | Konferenzbeitrag |
| 1994 | Evaluation of microdeformations and fracture quantities by means of micro moire methods
Michel, B.; Kühnert, R. | Konferenzbeitrag |
| 1994 | Experimental and numerical deformation analysis on components of microsystem technology
Michel, B.; Kühnert, R.; Auersperg, J.; Tränkner, K. | Konferenzbeitrag |
| 1994 | Experimental and numerical investigations of thermo-mechanically stressed micro-components
Michel, B.; Schubert, A.; Dudek, R.; Grosser, V. | Zeitschriftenaufsatz |
| 1994 | Experimentelle und numerische Deformationsanalyse an Komponenten der Mikrosystemtechnik
Michel, B.; Kühnert, R.; Auersperg, J.; Tränkner, K. | Konferenzbeitrag |
| 1994 | Fatigue crack evaluation in electronics
Michel, B.; Dost, M. | Konferenzbeitrag |
| 1994 | Mechanische und thermische Zuverlässigkeit von Komponenten und Bauteilen der Mikrosystemtechnik
Michel, B.; Reichl, H. | Konferenzbeitrag |
| 1994 | Mikrobaugruppen mechanisch prüfen
Michel, B.; Großer, V. | Zeitschriftenaufsatz |
| 1994 | Mikroskopische Deformationsmessungen mittels Laserinterferometrie
Großer, V.; Bombach, C.; Auersperg, J.; Michel, B. | Konferenzbeitrag |
| 1994 | Motion of oxygen in vanadium and niobium studied by nuclear magnetic resonance
Michel, B.; Kanert, O.; Günther, B. | Zeitschriftenaufsatz |
| 1994 | Optical deformation analysis of surface mounted devices
Vogel, D.; Kaulfersch, E.; Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1994 | Quantitative Deformations- und Rißspitzenanalyse mittels Mikro-Moire-Technik im REM
Michel, B.; Kühnert, R. | Konferenzbeitrag |
| 1994 | Residual stress analysis in components of microsystems
Schubert, A.; Michel, B. | Konferenzbeitrag |
| 1994 | Speckle photographic strain field measurement. A helpful aid in fracture modelling and analysis of microstructures
Vogel, D.; Sommer, J.-P.; Michel, B. | Konferenzbeitrag |
| 1994 | Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
Dudek, R.; Michel, B. | Konferenzbeitrag |
| 1994 | Werkstoffmechanische Untersuchungen von Komponenten der Mikrosystemtechnik
Michel, B.; Winkler, T.; Reichl, H. | Konferenzbeitrag |
| 1994 | X-ray residual stress analysis in components of microsystem technology
Schubert, A.; Kämpfe, B.; Michel, B. | Konferenzbeitrag |
| 1993 | Beanspruchung von Lötverbindungen oberflächenmontierter ICs in Abhängigkeit von der Pin-Form
Dudek, R.; Faust, W.; Michel, B.; Hartmann, H.J. | Konferenzbeitrag |
| 1993 | Lasermeßtechnik für Mikroaktuatoren
Großer, V.; Michel, B.; Bombach, C. | Aufsatz in Buch |
| 1993 | Physical and micromechanical aspects of stochastic fatigue crack growth
Michel, B.; Winkler, T.; Skurt, L. | Aufsatz in Buch |
| 1993 | Prüfen des Verformungsverhaltens mikromechanischer Bauelemente mittels Lasermeßtechniken
Michel, B.; Großer, V. | Konferenzbeitrag |
| 1993 | Qualitätskontrolle an mikromechanischen Bauteilen
Faust, W.; Michel, B.; Winkler, T. | Zeitschriftenaufsatz |
| 1993 | SPY - a modular specklephotographic measurement system for micro-mechanics purposes
Vogel, D.; Kaulfersch, E.; Michel, B. | Konferenzbeitrag |
| 1993 | Untersuchungen zum lokalen Deformationsverhalten in der Rißspitzenumgebung mit laseroptischen und elektronenmikroskopischen Feldmeßverfahren
Michel, B.; Vogel, D.; Kühnert, R. | Konferenzbeitrag |
| 1993 | X-ray analysis of residual stress gradients and textures in thin coatings
Schubert, A.; Kämpfe, B.; Auerswald, E.; Michel, B. | Konferenzbeitrag |
| 1993 | Zur Anwendbarkeit festkörpermechanischer Modelle im Bereich der Mikroelektronik
Michel, B.; Winkler, T. | Konferenzbeitrag |
| 1993 | Zuverlässigkeitsbewertung hochbeanspruchter elektronischer Baugruppen. Teil 1
Michel, B.; Großer, V.; Dudek, R.; Kühnert, R.; Schubert, A. | Zeitschriftenaufsatz |
| 1993 | Zuverlässigkeitsbewertung hochbeanspruchter elektronischer Baugruppen. Teil 2
Michel, B.; Großer, V.; Dudek, R.; Kühnert, R.; Schubert, A. | Zeitschriftenaufsatz |
| 1991 | Investigation of self-diffusion in nanocrystalline copper by NMR.
Dickenscheid, W.; Birringer, R.; Gleiter, H.; Kanert, O.; Michel, B.; Günther, B. | Zeitschriftenaufsatz |
| 1988 | Atomic motion of copper in solid Au-xCu alloys studied by nuclear magentic resonance.
Hackmann, A.; Kanert, O.; Kolem, H.; Michel, B.; Günther, B. | Zeitschriftenaufsatz |
| 1987 | Diffusion-investigations in solid Au-Cu alloys.
Kanert, O.; Kolem, H.; Hackmann, A.; Michel, B.; Guenther, B. | Abstract |