Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Konferenzbeitrag
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Konferenzbeitrag
201620% efficient n-type Cz-Si MWT solar cells with adjustable reverse behavior
Lohmüller, E.; Werner, S.; Maus, S.; Brand, A.; Jäger, U.; Clement, F.
Zeitschriftenaufsatz
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Konferenzbeitrag
2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.
Konferenzbeitrag
2016Simplified fabrication of n-type Cz-Si HIP-MWT+ solar cells with 20% efficiency using laser structuring
Lohmüller, E.; Werner, S.; Maus, S.; Brand, A.; Jäger, U.; Nekarda, J.; Clement, F.
Zeitschriftenaufsatz, Konferenzbeitrag
2014Klassifizierung von Liegepositionen mittels kapazitiver Näherungssensorik
Maus, Steffen
: Kuijper, Arjan (1. Gutachter); Rus, Silvia (2.Gutachterin)
Bachelor Thesis
2013Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging
Hansen, U.; Maus, S.; Töpper, M.
Konferenzbeitrag
2011Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.
Konferenzbeitrag
2011Wafer-level glass-caps for advanced optical applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Zoschke, K.; Toepper, M.
Konferenzbeitrag
2010Anodic bonding at low voltage using microstructured borosilicate glass thin-films
Leib, J.; Hansen, U.; Maus, S.; Feindt, H.; Hauck, K.; Zoschke, K.; Toepper, M.
Konferenzbeitrag
2010Hermetic BSG thin film coatings for harsh environment applications
Maus, S.; Hansen, U.; Leib, J.; Toepper, M.
Konferenzbeitrag
2010Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices
Hansen, U.; Maus, S.; Leib, J.; Toepper, M.
Konferenzbeitrag
2010Wafer-level glass capping with optical integration
Hansen, U.; Maus, S.; Leib, J.; Toepper, M.
Konferenzbeitrag
2009A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level
Maus, S.; Hansen, U.; Leib, J.; Töpper, M.
Konferenzbeitrag, Zeitschriftenaufsatz
2009Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation
Hansen, U.; Maus, S.; Leib, J.; Töpper, M.
Konferenzbeitrag, Zeitschriftenaufsatz
2009Thin hermetic borosilicate glass layers for highly reliable chip-passivations in wafer-level-packaging
Hansen, U.; Leib, J.; Maus, S.; Gyenge, O.; Töpper, M.
Konferenzbeitrag
2009Thin hermetic passivation of semiconductors using low temperature borosilicate glass - Benchmark of a new wafer-level packaging technology
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Fischer, T.; Zoschke, K.; Toepper, M.
Konferenzbeitrag
2007Wafer-level glass capping as drop-in for miniaturized, advanced optical COB packaging
Seidemann, V.; Gyenge, O.; Hansen, U.; Heuser, T.; Maus, S.; Mund, D.; Espertshuber, K.; Wilke, R.; Leib, J.
Konferenzbeitrag